Magnesium [Mg] as principal constituent

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CPC
H01L2224/13123

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/13123Magnesium [Mg] as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Bump structure and method of manufacturing bump structure
- Patent number 11,923,326
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Yu Chang
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Bump structure and method of manufacturing bump structure
- Patent number 11,456,266
- Issue date Sep 27, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ching-Yu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device including a reinforcing member
- Patent number 10,573,852
- Issue date Feb 25, 2020
- Samsung Display Co., Ltd.
- Byoung Yong Kim
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Core material, semiconductor package, and forming method of bump el...
- Patent number 10,381,319
- Issue date Aug 13, 2019
- Senju Metal Industry Co., Ltd.
- Tomoaki Nishino
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Electrode for a semiconductor device of a ball grid array (BGA) type
- Patent number 10,283,472
- Issue date May 7, 2019
- Sumitomo Electric Device Innovations, Inc.
- Keita Matsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having conductive bumps of varying heights
- Patent number 10,163,844
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yen-Liang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of manufacturing the same
- Patent number 10,163,768
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing metal ball, joining material, and metal ball
- Patent number 10,150,185
- Issue date Dec 11, 2018
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip packages and methods of manufacture thereof
- Patent number 9,735,130
- Issue date Aug 15, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo Lung Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump electrode, board which has bump electrodes, and method for man...
- Patent number 9,662,730
- Issue date May 30, 2017
- Senju Metal Industry Co., Ltd.
- Takahiro Hattori
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device having solder joint and method of forming the...
- Patent number 9,646,945
- Issue date May 9, 2017
- Samsung Electronics Co., Ltd.
- Soon-Bum Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 9,601,466
- Issue date Mar 21, 2017
- Samsung Electronics Co., Ltd.
- Jeongwon Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packages and methods of manufacture thereof
- Patent number 9,425,179
- Issue date Aug 23, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cylindrical bonding structure and method of manufacture
- Patent number 8,890,336
- Issue date Nov 18, 2014
- QUALCOMM Incorporated
- Jin-Yuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating circuit component
- Patent number 8,461,679
- Issue date Jun 11, 2013
- Megica Corporation
- Jin-Yuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package having a chip combined with a substrate via a copper p...
- Patent number 8,421,222
- Issue date Apr 16, 2013
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip semiconductor package and fabrication method thereof
- Patent number 8,093,721
- Issue date Jan 10, 2012
- Nepes Corporation
- In-Soo Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of joining chips utilizing copper pillar
- Patent number 8,021,921
- Issue date Sep 20, 2011
- Megica Corporation
- Shih-Hsiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating circuit component
- Patent number 7,960,270
- Issue date Jun 14, 2011
- Megica Corporation
- Jin-Yuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit component with bump formed over chip
- Patent number 7,382,005
- Issue date Jun 3, 2008
- Megica Corporation
- Shih-Hsiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure with pillar and cap
- Patent number 7,208,834
- Issue date Apr 24, 2007
- Megica Corporation
- Jin-Yuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer bumping process with solder balls bonded to under bump metall...
- Patent number 6,939,790
- Issue date Sep 6, 2005
- Advanced Semiconductor Engineering, Inc.
- Jau-Shoung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bumping process
- Patent number 6,908,842
- Issue date Jun 21, 2005
- Advanced Semiconductor Engineering, Inc.
- Jau-Shoung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating cylindrical bonding structure
- Patent number 6,784,087
- Issue date Aug 31, 2004
- Megic Corporation
- Jin-Yuan Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BUMP STRUCTURE AND METHOD OF MANUFACTURING BUMP STRUCTURE
- Publication number 20240258252
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Yu CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REVERSABLE ATTACHMENT SYSTEM
- Publication number 20240213212
- Publication date Jun 27, 2024
- The Boeing Company
- Peter D. Brewer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING SUBSTRATE, MANUFACTURING METHOD THEREOF, AND DISPLAY...
- Publication number 20230420431
- Publication date Dec 28, 2023
- Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Peihai WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE AND METHOD OF MANUFACTURING BUMP STRUCTURE
- Publication number 20220406741
- Publication date Dec 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Yu CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220384377
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- PEI-HAW TSAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE AND METHOD OF MANUFACTURING BUMP STRUCTURE
- Publication number 20210134746
- Publication date May 6, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Yu CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20170365571
- Publication date Dec 21, 2017
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Keita MATSUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20160071824
- Publication date Mar 10, 2016
- Samsung Electronics Co., Ltd.
- Jeongwon Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF ASSEMBLING CHIPS
- Publication number 20110291275
- Publication date Dec 1, 2011
- MEGICA CORPORATION
- Shih-Hsiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING CIRCUIT COMPONENT
- Publication number 20110215476
- Publication date Sep 8, 2011
- MEGICA Corporation
- Jin-Yuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20100230810
- Publication date Sep 16, 2010
- In-Soo Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE, CIRCUIT BOARD, AND MODULE MANUFACTURING METHOD
- Publication number 20100212939
- Publication date Aug 26, 2010
- Fujikura Ltd.
- Shoji Ito
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
BUMP STRUCTURE FOE SEMICONDUCTOR DEVICE
- Publication number 20100032831
- Publication date Feb 11, 2010
- NEPES CORPORATION
- Byung-Jin Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cylindrical Bonding Structure and method of manufacture
- Publication number 20080296761
- Publication date Dec 4, 2008
- MEGICA CORPORATION
- Jin-Yuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of assembling chips
- Publication number 20080241992
- Publication date Oct 2, 2008
- MEGICA CORPORATION
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of assembling chips
- Publication number 20080227237
- Publication date Sep 18, 2008
- MEGICA CORPORATION
- Shih-Hsiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of assembling chips
- Publication number 20080211105
- Publication date Sep 4, 2008
- MEGICA CORPORATION
- Shih-Hsiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING CIRCUIT COMPONENT
- Publication number 20070166993
- Publication date Jul 19, 2007
- MEGICA CORPORATION
- Jin-Yuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of assembling chips
- Publication number 20050194695
- Publication date Sep 8, 2005
- Shih-Hsiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of fabricating cylindrical bonding structure
- Publication number 20050026413
- Publication date Feb 3, 2005
- Jin-Yuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bumping process
- Publication number 20040127009
- Publication date Jul 1, 2004
- Advanced Semiconductor Engineering, Inc.
- Jau-Shoung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bumping process
- Publication number 20040127010
- Publication date Jul 1, 2004
- Advanced Semiconductor Engineering, Inc.
- Jau-Shoung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cylindrical bonding structure and method of manufacture
- Publication number 20030129822
- Publication date Jul 10, 2003
- Jin-Yuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cylindrical bonding structure and method of manufacture
- Publication number 20030127734
- Publication date Jul 10, 2003
- Jin-Yuan Lee
- H01 - BASIC ELECTRIC ELEMENTS

Magnesium [Mg] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bump structure and method of manufacturing bump structure

Bump structure and method of manufacturing bump structure

Display device including a reinforcing member

Core material, semiconductor package, and forming method of bump el...

Electrode for a semiconductor device of a ball grid array (BGA) type

Semiconductor device having conductive bumps of varying heights

Semiconductor structure and method of manufacturing the same

Method for producing metal ball, joining material, and metal ball

Chip packages and methods of manufacture thereof

Bump electrode, board which has bump electrodes, and method for man...

Semiconductor device having solder joint and method of forming the...

Semiconductor package and method of manufacturing the same

Chip packages and methods of manufacture thereof

Cylindrical bonding structure and method of manufacture

Method for fabricating circuit component

Chip package having a chip combined with a substrate via a copper p...

Flip chip semiconductor package and fabrication method thereof

Method of joining chips utilizing copper pillar

Method for fabricating circuit component

Circuit component with bump formed over chip

Bonding structure with pillar and cap

Wafer bumping process with solder balls bonded to under bump metall...

Bumping process

Method of fabricating cylindrical bonding structure

Patents Applicationslast 30 patents

BUMP STRUCTURE AND METHOD OF MANUFACTURING BUMP STRUCTURE

REVERSABLE ATTACHMENT SYSTEM

LIGHT-EMITTING SUBSTRATE, MANUFACTURING METHOD THEREOF, AND DISPLAY...

BUMP STRUCTURE AND METHOD OF MANUFACTURING BUMP STRUCTURE

SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME

BUMP STRUCTURE AND METHOD OF MANUFACTURING BUMP STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

METHOD OF ASSEMBLING CHIPS

METHOD FOR FABRICATING CIRCUIT COMPONENT

FLIP CHIP SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

MODULE, CIRCUIT BOARD, AND MODULE MANUFACTURING METHOD

BUMP STRUCTURE FOE SEMICONDUCTOR DEVICE

Cylindrical Bonding Structure and method of manufacture

Method of assembling chips

Method of assembling chips

Method of assembling chips

METHOD FOR FABRICATING CIRCUIT COMPONENT

Method of assembling chips

Method of fabricating cylindrical bonding structure

Bumping process

Bumping process

Cylindrical bonding structure and method of manufacture

Cylindrical bonding structure and method of manufacture