Manufacture and pre-treatment of the bonding area preform

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H01L2224/031

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/031Manufacture and pre-treatment of the bonding area preform

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure and method for wafer scale chip package
- Patent number 12,125,811
- Issue date Oct 22, 2024
- Texas Instruments Incorporated
- Indumini W. Ranmuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for permanent connection of two metal surfaces
- Patent number 12,107,057
- Issue date Oct 1, 2024
- EV Group E. Thallner GmbH
- Viorel Dragoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including test pad and bonding pad structure...
- Patent number 12,094,844
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 11,935,871
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device structure
- Patent number 11,742,307
- Issue date Aug 29, 2023
- OVONYX MEMORY TECHNOLOGY, LLC
- John Moore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including test pad and bonding pad structure...
- Patent number 11,728,301
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-temperature superconducting striated tape combinations
- Patent number 11,711,983
- Issue date Jul 25, 2023
- The Government of the United States of America, as represented by the Secreta...
- Joseph C. Prestigiacomo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Additive manufacturing of a frontside or backside interconnect of a...
- Patent number 11,688,713
- Issue date Jun 27, 2023
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication of high-temperature superconducting striated tape combi...
- Patent number 11,600,762
- Issue date Mar 7, 2023
- The Government of the United States of America, as represented by the Secreta...
- Joseph C. Prestigiacomo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor component and manufacturing method thereof
- Patent number 11,424,204
- Issue date Aug 23, 2022
- Mediatek Inc.
- Po-Chao Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanowire bonding interconnect for fine-pitch microelectronics
- Patent number 11,387,202
- Issue date Jul 12, 2022
- Invensas LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional integrated stretchable electronics
- Patent number 11,375,895
- Issue date Jul 5, 2022
- The Regents of the University of California
- Sheng Xu
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Semiconductor package having a laser-activatable mold compound
- Patent number 11,289,436
- Issue date Mar 29, 2022
- Infineon Technologies Austria AG
- Chee Hong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for permanent connection of two metal surfaces
- Patent number 11,282,801
- Issue date Mar 22, 2022
- EV Group E. Thallner GmbH
- Viorel Dragoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device structure
- Patent number 11,264,344
- Issue date Mar 1, 2022
- OVONYX MEMORY TECHNOLOGY, LLC
- John Moore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, manufacturing method, and solid-state imaging...
- Patent number 11,018,110
- Issue date May 25, 2021
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Akiko Hirata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded semiconductor structure and method for forming the same
- Patent number 11,011,486
- Issue date May 18, 2021
- United Microelectronics Corp.
- Po-Yu Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die structure, die stack structure and method of fabricating the same
- Patent number 10,867,943
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device structure
- Patent number 10,756,036
- Issue date Aug 25, 2020
- OVONYX MEMORY TECHNOLOGY, LLC
- John Moore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit system with carrier construction configuration a...
- Patent number 10,679,954
- Issue date Jun 9, 2020
- EoPlex Limited
- David G. Love
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 10,658,272
- Issue date May 19, 2020
- Kabushiki Kaisha Toshiba
- Hiroaki Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor method for forming semiconductor structure having bum...
- Patent number 10,607,858
- Issue date Mar 31, 2020
- NANYA TECHNOLOGY CORPORATION
- Po-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging process
- Patent number 10,424,573
- Issue date Sep 24, 2019
- DELTA ELECTRONICS INT'L (SINGAPORE) PTE LTD
- Beng Beng Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper pillar bump structure and manufacturing method therefor
- Patent number 10,312,208
- Issue date Jun 4, 2019
- Semiconductor Manufacturing International (Shanghai) Corporation
- Xingtao Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having bump on tilting upper corner surface
- Patent number 10,290,512
- Issue date May 14, 2019
- NANYA TECHNOLOGY CORPORATION
- Po-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad protection for harsh media applications
- Patent number 10,262,897
- Issue date Apr 16, 2019
- Melexis Technologies NV
- Appolonius Jacobus Van Der Wiel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer substrate for forming metal wiring and method for forming...
- Patent number 10,256,113
- Issue date Apr 9, 2019
- Tanaka Kikinzoku Kogyo K.K.
- Toshinori Ogashiwa
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Thin NiB or CoB capping layer for non-noble metallic bonding landin...
- Patent number 10,066,303
- Issue date Sep 4, 2018
- Imec VZW
- Eric Beyne
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor memory device structure
- Patent number 9,966,349
- Issue date May 8, 2018
- OVONYX MEMORY TECHNOLOGY, LLC
- John Moore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 9,922,928
- Issue date Mar 20, 2018
- Renesas Electronics Corporation
- Takashi Tonegawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR PERMANENT CONNECTION OF TWO METAL SURFACES
- Publication number 20240421109
- Publication date Dec 19, 2024
- EV GROUP E. THALLNER GMBH
- Viorel Dragio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Including Test Pad and Bonding Pad Structure...
- Publication number 20240363565
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE FOR CONNECTING A CHIP AND A METAL MATERIAL AND MA...
- Publication number 20240304575
- Publication date Sep 12, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- ZZU-CHI CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
- Publication number 20240234375
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGES AND METHODS OF FORMATION
- Publication number 20240153895
- Publication date May 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Harry-HakLay CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS, IMAGE PICKUP UNIT, ENDOSCOPE, AND METHOD F...
- Publication number 20240088076
- Publication date Mar 14, 2024
- OLYMPUS CORPORATION
- Keiichi KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE FOR REDUCING WARPAGE OF PLASTIC PACKAGE WAFER AND...
- Publication number 20240071873
- Publication date Feb 29, 2024
- NATIONAL CENTER FOR ADVANCED PACKAGING CO., LTD.
- Liqiang CAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
- Publication number 20230378140
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Including Test Pad and Bonding Pad Structure...
- Publication number 20230343736
- Publication date Oct 26, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP PACKAGE ASSEMBLY
- Publication number 20230317658
- Publication date Oct 5, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Rafael Jose Lizares Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOWIRE BONDING INTERCONNECT FOR FINE-PITCH MICROELECTRONICS
- Publication number 20230105341
- Publication date Apr 6, 2023
- Invensas LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING TEST PAD AND BONDING PAD STRUCTURE...
- Publication number 20230060208
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20230060720
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods of Manufacture
- Publication number 20230061716
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yen-Kun Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE WITH CONDUCTIVE FEATURE AND METHOD OF FORMING SAME
- Publication number 20220208702
- Publication date Jun 30, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka UZOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE STRUCTURE
- Publication number 20220157753
- Publication date May 19, 2022
- Ovonyx Memory Technology, LLC
- John Moore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220013481
- Publication date Jan 13, 2022
- RENESAS ELECTRONICS CORPORATION
- Tatsuya USAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, PAD STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20210233822
- Publication date Jul 29, 2021
- Changxin Memory Technologies, Inc.
- Chih-Wei CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20210134747
- Publication date May 6, 2021
- UNITED MICROELECTRONICS CORP.
- Po-Yu Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPONENT AND MANUFACTURING METHOD THEREOF
- Publication number 20210050315
- Publication date Feb 18, 2021
- MEDIATEK INC.
- Po-Chao TSAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Having a Laser-Activatable Mold Compound
- Publication number 20200381380
- Publication date Dec 3, 2020
- Infineon Technologies Austria AG
- Chee Hong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE STRUCTURE
- Publication number 20200357761
- Publication date Nov 12, 2020
- Ovonyx Memory Technology, LLC
- John Moore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOWIRE BONDING INTERCONNECT FOR FINE-PITCH MICROELECTRONICS
- Publication number 20200279821
- Publication date Sep 3, 2020
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20200091044
- Publication date Mar 19, 2020
- Kabushiki Kaisha Toshiba
- Hiroaki TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD, AND SOLID-STATE IMAGING...
- Publication number 20200035643
- Publication date Jan 30, 2020
- Sony Semiconductor Solutions Corporation
- AKIKO HIRATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR WAFER SCALE CHIP PACKAGE
- Publication number 20190385962
- Publication date Dec 19, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Indumini W. Ranmuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE STRUCTURE, DIE STACK STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20190385963
- Publication date Dec 19, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE STRUCTURE
- Publication number 20190319001
- Publication date Oct 17, 2019
- Ovonyx Memory Technology, LLC
- John Moore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING PROCESS
- Publication number 20190304961
- Publication date Oct 3, 2019
- Delta Electronics Int'l (Singapore) Pte Ltd
- Beng Beng Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Precise Alignment and Decal Bonding of a Pattern of Solder Preforms...
- Publication number 20190184480
- Publication date Jun 20, 2019
- The Government of the United States of America, as represented by the Secreta...
- Raymond C.Y. Auyeung
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Manufacture and pre-treatment of the bonding area preform

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor structure and method for wafer scale chip package

Method for permanent connection of two metal surfaces

Semiconductor package including test pad and bonding pad structure...

Semiconductor package and method of fabricating the same

Semiconductor memory device structure

Semiconductor package including test pad and bonding pad structure...

High-temperature superconducting striated tape combinations

Additive manufacturing of a frontside or backside interconnect of a...

Fabrication of high-temperature superconducting striated tape combi...

Semiconductor component and manufacturing method thereof

Nanowire bonding interconnect for fine-pitch microelectronics

Three-dimensional integrated stretchable electronics

Semiconductor package having a laser-activatable mold compound

Method for permanent connection of two metal surfaces

Semiconductor memory device structure

Semiconductor device, manufacturing method, and solid-state imaging...

Bonded semiconductor structure and method for forming the same

Die structure, die stack structure and method of fabricating the same

Semiconductor memory device structure

Integrated circuit system with carrier construction configuration a...

Method for manufacturing semiconductor device

Semiconductor method for forming semiconductor structure having bum...

Packaging process

Copper pillar bump structure and manufacturing method therefor

Semiconductor structure having bump on tilting upper corner surface

Bond pad protection for harsh media applications

Transfer substrate for forming metal wiring and method for forming...

Thin NiB or CoB capping layer for non-noble metallic bonding landin...

Semiconductor memory device structure

Semiconductor device and method of manufacturing semiconductor device

Patents Applicationslast 30 patents

METHOD FOR PERMANENT CONNECTION OF TWO METAL SURFACES

Semiconductor Package Including Test Pad and Bonding Pad Structure...

BONDING STRUCTURE FOR CONNECTING A CHIP AND A METAL MATERIAL AND MA...

METHOD OF FABRICATING SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DIE PACKAGES AND METHODS OF FORMATION

SEMICONDUCTOR APPARATUS, IMAGE PICKUP UNIT, ENDOSCOPE, AND METHOD F...

PACKAGE STRUCTURE FOR REDUCING WARPAGE OF PLASTIC PACKAGE WAFER AND...

METHOD OF FABRICATING SEMICONDUCTOR PACKAGE

Semiconductor Package Including Test Pad and Bonding Pad Structure...

FLIP CHIP PACKAGE ASSEMBLY

NANOWIRE BONDING INTERCONNECT FOR FINE-PITCH MICROELECTRONICS

SEMICONDUCTOR PACKAGE INCLUDING TEST PAD AND BONDING PAD STRUCTURE...

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

Semiconductor Devices and Methods of Manufacture

STRUCTURE WITH CONDUCTIVE FEATURE AND METHOD OF FORMING SAME

SEMICONDUCTOR MEMORY DEVICE STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE, PAD STRUCTURE AND FABRICATION METHOD THEREOF

BONDED SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR COMPONENT AND MANUFACTURING METHOD THEREOF

Semiconductor Package Having a Laser-Activatable Mold Compound

SEMICONDUCTOR MEMORY DEVICE STRUCTURE

NANOWIRE BONDING INTERCONNECT FOR FINE-PITCH MICROELECTRONICS

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD, AND SOLID-STATE IMAGING...

SEMICONDUCTOR STRUCTURE AND METHOD FOR WAFER SCALE CHIP PACKAGE

DIE STRUCTURE, DIE STACK STRUCTURE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR MEMORY DEVICE STRUCTURE

PACKAGING PROCESS

Precise Alignment and Decal Bonding of a Pattern of Solder Preforms...