Manganese [Mn]

Industry

CPC
H01L2924/01025

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/01025Manganese [Mn]

Industries

Patents Grantslast 30 patents

Information Patent Grant
Low temperature bonded structures
- Patent number 12,046,571
- Issue date Jul 23, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, manufacturing method, solid state image senso...
- Patent number 11,776,923
- Issue date Oct 3, 2023
- Sony Corporation
- Masaki Haneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin molding, surface mounted light emitting apparatus and methods...
- Patent number 11,631,790
- Issue date Apr 18, 2023
- Nichia Corporation
- Masafumi Kuramoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature bonded structures
- Patent number 11,515,279
- Issue date Nov 29, 2022
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal paste for joints, assembly, production method for assembly, s...
- Patent number 11,462,502
- Issue date Oct 4, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Yuki Kawana
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Semiconductor substrate having a bond pad material based on aluminum
- Patent number 11,410,950
- Issue date Aug 9, 2022
- Infineon Technologies AG
- Gert Pfahl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection of copper surfaces using copper sintering material
- Patent number 11,329,023
- Issue date May 10, 2022
- Schlumberger Technology Corporation
- Mark Alex Kostinovsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a pillar structure having a non-metal sidewall pro...
- Patent number 11,257,714
- Issue date Feb 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modulated inductance module
- Patent number 11,201,007
- Issue date Dec 14, 2021
- L. Pierre de Rochemont
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Resin molding, surface mounted light emitting apparatus and methods...
- Patent number 10,971,656
- Issue date Apr 6, 2021
- Nichia Corporation
- Masafumi Kuramoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, manufacturing method, solid state image senso...
- Patent number 10,950,637
- Issue date Mar 16, 2021
- Sony Corporation
- Masaki Haneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive film for semiconductor, and semiconductor device
- Patent number 10,818,610
- Issue date Oct 27, 2020
- LG Chem, Ltd.
- Hee Jung Kim
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 10,818,620
- Issue date Oct 27, 2020
- Renesas Electronics Corporation
- Hiromi Shigihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature bonded structures
- Patent number 10,790,262
- Issue date Sep 29, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin molding, surface mounted light emitting apparatus and methods...
- Patent number 10,686,102
- Issue date Jun 16, 2020
- Nichia Corporation
- Masafumi Kuramoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, manufacturing method, solid state image senso...
- Patent number 10,615,210
- Issue date Apr 7, 2020
- Sony Corporation
- Masaki Haneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching solution for copper or copper alloy
- Patent number 10,570,522
- Issue date Feb 25, 2020
- Entegris, Inc.
- Yutaka Yoshida
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Power management module and method of manufacture
- Patent number 10,475,568
- Issue date Nov 12, 2019
- L. Pierre de Rochemont
- L. Pierre de Rochemont
- B82 - NANO-TECHNOLOGY
Information Patent Grant
White light devices using non-polar or semipolar gallium containing...
- Patent number RE47711
- Issue date Nov 5, 2019
- Soraa, Inc.
- James W. Raring
Information Patent Grant
Semiconductor device
- Patent number 10,461,053
- Issue date Oct 29, 2019
- Renesas Electronics Corporation
- Shinya Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding materials comprising ball grid arrays and metal inve...
- Patent number 10,403,594
- Issue date Sep 3, 2019
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tooling for coupling multiple electronic chips
- Patent number 10,340,239
- Issue date Jul 2, 2019
- Cufer Asset Ltd. L.L.C.
- Roger Dugas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, manufacturing method, solid state image senso...
- Patent number 10,332,927
- Issue date Jun 25, 2019
- Sony Corporation
- Masaki Haneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package, integrated fan-out package array, and m...
- Patent number 10,276,421
- Issue date Apr 30, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sih-Hao Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin molding, surface mounted light emitting apparatus and methods...
- Patent number 10,263,161
- Issue date Apr 16, 2019
- Nichia Corporation
- Masafumi Kuramoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device and method for manufacturing light emitting d...
- Patent number 10,230,034
- Issue date Mar 12, 2019
- Nichia Corporation
- Motokazu Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive connecting member and manufacturing method of same
- Patent number 10,177,079
- Issue date Jan 8, 2019
- Furukawa Electric Co., Ltd.
- Hideo Nishikubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cu pillar bump with L-shaped non-metal sidewall protection structure
- Patent number 10,163,837
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,163,740
- Issue date Dec 25, 2018
- Renesas Electronics Corporation
- Bunji Yasumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mixed alloy solder paste
- Patent number 10,118,260
- Issue date Nov 6, 2018
- Indium Corporation
- Hongwen Zhang
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING REDISTRIBUTION STRUCTURE AND METHOD...
- Publication number 20240321804
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Dowan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD, SOLID STATE IMAGE SENSO...
- Publication number 20230402411
- Publication date Dec 14, 2023
- SONY GROUP CORPORATION
- Masaki HANEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW TEMPERATURE BONDED STRUCTURES
- Publication number 20230268307
- Publication date Aug 24, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT INSULATING INTERCONNECT FEATURES IN A COMPONENT OF A COMPOSITE...
- Publication number 20220415853
- Publication date Dec 29, 2022
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION OF COPPER SURFACES USING COPPER SINTERING MATERIAL
- Publication number 20210320082
- Publication date Oct 14, 2021
- SCHLUMBERGER TECHNOLOGY CORPORATION
- Mark Alex Kostinovsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD, SOLID STATE IMAGE SENSO...
- Publication number 20210183661
- Publication date Jun 17, 2021
- SONY CORPORATION
- Masaki HANEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Substrate Having a Bond Pad Material Based on Aluminum
- Publication number 20210091025
- Publication date Mar 25, 2021
- INFINEON TECHNOLOGIES AG
- Gert Pfahl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW TEMPERATURE BONDED STRUCTURES
- Publication number 20200381389
- Publication date Dec 3, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka UZOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD, SOLID STATE IMAGE SENSO...
- Publication number 20200227462
- Publication date Jul 16, 2020
- SONY CORPORATION
- Masaki HANEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING INTERLAYER...
- Publication number 20200211931
- Publication date Jul 2, 2020
- RENESAS ELECTRONICS CORPORATION
- Masahiro MATSUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL PASTE FOR JOINTS, ASSEMBLY, PRODUCTION METHOD FOR ASSEMBLY, S...
- Publication number 20200075528
- Publication date Mar 5, 2020
- Hitachi Chemical Company, Ltd.
- Yuki KAWANA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
ADHESIVE FILM FOR SEMICONDUCTOR, AND SEMICONDUCTOR DEVICE
- Publication number 20190326226
- Publication date Oct 24, 2019
- LG CHEM, LTD.
- Hee Jung KIM
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
LOW TEMPERATURE BONDED STRUCTURES
- Publication number 20190319007
- Publication date Oct 17, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka UZOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING MATERIALS COMPRISING BALL GRID ARRAYS AND METAL INVE...
- Publication number 20190229083
- Publication date Jul 25, 2019
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD, SOLID STATE IMAGE SENSO...
- Publication number 20190206919
- Publication date Jul 4, 2019
- SONY CORPORATION
- Masaki HANEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190027455
- Publication date Jan 24, 2019
- RENESAS ELECTRONICS CORPORATION
- SHINYA SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN MOLDING, SURFACE MOUNTED LIGHT EMITTING APPARATUS AND METHODS...
- Publication number 20180175253
- Publication date Jun 21, 2018
- Nichia Corporation.
- Masafumi KURAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD, SOLID STATE IMAGE SENSO...
- Publication number 20180138224
- Publication date May 17, 2018
- SONY CORPORATION
- Masaki HANEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING LIGHT EMITTING D...
- Publication number 20180123006
- Publication date May 3, 2018
- Nichia Corporation.
- Motokazu YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180040521
- Publication date Feb 8, 2018
- RENESAS ELECTRONICS CORPORATION
- Bunji Yasumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOOLING FOR COUPLING MULTIPLE ELECTRONIC CHIPS
- Publication number 20180033754
- Publication date Feb 1, 2018
- Cufer Asset Ltd. L.L.C.
- Roger Dugas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING BUMP STRUCTURE
- Publication number 20180033756
- Publication date Feb 1, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Guo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE AND METHOD
- Publication number 20170352635
- Publication date Dec 7, 2017
- Semiconductor Components Industries, LLC
- Shutesh Krishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CIRCUIT PACKAGE
- Publication number 20170309576
- Publication date Oct 26, 2017
- TDK Corporation
- KENICHI KAWABATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CIRCUIT PACKAGE
- Publication number 20170301628
- Publication date Oct 19, 2017
- TDK Corporation
- KENICHI KAWABATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED FAN-OUT PACKAGE, INTEGRATED FAN-OUT PACKAGE ARRAY, AND M...
- Publication number 20170271227
- Publication date Sep 21, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sih-Hao Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ELEMENT MOUNTING SUBSTRATE AND ELECTRONIC DEVICE
- Publication number 20170186672
- Publication date Jun 29, 2017
- KYOCERA CORPORATION
- Hiroshi YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BOND USING A COPPER ALLOY FOR YIELD IMPROVEMENT
- Publication number 20170025381
- Publication date Jan 26, 2017
- Taiwan Semiconductor Manufacturing Co., LTD
- Yu-Cheng Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND...
- Publication number 20160351461
- Publication date Dec 1, 2016
- Samsung SDI Co., Ltd.
- Yoon Man LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR INTEGRATED CIRCUIT DEVICES INCLUDING MULTI-LAYER GLAS...
- Publication number 20160322290
- Publication date Nov 3, 2016
- Intel Corporation
- Qing Ma
- H01 - BASIC ELECTRIC ELEMENTS

Manganese [Mn]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Low temperature bonded structures

Semiconductor device, manufacturing method, solid state image senso...

Resin molding, surface mounted light emitting apparatus and methods...

Low temperature bonded structures

Metal paste for joints, assembly, production method for assembly, s...

Semiconductor substrate having a bond pad material based on aluminum

Interconnection of copper surfaces using copper sintering material

Method of making a pillar structure having a non-metal sidewall pro...

Modulated inductance module

Resin molding, surface mounted light emitting apparatus and methods...

Semiconductor device, manufacturing method, solid state image senso...

Adhesive film for semiconductor, and semiconductor device

Semiconductor integrated circuit device

Low temperature bonded structures

Resin molding, surface mounted light emitting apparatus and methods...

Semiconductor device, manufacturing method, solid state image senso...

Etching solution for copper or copper alloy

Power management module and method of manufacture

White light devices using non-polar or semipolar gallium containing...

Semiconductor device

Hybrid bonding materials comprising ball grid arrays and metal inve...

Tooling for coupling multiple electronic chips

Semiconductor device, manufacturing method, solid state image senso...

Integrated fan-out package, integrated fan-out package array, and m...

Resin molding, surface mounted light emitting apparatus and methods...

Light emitting device and method for manufacturing light emitting d...

Conductive connecting member and manufacturing method of same

Cu pillar bump with L-shaped non-metal sidewall protection structure

Semiconductor device

Mixed alloy solder paste

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE INCLUDING REDISTRIBUTION STRUCTURE AND METHOD...

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD, SOLID STATE IMAGE SENSO...

LOW TEMPERATURE BONDED STRUCTURES

HEAT INSULATING INTERCONNECT FEATURES IN A COMPONENT OF A COMPOSITE...

INTERCONNECTION OF COPPER SURFACES USING COPPER SINTERING MATERIAL

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD, SOLID STATE IMAGE SENSO...

Semiconductor Substrate Having a Bond Pad Material Based on Aluminum

LOW TEMPERATURE BONDED STRUCTURES

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD, SOLID STATE IMAGE SENSO...

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING INTERLAYER...

METAL PASTE FOR JOINTS, ASSEMBLY, PRODUCTION METHOD FOR ASSEMBLY, S...

ADHESIVE FILM FOR SEMICONDUCTOR, AND SEMICONDUCTOR DEVICE

LOW TEMPERATURE BONDED STRUCTURES

HYBRID BONDING MATERIALS COMPRISING BALL GRID ARRAYS AND METAL INVE...

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD, SOLID STATE IMAGE SENSO...

SEMICONDUCTOR DEVICE

RESIN MOLDING, SURFACE MOUNTED LIGHT EMITTING APPARATUS AND METHODS...

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD, SOLID STATE IMAGE SENSO...

LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING LIGHT EMITTING D...

SEMICONDUCTOR DEVICE

TOOLING FOR COUPLING MULTIPLE ELECTRONIC CHIPS

METHOD FOR FORMING BUMP STRUCTURE

BONDING STRUCTURE AND METHOD

ELECTRONIC CIRCUIT PACKAGE

ELECTRONIC CIRCUIT PACKAGE

INTEGRATED FAN-OUT PACKAGE, INTEGRATED FAN-OUT PACKAGE ARRAY, AND M...

ELECTRONIC ELEMENT MOUNTING SUBSTRATE AND ELECTRONIC DEVICE

HYBRID BOND USING A COPPER ALLOY FOR YIELD IMPROVEMENT

EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND...

SUBSTRATE FOR INTEGRATED CIRCUIT DEVICES INCLUDING MULTI-LAYER GLAS...