maintaining a controlled atmosphere with processes not provided for in B81C1/00285

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B81C1/00293

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BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS B81C1/00Manufacture or treatment of devices or systems in or on a substrate

Current Industry

B81C1/00293maintaining a controlled atmosphere with processes not provided for in B81C1/00285

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Micromechanical component for a sensor device having a capacitor se...
- Patent number 12,163,851
- Issue date Dec 10, 2024
- Robert Bosch GmbH
- Heribert Weber
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bonded structures
- Patent number 12,100,684
- Issue date Sep 24, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Signal processing circuit for triple-membrane MEMS device
- Patent number 11,932,533
- Issue date Mar 19, 2024
- Infineon Technologies AG
- Marc Fueldner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,915,924
- Issue date Feb 27, 2024
- Denso Corporation
- Megumi Suzuki
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Vertical shear weld wafer bonding
- Patent number 11,858,806
- Issue date Jan 2, 2024
- Texas Instruments Incorporated
- John Charles Ehmke
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of forming dielectric and metal sealing layers on capping st...
- Patent number 11,772,960
- Issue date Oct 3, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ching-Kai Shen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bonded structures
- Patent number 11,670,615
- Issue date Jun 6, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS cavity with non-contaminating seal
- Patent number 11,618,675
- Issue date Apr 4, 2023
- SiTime Corporation
- Michael Julian Daneman
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor structure and method for fabricating the same
- Patent number 11,434,129
- Issue date Sep 6, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device and manufacturing method of the same
- Patent number 11,365,117
- Issue date Jun 21, 2022
- Industrial Technology Research Institute
- Heng-chung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for setting a pressure in a cavern formed with the aid of a...
- Patent number 11,274,038
- Issue date Mar 15, 2022
- Robert Bosch GmbH
- Johannes Classen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS cavity with non-contaminating seal
- Patent number 11,220,425
- Issue date Jan 11, 2022
- SiTime Corporation
- Michael Julian Daneman
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical system cavity packaging
- Patent number 11,203,524
- Issue date Dec 21, 2021
- Texas Instruments Incorporated
- Jose Antonio Martinez
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS devices and methods of forming same
- Patent number 11,180,365
- Issue date Nov 23, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Chih Liang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stress reduction during laser resealing through a temperature increase
- Patent number 11,084,716
- Issue date Aug 10, 2021
- Robert Bosch GmbH
- Julia Amthor
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for setting a pressure in a cavity formed with the aid of a...
- Patent number 11,084,714
- Issue date Aug 10, 2021
- Robert Bosch GmbH
- Peter Borwin Staffeld
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Multi-layer sealing film for high seal yield
- Patent number 11,034,578
- Issue date Jun 15, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Chien Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer level integrated MEMS device enabled by silicon pillar and sm...
- Patent number 10,961,118
- Issue date Mar 30, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Chia Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor structure and manufacturing method for the same
- Patent number 10,961,114
- Issue date Mar 30, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ching-Kai Shen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for sealing an access opening to a cavity and MEMS component...
- Patent number 10,913,656
- Issue date Feb 9, 2021
- Infineon Technologies AG
- Gerhard Metzger-Brueckl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor pressure sensor
- Patent number 10,906,800
- Issue date Feb 2, 2021
- Mitsubishi Electric Cornoration
- Eiji Yoshikawa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer level integrated MEMS device enabled by silicon pillar and sm...
- Patent number 10,899,608
- Issue date Jan 26, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Chia Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing a micromechanical element
- Patent number 10,889,491
- Issue date Jan 12, 2021
- Robert Bosch GmbH
- Markus Kuhnke
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bonded structures
- Patent number 10,879,207
- Issue date Dec 29, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Structure and method for sealing through-hole, and transfer substra...
- Patent number 10,870,151
- Issue date Dec 22, 2020
- Tanaka Kikinzoku Kogyo K.K.
- Toshinori Ogashiwa
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Methods for CMOS-MEMS integrated devices with multiple sealed cavit...
- Patent number 10,850,973
- Issue date Dec 1, 2020
- Invensense, Inc.
- Michael Daneman
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for closing off a micromechanical device by laser melting, a...
- Patent number 10,836,631
- Issue date Nov 17, 2020
- Robert Bosch GmbH
- Jochen Reinmuth
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Micro-electro-mechanical system (MEMS) and related actuator bumps,...
- Patent number 10,811,206
- Issue date Oct 20, 2020
- International Business Machines Corporation
- Christopher V. Jahnes
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Hermetic vertical shear weld wafer bonding
- Patent number 10,759,658
- Issue date Sep 1, 2020
- Texas Instruments Incorporated
- John Charles Ehmke
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro-electro-mechanical system (MEMS) and related actuator bumps,...
- Patent number 10,748,725
- Issue date Aug 18, 2020
- International Business Machines Corporation
- Christopher V. Jahnes
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
LASER SEALING METHODS FOR CLOSING VENTHOLES OF MICROMECAHNICAL DEVICES
- Publication number 20240228267
- Publication date Jul 11, 2024
- ROBERT BOSCH GmbH
- Bo CHENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS SENSOR AND METHOD OF MANUFACTURING MEMS SENSOR
- Publication number 20240208804
- Publication date Jun 27, 2024
- Rohm Co., Ltd.
- Martin Wilfried HELLER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SIGNAL PROCESSING CIRCUIT FOR TRIPLE-MEMBRANE MEMS DEVICE
- Publication number 20240174514
- Publication date May 30, 2024
- INFINEON TECHNOLOGIES AG
- Marc Fueldner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LASER SEALING METHODS FOR CLOSING VENTHOLES OF MICROMECAHNICAL DEVICES
- Publication number 20240132342
- Publication date Apr 25, 2024
- ROBERT BOSCH GmbH
- Bo CHENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHODS FOR SEALING CAVITIES IN MICRO-FABRICATED DEVICES AND MICRO-...
- Publication number 20240109771
- Publication date Apr 4, 2024
- The University of British Columbia
- Kenichi TAKAHATA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL SYSTEMS PACKAGE AND METHOD FOR MANUFACTURING...
- Publication number 20240083743
- Publication date Mar 14, 2024
- Vanguard International Semiconductor Corporation
- RAKESH CHAND
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20230382719
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- CHING-KAI SHEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PLUG FOR MEMS CAVITY
- Publication number 20230365399
- Publication date Nov 16, 2023
- Murata Manufacturing Co., Ltd.
- Petteri KILPINEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BONDED STRUCTURES
- Publication number 20230361072
- Publication date Nov 9, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS CAVITY WITH NON-CONTAMINATING SEAL
- Publication number 20230286798
- Publication date Sep 14, 2023
- SiTime Corporation
- Michael Julian Daneman
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Fabrication Method of MEMS Transducer Element
- Publication number 20230146234
- Publication date May 11, 2023
- TE Connectivity Solutions GMBH
- Jean-Francois Le Neal
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
OPTICAL SCANNING DEVICE AND METHOD FOR MANUFACTURING THE SAME, AND...
- Publication number 20230094213
- Publication date Mar 30, 2023
- Mitsubishi Electric Corporation
- Yusuke SHIRAYANAGI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROMECHANICAL COMPONENT FOR A SENSOR DEVICE
- Publication number 20220390311
- Publication date Dec 8, 2022
- ROBERT BOSCH GmbH
- Heribert Weber
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20220315414
- Publication date Oct 6, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUN-WEN CHENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MULTIPLY ENCAPSULATED MICRO ELECTRICAL MECHANICAL SYSTEMS DEVICE
- Publication number 20220219971
- Publication date Jul 14, 2022
- CAMBRIDGE ENTERPRISE LIMITED
- Ashwin SESHIA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Signal Processing Circuit for Triple-Membrane MEMS Device
- Publication number 20220194784
- Publication date Jun 23, 2022
- INFINEON TECHNOLOGIES AG
- Marc Fueldner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS CAVITY WITH NON-CONTAMINATING SEAL
- Publication number 20220162063
- Publication date May 26, 2022
- SiTime Corporation
- Michael Julian Daneman
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
VERTICAL SHEAR WELD WAFER BONDING
- Publication number 20210371272
- Publication date Dec 2, 2021
- TEXAS INSTRUMENTS INCORPORATED
- John Charles Ehmke
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR MANUFACTURING MEMS DEVICE AND MEMS DEVICE
- Publication number 20210229985
- Publication date Jul 29, 2021
- TOHOKU UNIVERSITY
- Yukio SUZUKI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20210206627
- Publication date Jul 8, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- CHING-KAI SHEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BONDED STRUCTURES
- Publication number 20210202428
- Publication date Jul 1, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20210188626
- Publication date Jun 24, 2021
- Industrial Technology Research Institute
- Heng-chung CHANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
VERTICAL SHEAR WELD WAFER BONDING
- Publication number 20200391993
- Publication date Dec 17, 2020
- TEXAS INSTRUMENTS INCORPORATED
- John Charles Ehmke
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS CAVITY WITH NON-CONTAMINATING SEAL
- Publication number 20200391997
- Publication date Dec 17, 2020
- SiTime Corporation
- Michael Julian Daneman
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20200377362
- Publication date Dec 3, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- CHING-KAI SHEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STRESS REDUCTION DURING LASER RESEALING THROUGH A TEMPERATURE INCREASE
- Publication number 20200270124
- Publication date Aug 27, 2020
- ROBERT BOSCH GmbH
- Julia AMTHOR
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MULTI-LAYER SEALING FILM FOR HIGH SEAL YIELD
- Publication number 20200270121
- Publication date Aug 27, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Chih-Chien Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STRUCTURE AND METHOD FOR SEALING THROUGH-HOLE, AND TRANSFER SUBSTRA...
- Publication number 20200230701
- Publication date Jul 23, 2020
- Tanaka Kikinzoku Kogyo K.K.
- Toshinori OGASHIWA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
MICROELECTROMECHANICAL SYSTEM CAVITY PACKAGING
- Publication number 20200189910
- Publication date Jun 18, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Jose Antonio Martinez
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HERMETIC VERTICAL SHEAR WELD WAFER BONDING
- Publication number 20200180946
- Publication date Jun 11, 2020
- TEXAS INSTRUMENTS INCORPORATED
- John Charles Ehmke
- B81 - MICRO-STRUCTURAL TECHNOLOGY

maintaining a controlled atmosphere with processes not provided for in B81C1/00285

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Micromechanical component for a sensor device having a capacitor se...

Bonded structures

Signal processing circuit for triple-membrane MEMS device

Semiconductor device and method for manufacturing the same

Vertical shear weld wafer bonding

Method of forming dielectric and metal sealing layers on capping st...

Bonded structures

MEMS cavity with non-contaminating seal

Semiconductor structure and method for fabricating the same

MEMS device and manufacturing method of the same

Method for setting a pressure in a cavern formed with the aid of a...

MEMS cavity with non-contaminating seal

Microelectromechanical system cavity packaging

MEMS devices and methods of forming same

Stress reduction during laser resealing through a temperature increase

Method for setting a pressure in a cavity formed with the aid of a...

Multi-layer sealing film for high seal yield

Wafer level integrated MEMS device enabled by silicon pillar and sm...

Semiconductor structure and manufacturing method for the same

Method for sealing an access opening to a cavity and MEMS component...

Semiconductor pressure sensor

Wafer level integrated MEMS device enabled by silicon pillar and sm...

Method for producing a micromechanical element

Bonded structures

Structure and method for sealing through-hole, and transfer substra...

Methods for CMOS-MEMS integrated devices with multiple sealed cavit...

Method for closing off a micromechanical device by laser melting, a...

Micro-electro-mechanical system (MEMS) and related actuator bumps,...

Hermetic vertical shear weld wafer bonding

Micro-electro-mechanical system (MEMS) and related actuator bumps,...

Patents Applicationslast 30 patents

LASER SEALING METHODS FOR CLOSING VENTHOLES OF MICROMECAHNICAL DEVICES

MEMS SENSOR AND METHOD OF MANUFACTURING MEMS SENSOR

SIGNAL PROCESSING CIRCUIT FOR TRIPLE-MEMBRANE MEMS DEVICE

LASER SEALING METHODS FOR CLOSING VENTHOLES OF MICROMECAHNICAL DEVICES

METHODS FOR SEALING CAVITIES IN MICRO-FABRICATED DEVICES AND MICRO-...

MICROELECTROMECHANICAL SYSTEMS PACKAGE AND METHOD FOR MANUFACTURING...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD FOR THE SAME

PLUG FOR MEMS CAVITY

BONDED STRUCTURES

MEMS CAVITY WITH NON-CONTAMINATING SEAL

Fabrication Method of MEMS Transducer Element

OPTICAL SCANNING DEVICE AND METHOD FOR MANUFACTURING THE SAME, AND...

MICROMECHANICAL COMPONENT FOR A SENSOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

MULTIPLY ENCAPSULATED MICRO ELECTRICAL MECHANICAL SYSTEMS DEVICE

Signal Processing Circuit for Triple-Membrane MEMS Device

MEMS CAVITY WITH NON-CONTAMINATING SEAL

VERTICAL SHEAR WELD WAFER BONDING

METHOD FOR MANUFACTURING MEMS DEVICE AND MEMS DEVICE

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD FOR THE SAME

BONDED STRUCTURES

MEMS DEVICE AND MANUFACTURING METHOD OF THE SAME

VERTICAL SHEAR WELD WAFER BONDING

MEMS CAVITY WITH NON-CONTAMINATING SEAL

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD FOR THE SAME

STRESS REDUCTION DURING LASER RESEALING THROUGH A TEMPERATURE INCREASE

MULTI-LAYER SEALING FILM FOR HIGH SEAL YIELD

STRUCTURE AND METHOD FOR SEALING THROUGH-HOLE, AND TRANSFER SUBSTRA...

MICROELECTROMECHANICAL SYSTEM CAVITY PACKAGING

HERMETIC VERTICAL SHEAR WELD WAFER BONDING