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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/22liquid at the normal operating temperature of the device

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package device
- Patent number 11,735,491
- Issue date Aug 22, 2023
- Samsung Electronics Co., Ltd.
- Hyunggyun Noh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low force liquid metal interconnect solutions
- Patent number 11,622,466
- Issue date Apr 4, 2023
- Intel Corporation
- Karumbu Meyyappan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Crack identification in IC chip package using encapsulated liquid p...
- Patent number 11,543,322
- Issue date Jan 3, 2023
- GLOBALFOUNDRIES U.S. INC.
- George K. Parker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronics assemblies with CIO bonding layers and double sid...
- Patent number 11,527,458
- Issue date Dec 13, 2022
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Ercan Mehmet Dede
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaged electronic devices with top terminations
- Patent number 11,343,919
- Issue date May 24, 2022
- NXP USA, INC.
- Fernando A. Santos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management solutions for embedded integrated circuit devices
- Patent number 11,342,243
- Issue date May 24, 2022
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging cover plate, organic light-emitting diode display and man...
- Patent number 11,245,099
- Issue date Feb 8, 2022
- BOE Technology Group Co., Ltd.
- Linlin Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling devices including a variable angle contact surface and meth...
- Patent number 11,098,960
- Issue date Aug 24, 2021
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Electronic power module comprising a dielectric support
- Patent number 11,049,795
- Issue date Jun 29, 2021
- SUPERGRID INSTITUTE
- Cyril Buttay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device and method of manufacturing the same, an...
- Patent number 11,037,844
- Issue date Jun 15, 2021
- Mitsubishi Electric Corporation
- Satoshi Kondo
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Encapsulated stress mitigation layer and power electronic assemblie...
- Patent number 10,879,209
- Issue date Dec 29, 2020
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures
- Patent number 10,879,210
- Issue date Dec 29, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stretchable electronic systems with containment chambers
- Patent number 10,840,536
- Issue date Nov 17, 2020
- The Board of Trustees of the University of Illinois
- John A. Rogers
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method for manufacturing printed circuit...
- Patent number 10,827,619
- Issue date Nov 3, 2020
- Mitsubishi Electric Corporation
- Nicolas Degrenne
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Encapsulated stress mitigation layer and power electronic assemblie...
- Patent number 10,700,036
- Issue date Jun 30, 2020
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures
- Patent number 10,522,499
- Issue date Dec 31, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stretchable electronic systems with fluid containment
- Patent number 10,497,633
- Issue date Dec 3, 2019
- The Board of Trustees of the University of Illinois
- John A. Rogers
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power electronics assemblies with cio bonding layers and double sid...
- Patent number 10,453,777
- Issue date Oct 22, 2019
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Ercan Mehmet Dede
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods of manufacturing packaged electronic devices with top termi...
- Patent number 10,375,833
- Issue date Aug 6, 2019
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged electronic devices with top terminations, and methods of m...
- Patent number 9,986,646
- Issue date May 29, 2018
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electric power converter with a spring member
- Patent number 9,502,331
- Issue date Nov 22, 2016
- Denso Corporation
- Tomohisa Sano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module for high pressure applications
- Patent number 9,484,275
- Issue date Nov 1, 2016
- GE Energy Power Conversion Technology Ltd.
- Fei Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage semiconductor devices including electric arc suppressi...
- Patent number 9,343,383
- Issue date May 17, 2016
- Cree, Inc.
- Van Mieczkowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 9,099,484
- Issue date Aug 4, 2015
- Renesas Electronics Corporation
- Hiroshi Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wireless chip and manufacturing method of the same
- Patent number 8,698,262
- Issue date Apr 15, 2014
- Semiconductor Energy Laboratory Co., Ltd.
- Takuya Tsurume
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a stacked device conductive path connectivity
- Patent number 8,578,591
- Issue date Nov 12, 2013
- Micron Technology, Inc.
- Ebrahim H Hargan
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor chip device with liquid thermal interface material
- Patent number 8,574,965
- Issue date Nov 5, 2013
- ATI Technologies ULC
- Gamal Refai-Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked device conductive path connectivity
- Patent number 8,063,491
- Issue date Nov 22, 2011
- Micron Technology, Inc.
- Ebrahim H Hargan
- G11 - INFORMATION STORAGE
Information Patent Grant
Packaging for high power integrated circuits
- Patent number 7,642,644
- Issue date Jan 5, 2010
- Mayo Foundation for Medical Education and Research
- Wendy L. Wilkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having filler with thermal conductive particles
- Patent number 7,554,192
- Issue date Jun 30, 2009
- Mitsubishi Electric Corporation
- Masuo Koga
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FLUID-INFUSED ENCAPSULATION OF WATER-SENSITIVE MATERIALS WITH REPLE...
- Publication number 20240203807
- Publication date Jun 20, 2024
- President and Fellows of Harvard College
- Yanhao YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR LIQUID METAL MIXTURES FOR ELECTRICAL INTERCONNECTS
- Publication number 20230317533
- Publication date Oct 5, 2023
- Intel Corporation
- Gregorio Roberto Murtagian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW FORCE LIQUID METAL INTERCONNECT SOLUTIONS
- Publication number 20230209759
- Publication date Jun 29, 2023
- Intel Corporation
- Karumbu MEYYAPPAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DAM SURROUNDING A DIE ON A SUBSTRATE
- Publication number 20230086920
- Publication date Mar 23, 2023
- Intel Corporation
- Liang HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE
- Publication number 20220301969
- Publication date Sep 22, 2022
- Samsung Electronics Co., Ltd.
- Hyunggyun NOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CRACK IDENTIFICATION IN IC CHIP PACKAGE USING ENCAPSULATED LIQUID P...
- Publication number 20210341349
- Publication date Nov 4, 2021
- GLOBALFOUNDRIES U.S. Inc.
- George K. Parker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATED STRESS MITIGATION LAYER AND POWER ELECTRONIC ASSEMBLIE...
- Publication number 20200286849
- Publication date Sep 10, 2020
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATED STRESS MITIGATION LAYER AND POWER ELECTRONIC ASSEMBLIE...
- Publication number 20200126946
- Publication date Apr 23, 2020
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER ELECTRONICS ASSEMBLIES WITH CIO BONDING LAYERS AND DOUBLE SID...
- Publication number 20200006198
- Publication date Jan 2, 2020
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Ercan Mehmet Dede
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Electronic Power Module Comprising a Dielectric Support
- Publication number 20190385930
- Publication date Dec 19, 2019
- SUPERGRID INSTITUTE
- Cyril Buttay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING PRINTED CIRCUIT...
- Publication number 20190320534
- Publication date Oct 17, 2019
- Mitsubishi Electric Corporation
- Nicolas DEGRENNE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED ELECTRONIC DEVICES WITH TOP TERMINATIONS, AND METHODS OF M...
- Publication number 20180270960
- Publication date Sep 20, 2018
- NXP USA, Inc.
- Lakshminarayan VISWANATHAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID UNDERFILL MATERIAL COMPOSITION FOR SEALING SEMICONDUCTOR AND...
- Publication number 20160186024
- Publication date Jun 30, 2016
- Shin-Etsu Chemical Co., Ltd.
- Kazuaki SUMITA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR MODULE, SEMICONDUCTOR MODULE PACKAGE AND SEMICONDUCTO...
- Publication number 20160027710
- Publication date Jan 28, 2016
- GE Energy Power Conversion Technology Ltd.
- Fei XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-SIMILAR AND FRACTAL DESIGN FOR STRETCHABLE ELECTRONICS
- Publication number 20150380355
- Publication date Dec 31, 2015
- THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
- John A. ROGERS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULANT COMPOSITION
- Publication number 20150221527
- Publication date Aug 6, 2015
- Rohm and Haas Electronic Materials L.L.C.
- Paul L. MORGANELLI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20150179480
- Publication date Jun 25, 2015
- RENESAS ELECTRONICS CORPORATION
- Hiroshi Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20140349447
- Publication date Nov 27, 2014
- Renesas Electronics Corporation
- Hiroshi Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH VOLTAGE SEMICONDUCTOR DEVICES INCLUDING ELECTRIC ARC SUPPRESSI...
- Publication number 20130228796
- Publication date Sep 5, 2013
- Cree, Inc.
- Van Mieczkowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP DEVICE WITH LIQUID THERMAL INTERFACE MATERIAL
- Publication number 20120098119
- Publication date Apr 26, 2012
- Gamal Refai-Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DEVICE CONDUCTIVE PATH CONNECTIVITY
- Publication number 20120060364
- Publication date Mar 15, 2012
- Ebrahim H. Hargan
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20110127543
- Publication date Jun 2, 2011
- KABUSHIKI KAISHA YASKAWA DENKI
- Kensuke AKIYOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE DEVICE
- Publication number 20100084162
- Publication date Apr 8, 2010
- Chung-Jyh LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DEVICE CONDUCTIVE PATH CONNECTIVITY
- Publication number 20100078829
- Publication date Apr 1, 2010
- Micron Technology, Inc.
- Ebrahim H. Hargan
- G11 - INFORMATION STORAGE
Information Patent Application
Fluid encapsulant for protecting electronics
- Publication number 20080115772
- Publication date May 22, 2008
- TI Group Automotive Systems, LLC
- Peter P. Kuperus
- B60 - VEHICLES IN GENERAL
Information Patent Application
Packaging For High Power Integrated Circuits Using Supercritical Fluid
- Publication number 20080093732
- Publication date Apr 24, 2008
- Wendy L. Wilkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20080006932
- Publication date Jan 10, 2008
- Mitsubishi Electric Corporation
- Masuo KOGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip on a board
- Publication number 20070139899
- Publication date Jun 21, 2007
- Palo Alto Research Center Incorporated
- Koenraad F. Van Schuylenbergh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wireless chip and manufacturing method of the same
- Publication number 20060055014
- Publication date Mar 16, 2006
- Semiconductor Energy Laboratory Co., Ltd.
- Takuya Tsurume
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package with heat sink
- Publication number 20040262742
- Publication date Dec 30, 2004
- Tessera, Inc.
- Thomas H. DiStefano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

liquid at the normal operating temperature of the device

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package device

Low force liquid metal interconnect solutions

Crack identification in IC chip package using encapsulated liquid p...

Power electronics assemblies with CIO bonding layers and double sid...

Packaged electronic devices with top terminations

Thermal management solutions for embedded integrated circuit devices

Packaging cover plate, organic light-emitting diode display and man...

Cooling devices including a variable angle contact surface and meth...

Electronic power module comprising a dielectric support

Power semiconductor device and method of manufacturing the same, an...

Encapsulated stress mitigation layer and power electronic assemblie...

Bonded structures

Stretchable electronic systems with containment chambers

Printed circuit board and method for manufacturing printed circuit...

Encapsulated stress mitigation layer and power electronic assemblie...

Bonded structures

Stretchable electronic systems with fluid containment

Power electronics assemblies with cio bonding layers and double sid...

Methods of manufacturing packaged electronic devices with top termi...

Packaged electronic devices with top terminations, and methods of m...

Electric power converter with a spring member

Semiconductor module for high pressure applications

High voltage semiconductor devices including electric arc suppressi...

Method of manufacturing semiconductor device

Wireless chip and manufacturing method of the same

Method for manufacturing a stacked device conductive path connectivity

Semiconductor chip device with liquid thermal interface material

Stacked device conductive path connectivity

Packaging for high power integrated circuits

Semiconductor device having filler with thermal conductive particles

Patents Applicationslast 30 patents

FLUID-INFUSED ENCAPSULATION OF WATER-SENSITIVE MATERIALS WITH REPLE...

TECHNOLOGIES FOR LIQUID METAL MIXTURES FOR ELECTRICAL INTERCONNECTS

LOW FORCE LIQUID METAL INTERCONNECT SOLUTIONS

DAM SURROUNDING A DIE ON A SUBSTRATE

SEMICONDUCTOR PACKAGE DEVICE

CRACK IDENTIFICATION IN IC CHIP PACKAGE USING ENCAPSULATED LIQUID P...

ENCAPSULATED STRESS MITIGATION LAYER AND POWER ELECTRONIC ASSEMBLIE...

ENCAPSULATED STRESS MITIGATION LAYER AND POWER ELECTRONIC ASSEMBLIE...

POWER ELECTRONICS ASSEMBLIES WITH CIO BONDING LAYERS AND DOUBLE SID...

Electronic Power Module Comprising a Dielectric Support

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING PRINTED CIRCUIT...

PACKAGED ELECTRONIC DEVICES WITH TOP TERMINATIONS, AND METHODS OF M...

LIQUID UNDERFILL MATERIAL COMPOSITION FOR SEALING SEMICONDUCTOR AND...

SEMICONDUCTOR MODULE, SEMICONDUCTOR MODULE PACKAGE AND SEMICONDUCTO...

SELF-SIMILAR AND FRACTAL DESIGN FOR STRETCHABLE ELECTRONICS

ENCAPSULANT COMPOSITION

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

HIGH VOLTAGE SEMICONDUCTOR DEVICES INCLUDING ELECTRIC ARC SUPPRESSI...

SEMICONDUCTOR CHIP DEVICE WITH LIQUID THERMAL INTERFACE MATERIAL

STACKED DEVICE CONDUCTIVE PATH CONNECTIVITY

SEMICONDUCTOR DEVICE

ELECTRONIC PACKAGE DEVICE

STACKED DEVICE CONDUCTIVE PATH CONNECTIVITY

Fluid encapsulant for protecting electronics

Packaging For High Power Integrated Circuits Using Supercritical Fluid

SEMICONDUCTOR DEVICE

Chip on a board

Wireless chip and manufacturing method of the same

Semiconductor package with heat sink