Loop shape arrangement

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CPC
H01L2224/4909

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/4909Loop shape arrangement

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor arrangement and method for producing the same
- Patent number 11,942,449
- Issue date Mar 26, 2024
- Infineon Technologies AG
- Frank Sauerland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,721,672
- Issue date Aug 8, 2023
- Kioxia Corporation
- Yuichi Sano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module and method of manufacturing the same, and power conver...
- Patent number 11,562,979
- Issue date Jan 24, 2023
- Mitsubishi Electric Corporation
- Chika Matsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 11,342,276
- Issue date May 24, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Ji Young Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring with external terminal
- Patent number 11,296,047
- Issue date Apr 5, 2022
- Micron Technology, Inc.
- Ken Ota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aluminate fluorescent material, light emitting device, and method f...
- Patent number 11,034,888
- Issue date Jun 15, 2021
- Nichia Corporation
- Kazuya Nishimata
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Apparatus for communication across a capacitively coupled channel
- Patent number 10,804,845
- Issue date Oct 13, 2020
- Texas Instruments Incorporated
- Subhashish Mukherjee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Compensation device for transistors
- Patent number 10,763,228
- Issue date Sep 1, 2020
- Infineon Technologies AG
- David Seebacher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interchip backside connection
- Patent number 10,700,017
- Issue date Jun 30, 2020
- International Business Machines Corporation
- Effendi Leobandung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and power conversion device
- Patent number 10,573,570
- Issue date Feb 25, 2020
- Mitsubishi Electric Corporation
- Daisuke Murata
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 10,546,819
- Issue date Jan 28, 2020
- TOSHIBA MEMORY CORPORATION
- Satoru Takaku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IGBT die structure with auxiliary P well terminal
- Patent number 10,535,760
- Issue date Jan 14, 2020
- Littelfuse, Inc.
- Kyoung Wook Seok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring with external terminal
- Patent number 10,468,371
- Issue date Nov 5, 2019
- Micron Technology, Inc.
- Ken Ota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency power component and radio frequency signal transcei...
- Patent number 10,347,596
- Issue date Jul 9, 2019
- Huawei Technologies Co., Ltd.
- An Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adjustable losses on bond wire arrangement
- Patent number 10,312,905
- Issue date Jun 4, 2019
- NXP USA, INC.
- Youri Volokhine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting apparatus
- Patent number 10,305,011
- Issue date May 28, 2019
- Nichia Corporation
- Shimpei Sasaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a power module with a magnetic device having a co...
- Patent number 10,304,615
- Issue date May 28, 2019
- Enpirion, Inc.
- Ashraf W. Lotfi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding methods and systems incorporating metal nanoparticles
- Patent number 10,283,482
- Issue date May 7, 2019
- Lockheed Martin Corporation
- Randall Mark Stoltenberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including package substrate and chip stack in...
- Patent number 10,283,486
- Issue date May 7, 2019
- Samsung Electronics Co., Ltd.
- Jin-Young Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor die with drain via arrangement, and methods of manufactu...
- Patent number 10,103,233
- Issue date Oct 16, 2018
- NXP USA, INC.
- Ibrahim Khalil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting apparatus
- Patent number 9,991,432
- Issue date Jun 5, 2018
- Nichia Corporation
- Shimpei Sasaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adjustable losses of bond wire arrangement
- Patent number 9,979,388
- Issue date May 22, 2018
- NXP USA, INC.
- Youri Volokhine
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor module with ultrasonically welded terminals
- Patent number 9,949,385
- Issue date Apr 17, 2018
- ABB Schweiz AG
- Samuel Hartmann
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring with external terminal
- Patent number 9,941,238
- Issue date Apr 10, 2018
- Micron Technology, Inc.
- Ken Ota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding method and apparatus for electromagnetic interference...
- Patent number 9,935,075
- Issue date Apr 3, 2018
- Invensas Corporation
- Shaowu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transformer
- Patent number 9,928,954
- Issue date Mar 27, 2018
- Ampleon Netherlands B.V.
- Vittorio Cuoco
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
IGBT die structure with auxiliary P well terminal
- Patent number 9,911,838
- Issue date Mar 6, 2018
- IXYS Corporation
- Kyoung Wook Seok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding methods and systems incorporating metal nanoparticles
- Patent number 9,881,895
- Issue date Jan 30, 2018
- Lockheed Martin Corporation
- Randall Mark Stoltenberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package with thermal dissipation structure and method for form...
- Patent number 9,870,975
- Issue date Jan 16, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flipped die stacks with multiple rows of leadframe interconnects
- Patent number 9,859,257
- Issue date Jan 2, 2018
- Invensas Corporation
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PASSIVE ELEMENT AND ELECTRONIC DEVICE
- Publication number 20240282866
- Publication date Aug 22, 2024
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Kento KAWASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Comprising a Leadframe Adapted for Higher Curr...
- Publication number 20240112993
- Publication date Apr 4, 2024
- Infineon Technologies Austria AG
- Stefan Schwab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GALVANIC ISOLATION DEVICE
- Publication number 20240113094
- Publication date Apr 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Jeffrey Alan West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING BUFFER CHIP BONDED TO MEMORY DIES U...
- Publication number 20240055395
- Publication date Feb 15, 2024
- Samsung Electronics Co., Ltd.
- Manho LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230411354
- Publication date Dec 21, 2023
- Samsung Electronics Co., Ltd.
- Chihong SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING WINDOW BALL GRID ARRAY (WBGA) PACKAGE
- Publication number 20230361073
- Publication date Nov 9, 2023
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME PACKAGE WITH METAL INTERPOSER
- Publication number 20230134332
- Publication date May 4, 2023
- MEDIATEK INC.
- Chu-Chia Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH DIRECT ATTACH TO CIRCUIT BOARDS
- Publication number 20230082706
- Publication date Mar 16, 2023
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20220285320
- Publication date Sep 8, 2022
- KIOXIA Corporation
- Yuichi SANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20220246542
- Publication date Aug 4, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Ji Young CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ARRANGEMENT AND METHOD FOR PRODUCING THE SAME
- Publication number 20210242163
- Publication date Aug 5, 2021
- INFINEON TECHNOLOGIES AG
- Frank Sauerland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND METHOD OF MANUFACTURING THE SAME, AND POWER CONVER...
- Publication number 20210217724
- Publication date Jul 15, 2021
- MITSUBISHI ELECTRIC CORPORATION
- Chika MATSUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR COMMUNICATION ACROSS A CAPACITIVELY COUPLED CHANNEL
- Publication number 20200044605
- Publication date Feb 6, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Subhashish Mukherjee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
POWER MODULE AND POWER CONVERSION APPARATUS
- Publication number 20190393184
- Publication date Dec 26, 2019
- Mitsubishi Electric Corporation
- Satoshi KONDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE
- Publication number 20190164857
- Publication date May 30, 2019
- Mitsubishi Electric Corporation
- Daisuke MURATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALUMINATE FLUORESCENT MATERIAL, LIGHT EMITTING DEVICE, AND METHOD F...
- Publication number 20190100694
- Publication date Apr 4, 2019
- Nichia Corporation.
- Kazuya NISHIMATA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADJUSTABLE LOSSES OF BOND WIRE ARRANGEMENT
- Publication number 20180269873
- Publication date Sep 20, 2018
- NXP USA, Inc.
- Youri VOLOKHINE
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Wire Bonding Method and Apparatus for Electromagnetic Interference...
- Publication number 20180197834
- Publication date Jul 12, 2018
- Invensas Corporation
- Shaowu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING WITH EXTERNAL TERMINAL
- Publication number 20180190613
- Publication date Jul 5, 2018
- Micron Technology, Inc.
- Ken Ota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IGBT Die Structure With Auxiliary P Well Terminal
- Publication number 20180145162
- Publication date May 24, 2018
- IXYS Corporation
- Kyoung Wook Seok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180145053
- Publication date May 24, 2018
- Samsung Electronics Co., Ltd.
- JIN-YOUNG JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING METHODS AND SYSTEMS INCORPORATING METAL NANOPARTICLES
- Publication number 20180138143
- Publication date May 17, 2018
- Lockheed Martin Corporation
- Randall Mark STOLTENBERG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180076146
- Publication date Mar 15, 2018
- Toshiba Memory Corporation
- Satoru TAKAKU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire Bonding Method and Apparatus for Electromagnetic Interference...
- Publication number 20180033764
- Publication date Feb 1, 2018
- Invensas Corporation
- Shaowu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH THERMAL DISSIPATION STRUCTURE AND METHOD FOR FORM...
- Publication number 20180019183
- Publication date Jan 18, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chin-Hua WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Radio Frequency Power Component and Radio Frequency Signal Transcei...
- Publication number 20170194282
- Publication date Jul 6, 2017
- Huawei Technologies Co., Ltd
- An Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING WITH EXTERNAL TERMINAL
- Publication number 20170133385
- Publication date May 11, 2017
- Micron Technology, Inc.
- Ken Ota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING METHODS AND SYSTEMS INCORPORATING METAL NANOPARTICLES
- Publication number 20170053895
- Publication date Feb 23, 2017
- Lockheed Martin Corporation
- Randall Mark STOLTENBERG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE FOR LIGHT EMITTING APPARATUS AND LIGHT EMITTING APPARATUS I...
- Publication number 20160308104
- Publication date Oct 20, 2016
- Nichia Corporation.
- Shimpei SASAOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE
- Publication number 20150332990
- Publication date Nov 19, 2015
- Rohm Co., Ltd.
- Hirotoshi Usui
- H01 - BASIC ELECTRIC ELEMENTS

Loop shape arrangement

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor arrangement and method for producing the same

Semiconductor device and manufacturing method thereof

Power module and method of manufacturing the same, and power conver...

Semiconductor device and method of manufacturing semiconductor device

Wiring with external terminal

Aluminate fluorescent material, light emitting device, and method f...

Apparatus for communication across a capacitively coupled channel

Compensation device for transistors

Interchip backside connection

Semiconductor device and power conversion device

Semiconductor device and method of manufacturing the same

IGBT die structure with auxiliary P well terminal

Wiring with external terminal

Radio frequency power component and radio frequency signal transcei...

Adjustable losses on bond wire arrangement

Light emitting apparatus

Method of forming a power module with a magnetic device having a co...

Wire bonding methods and systems incorporating metal nanoparticles

Semiconductor package including package substrate and chip stack in...

Transistor die with drain via arrangement, and methods of manufactu...

Light emitting apparatus

Adjustable losses of bond wire arrangement

Semiconductor module with ultrasonically welded terminals

Wiring with external terminal

Wire bonding method and apparatus for electromagnetic interference...

Transformer

IGBT die structure with auxiliary P well terminal

Wire bonding methods and systems incorporating metal nanoparticles

Chip package with thermal dissipation structure and method for form...

Flipped die stacks with multiple rows of leadframe interconnects

Patents Applicationslast 30 patents

PASSIVE ELEMENT AND ELECTRONIC DEVICE

Semiconductor Device Comprising a Leadframe Adapted for Higher Curr...

GALVANIC ISOLATION DEVICE

SEMICONDUCTOR PACKAGE INCLUDING BUFFER CHIP BONDED TO MEMORY DIES U...

SEMICONDUCTOR PACKAGE

METHOD FOR MANUFACTURING WINDOW BALL GRID ARRAY (WBGA) PACKAGE

LEADFRAME PACKAGE WITH METAL INTERPOSER

MICROELECTRONIC ASSEMBLIES WITH DIRECT ATTACH TO CIRCUIT BOARDS

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR ARRANGEMENT AND METHOD FOR PRODUCING THE SAME

POWER MODULE AND METHOD OF MANUFACTURING THE SAME, AND POWER CONVER...

APPARATUS FOR COMMUNICATION ACROSS A CAPACITIVELY COUPLED CHANNEL

POWER MODULE AND POWER CONVERSION APPARATUS

SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE

ALUMINATE FLUORESCENT MATERIAL, LIGHT EMITTING DEVICE, AND METHOD F...

ADJUSTABLE LOSSES OF BOND WIRE ARRANGEMENT

Wire Bonding Method and Apparatus for Electromagnetic Interference...

WIRING WITH EXTERNAL TERMINAL

IGBT Die Structure With Auxiliary P Well Terminal

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

WIRE BONDING METHODS AND SYSTEMS INCORPORATING METAL NANOPARTICLES

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Wire Bonding Method and Apparatus for Electromagnetic Interference...

CHIP PACKAGE WITH THERMAL DISSIPATION STRUCTURE AND METHOD FOR FORM...

Radio Frequency Power Component and Radio Frequency Signal Transcei...

WIRING WITH EXTERNAL TERMINAL

WIRE BONDING METHODS AND SYSTEMS INCORPORATING METAL NANOPARTICLES

PACKAGE FOR LIGHT EMITTING APPARATUS AND LIGHT EMITTING APPARATUS I...

PACKAGE