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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L28/00Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor

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H01L28/91made by depositing layers

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Patents Grantslast 30 patents

Information Patent Grant
Trench pattern for trench capacitor yield improvement
- Patent number 12,205,982
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yuan-Sheng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including capacitor structure and method for m...
- Patent number 12,199,138
- Issue date Jan 14, 2025
- Samsung Electronics Co., Ltd.
- Intak Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,199,140
- Issue date Jan 14, 2025
- SK Hynix Inc.
- Jae Hee Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench capacitor film scheme to reduce substrate warpage
- Patent number 12,199,139
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ting-Chen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density metal insulator metal capacitor
- Patent number 12,191,347
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei Kai Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin-film transistors and MIM capacitors in exclusion zones
- Patent number 12,183,668
- Issue date Dec 31, 2024
- Intel Corporation
- Abhishek A. Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures having deep trench capacitor and methods f...
- Patent number 12,183,778
- Issue date Dec 31, 2024
- NANYA TECHNOLOGY CORPORATION
- Szu-Yu Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit and method of forming the same
- Patent number 12,183,779
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Che Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-insulator-metal (MIM) energy storage device with layered stac...
- Patent number 12,183,520
- Issue date Dec 31, 2024
- Smoltek AB
- M Shafiqul Kabir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through plate interconnect for a vertical MIM capacitor
- Patent number 12,176,284
- Issue date Dec 24, 2024
- Intel Corporation
- Travis Lajoie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench capacitor profile to decrease substrate warpage
- Patent number 12,176,387
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Li Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including a semiconductor layer within a trench a...
- Patent number 12,166,068
- Issue date Dec 10, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Ralph N. Wall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked staggered electrode foil capacitor structures in semiconduc...
- Patent number 12,154,940
- Issue date Nov 26, 2024
- SARAS MICRO DEVICES, INC.
- Richard P. Sheridan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure including a trench having a high aspect rat...
- Patent number 12,148,654
- Issue date Nov 19, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Yong Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array of capacitors, array of memory cells, methods of forming an a...
- Patent number 12,150,312
- Issue date Nov 19, 2024
- Micron Technology, Inc.
- Sameer Chhajed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures having deep trench capacitor and methods f...
- Patent number 12,148,791
- Issue date Nov 19, 2024
- NANYA TECHNOLOGY CORPORATION
- Szu-Yu Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing capacitor structure
- Patent number 12,125,642
- Issue date Oct 22, 2024
- NANYA TECHNOLOGY CORPORATION
- Chien-Chung Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor trench capacitor structure and manufacturing method t...
- Patent number 12,119,414
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Fu-Chiang Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deep trench capacitor including stress-relief voids and methods of...
- Patent number 12,113,099
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Fu-Chiang Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal plate corner structure on metal insulator metal
- Patent number 12,107,041
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yuan-Yang Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming an electronic product comprising two capacitors...
- Patent number 12,107,118
- Issue date Oct 1, 2024
- Murata Manufacturing Co., Ltd.
- Florent Lallemand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-density capacitor for focal plane arrays
- Patent number 12,094,891
- Issue date Sep 17, 2024
- DRS Network & Imaging Systems, LLC
- Eugene E. Krueger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional device structure including embedded integrated pa...
- Patent number 12,094,925
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded deep trench capacitor structure and methods of forming the...
- Patent number 12,094,868
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer polysilicon stack for semiconductor devices
- Patent number 12,080,755
- Issue date Sep 3, 2024
- Texas Instruments Incorporated
- Furen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory devices and methods of fabricating the same
- Patent number 12,082,395
- Issue date Sep 3, 2024
- Samsung Electronics Co., Ltd.
- Kyooho Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including deep trench capacitors and via contacts
- Patent number 12,074,227
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing semiconductor devices
- Patent number 12,074,023
- Issue date Aug 27, 2024
- Samsung Electronics Co., Ltd.
- Ji-woon Park
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Metal insulator metal capacitor structure having high capacitance
- Patent number 12,068,364
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Yin Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure formation in a semiconductor device
- Patent number 12,068,363
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuang-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250022911
- Publication date Jan 16, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Cheng Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY CAPACITOR AND METHODS OF FORMING THE SAME
- Publication number 20250022912
- Publication date Jan 16, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Meng-Hsien Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Integrated Capacitors
- Publication number 20250015019
- Publication date Jan 9, 2025
- Chipletz, Inc.
- Michael SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR STRUCTURE
- Publication number 20250014824
- Publication date Jan 9, 2025
- NANYA TECHNOLOGY CORPORATION
- Chien-Chung WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR STRUCTURE INCLUDING WORK FUNCTION METAL LAYERS AND METHOD...
- Publication number 20250014984
- Publication date Jan 9, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bi-Shen LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL CAPACITORS
- Publication number 20250015124
- Publication date Jan 9, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- Chieh-En Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXTREMELY HIGH DENSITY SILICON CAPACITOR
- Publication number 20250006780
- Publication date Jan 2, 2025
- International Business Machines Corporation
- Joshua M. Rubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARBON NANOFIBER CAPACITOR APPARATUS AND RELATED METHODS
- Publication number 20250006781
- Publication date Jan 2, 2025
- Intel Corporation
- Thomas Sounart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL INSULATOR METAL CAPACITOR (MIM CAPACITOR)
- Publication number 20240421067
- Publication date Dec 19, 2024
- International Business Machines Corporation
- Baozhen Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20240421066
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Liang CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH ELECTRODE LAYER AND METHOD FOR...
- Publication number 20240413193
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Tzu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL METAL-INSULATOR-METAL CAPACITORS
- Publication number 20240413194
- Publication date Dec 12, 2024
- Intel Corporation
- Denzil Frost
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-DENSITY CAPACITOR FOR FOCAL PLANE ARRAYS
- Publication number 20240405032
- Publication date Dec 5, 2024
- DRS Network & Imaging Systems, LLC
- Eugene E. Krueger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER POLYSILICON STACK FOR SEMICONDUCTOR DEVICES
- Publication number 20240395854
- Publication date Nov 28, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Furen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ferroelectric Device and Methods of Fabrication Thereof
- Publication number 20240397730
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sai-Hooi Yeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL CAPACITOR AND METHODS OF MANUFACTURING
- Publication number 20240387614
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Ying TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS FOR FABRICATION THEREOF
- Publication number 20240387615
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Po LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED CAPACITOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240387619
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Yu LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL PLATE CORNER STRUCTURE ON METAL INSULATOR METAL
- Publication number 20240379529
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Yuan-Yang Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL MIM STRUCTURE
- Publication number 20240379532
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Chun-huan WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR STRUCTURE AND METHOD OF MAKING THE SAME
- Publication number 20240379735
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Yun-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240379530
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Jen TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF INTEGRATED CHIPS PACKAGE WITH CAP...
- Publication number 20240379738
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL DEVICE WITH IMPROVED PERFORMANCE
- Publication number 20240379528
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240371922
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Che Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FORMATION IN A SEMICONDUCTOR DEVICE
- Publication number 20240371921
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuang-Wei CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNING A FUNCTIONAL LAYER BY MEANS OF A SACRIFICIAL LAYER AND P...
- Publication number 20240371923
- Publication date Nov 7, 2024
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Messaoud BEDJAOUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICES AND METHODS OF FABRICATING THE SAME
- Publication number 20240373620
- Publication date Nov 7, 2024
- Samsung Electronics Co., Ltd.
- KYOOHO JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING DEEP TRENCH CAPACITORS AND VIA CONTACTS
- Publication number 20240372013
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR TRENCH CAPACITOR STRUCTURE AND MANUFACTURING METHOD T...
- Publication number 20240372014
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- FU-CHIANG KUO
- H01 - BASIC ELECTRIC ELEMENTS

made by depositing layers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Trench pattern for trench capacitor yield improvement

Semiconductor device including capacitor structure and method for m...

Semiconductor device and method for manufacturing the same

Trench capacitor film scheme to reduce substrate warpage

High density metal insulator metal capacitor

Thin-film transistors and MIM capacitors in exclusion zones

Semiconductor structures having deep trench capacitor and methods f...

Integrated circuit and method of forming the same

Metal-insulator-metal (MIM) energy storage device with layered stac...

Through plate interconnect for a vertical MIM capacitor

Trench capacitor profile to decrease substrate warpage

Electronic device including a semiconductor layer within a trench a...

Stacked staggered electrode foil capacitor structures in semiconduc...

Semiconductor structure including a trench having a high aspect rat...

Array of capacitors, array of memory cells, methods of forming an a...

Semiconductor structures having deep trench capacitor and methods f...

Method of manufacturing capacitor structure

Semiconductor trench capacitor structure and manufacturing method t...

Deep trench capacitor including stress-relief voids and methods of...

Metal plate corner structure on metal insulator metal

Method for forming an electronic product comprising two capacitors...

High-density capacitor for focal plane arrays

Three-dimensional device structure including embedded integrated pa...

Shielded deep trench capacitor structure and methods of forming the...

Multi-layer polysilicon stack for semiconductor devices

Semiconductor memory devices and methods of fabricating the same

Semiconductor device including deep trench capacitors and via contacts

Methods of manufacturing semiconductor devices

Metal insulator metal capacitor structure having high capacitance

Structure formation in a semiconductor device

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

HIGH DENSITY CAPACITOR AND METHODS OF FORMING THE SAME

Semiconductor Package with Integrated Capacitors

CAPACITOR STRUCTURE

CAPACITOR STRUCTURE INCLUDING WORK FUNCTION METAL LAYERS AND METHOD...

METAL-INSULATOR-METAL CAPACITORS

EXTREMELY HIGH DENSITY SILICON CAPACITOR

CARBON NANOFIBER CAPACITOR APPARATUS AND RELATED METHODS

METAL INSULATOR METAL CAPACITOR (MIM CAPACITOR)

METAL-INSULATOR-METAL STRUCTURES AND METHODS OF FORMING THE SAME

SEMICONDUCTOR DEVICE STRUCTURE WITH ELECTRODE LAYER AND METHOD FOR...

THREE-DIMENSIONAL METAL-INSULATOR-METAL CAPACITORS

HIGH-DENSITY CAPACITOR FOR FOCAL PLANE ARRAYS

MULTI-LAYER POLYSILICON STACK FOR SEMICONDUCTOR DEVICES

Ferroelectric Device and Methods of Fabrication Thereof

METAL-INSULATOR-METAL CAPACITOR AND METHODS OF MANUFACTURING

SEMICONDUCTOR DEVICES AND METHODS FOR FABRICATION THEREOF

STACKED CAPACITOR STRUCTURE AND MANUFACTURING METHOD THEREOF

METAL PLATE CORNER STRUCTURE ON METAL INSULATOR METAL

NOVEL MIM STRUCTURE

CAPACITOR STRUCTURE AND METHOD OF MAKING THE SAME

INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME

STRUCTURE AND FORMATION METHOD OF INTEGRATED CHIPS PACKAGE WITH CAP...

METAL-INSULATOR-METAL DEVICE WITH IMPROVED PERFORMANCE

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

STRUCTURE FORMATION IN A SEMICONDUCTOR DEVICE

PATTERNING A FUNCTIONAL LAYER BY MEANS OF A SACRIFICIAL LAYER AND P...

SEMICONDUCTOR MEMORY DEVICES AND METHODS OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE INCLUDING DEEP TRENCH CAPACITORS AND VIA CONTACTS

SEMICONDUCTOR TRENCH CAPACITOR STRUCTURE AND MANUFACTURING METHOD T...