Claims
- 1. A surface-mounted package for an electronic device with at least one long lead wire, comprising:an electronic device with at least one long lead wire; an insulated substrate; at least one bottom contact for surface-mounting said substrate on and making connection to a motherboard; at least one via hole through said substrate for said lead wire to be inserted to a depth no deeper than the thickness of the substrate; soldering material plating along the wall of said via hole for soldering to said lead wire; and an extension from said soldering material for connection to said bottom contact.
- 2. A surface mount package as described in claim 1, wherein said lead wire is folded back inside said via hole.
Parent Case Info
This application is a continuation of Ser. No. 09/399039, filed Sep. 21, 1999.
US Referenced Citations (12)
Continuations (1)
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Number |
Date |
Country |
Parent |
09/399039 |
Sep 1999 |
US |
Child |
09/949558 |
|
US |