Manufacture insulated metal core circuits or other insulated electrically conductive core circuits

Industry

CPC
H05K3/44

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/44Manufacture insulated metal core circuits or other insulated electrically conductive core circuits

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Heat-dissipating circuit board, heat-dissipating member, and produc...
- Patent number 12,177,972
- Issue date Dec 24, 2024
- NOF Corporation
- Toshinobu Fujimura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of manufacturing a printed circuit board with a self-aligned...
- Patent number 12,170,165
- Issue date Dec 17, 2024
- Vicor Corporation
- Patrizio Vinciarelli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit structure
- Patent number 12,166,339
- Issue date Dec 10, 2024
- Autonetworks Technologies, Ltd.
- Akira Haraguchi
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Insulated circuit substrate manufacturing method
- Patent number 12,133,338
- Issue date Oct 29, 2024
- Mitsubishi Materials Corporation
- Yoshiaki Sakaniwa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method for double-sided wiring circuit board and doub...
- Patent number 12,114,438
- Issue date Oct 8, 2024
- Nitto Denko Corporation
- Shusaku Shibata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of insulated metal substrate
- Patent number 12,096,569
- Issue date Sep 17, 2024
- Jentech Precision Industrial Co., LTD.
- Chun-Ta Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-hole electrode substrate
- Patent number 12,080,637
- Issue date Sep 3, 2024
- Dai Nippon Printing Co., Ltd.
- Satoru Kuramochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring circuit board
- Patent number 12,035,484
- Issue date Jul 9, 2024
- Nitto Denko Corporation
- Kenya Takimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of forming interconnect circuits
- Patent number 11,979,976
- Issue date May 7, 2024
- CelLink Corporation
- Kevin Michael Coakley
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Manufacturing method of printed circuit board
- Patent number 11,641,719
- Issue date May 2, 2023
- SHENNAN CIRCUITS CO., LTD.
- Hegen Zhang
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method of manufacturing a self-aligned planar magnetic structure
- Patent number 11,640,873
- Issue date May 2, 2023
- Vicor Corporation
- Patrizio Vinciarelli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light- or heat-curing method and curable resin composition
- Patent number 11,548,984
- Issue date Jan 10, 2023
- FUJIFILM WAKO PURE CHEMICAL CORPORATION
- Tadashi Nakano
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Metal base circuit board and method of manufacturing the metal base...
- Patent number 11,490,513
- Issue date Nov 1, 2022
- NHK Spring Co., Ltd.
- Katsumi Mizuno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal substrate and method of manufacturing the same
- Patent number 11,483,934
- Issue date Oct 25, 2022
- AZOTEK CO., LTD.
- Hung-Jung Lee
- B32 - LAYERED PRODUCTS
Information Patent Grant
Insulated metal substrate
- Patent number 11,388,823
- Issue date Jul 12, 2022
- Jentech Precision Industrial Co., LTD.
- Chun-Ta Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric material change to optimize electrical and mechanical pr...
- Patent number 11,382,210
- Issue date Jul 5, 2022
- International Business Machines Corporation
- John R. Dangler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Through-hole electrode substrate
- Patent number 11,362,028
- Issue date Jun 14, 2022
- Dai Nippon Printing Co., Ltd.
- Satoru Kuramochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate, imaging unit and imaging device
- Patent number 11,343,907
- Issue date May 24, 2022
- Nikon Corporation
- Ryoichi Suganuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for a smart module directly embedded on a light...
- Patent number 11,320,126
- Issue date May 3, 2022
- Fluence Bioengineering, Inc.
- Dung Duong
- F21 - LIGHTING
Information Patent Grant
Component carrier and method of manufacturing the same
- Patent number 11,324,122
- Issue date May 3, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Heinz Moitzi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer laminate and method for producing multilayer printed wir...
- Patent number 11,285,700
- Issue date Mar 29, 2022
- Mitsui Mining & Smelting Co., Ltd.
- Yoshihiro Yoneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring circuit board, producing method thereof, and wiring circuit...
- Patent number 11,284,503
- Issue date Mar 22, 2022
- Nitto Denko Corporation
- Masaki Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of manufacturing a high impedance surface (HIS) enhanced by...
- Patent number 11,071,213
- Issue date Jul 20, 2021
- The Boeing Company
- Charles Muwonge
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer board and manufacturing method of the same
- Patent number 10,939,562
- Issue date Mar 2, 2021
- Taiyo Yuden Co., Ltd.
- Yuichi Sugiyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for lighting fixtures
- Patent number 10,914,462
- Issue date Feb 9, 2021
- Fluence Bioengineering, Inc.
- Dung Duong
- F21 - LIGHTING
Information Patent Grant
Printed circuit board for integrated LED driver
- Patent number 10,856,376
- Issue date Dec 1, 2020
- Lumileds LLC
- Zhihua Song
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for lighting fixtures
- Patent number 10,823,382
- Issue date Nov 3, 2020
- Fluence Bioengineering, Inc.
- Dung Duong
- F21 - LIGHTING
Information Patent Grant
Systems and methods for lighting fixtures
- Patent number 10,816,180
- Issue date Oct 27, 2020
- Fluence Bioengineering, Inc.
- Dung Duong
- F21 - LIGHTING
Information Patent Grant
Printed circuit board for integrated LED driver
- Patent number 10,813,182
- Issue date Oct 20, 2020
- Lumileds LLC
- Zhihua Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-hole electrode substrate
- Patent number 10,790,221
- Issue date Sep 29, 2020
- Dai Nippon Printing Co., Ltd.
- Satoru Kuramochi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THROUGH-HOLE ELECTRODE SUBSTRATE
- Publication number 20240404934
- Publication date Dec 5, 2024
- DAI NIPPON PRINTING CO., LTD.
- Satoru KURAMOCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE-ON-FOIL WITH METAL PATTERNED COMPONENTS FORMED THEREIN AN...
- Publication number 20240290708
- Publication date Aug 29, 2024
- LUX SEMICONDUCTORS, INC.
- Chad B. MOORE
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Interconnect Circuit Methods And Devices
- Publication number 20240276632
- Publication date Aug 15, 2024
- CelLink Corporation
- Kevin Michael Coakley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240276650
- Publication date Aug 15, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- Yu-Hsien LIAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT-DISSIPATING CIRCUIT BOARD, HEAT-DISSIPATING MEMBER, AND PRODUC...
- Publication number 20240268022
- Publication date Aug 8, 2024
- NOF Corporation
- Toshinobu FUJIMURA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for coating and forming novel material layer structure of hi...
- Publication number 20240244763
- Publication date Jul 18, 2024
- LongKai LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240244762
- Publication date Jul 18, 2024
- IBIDEN CO., LTD.
- Nobuhisa KURODA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING CIRCUIT BOARD
- Publication number 20240008178
- Publication date Jan 4, 2024
- Nitto Denko Corporation
- Shusaku SHIBATA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COOLING SYSTEM AND METHODS
- Publication number 20230422390
- Publication date Dec 28, 2023
- EvansWerks, Inc.
- SHUAIB BADAT
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT STRUCTURE
- Publication number 20230247788
- Publication date Aug 3, 2023
- AUTONETWORKS TECHNOLOGIES, LTD.
- Akira Haraguchi
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
INSULATED CIRCUIT SUBSTRATE MANUFACTURING METHOD
- Publication number 20230127557
- Publication date Apr 27, 2023
- MITSUBISHI MATERIALS CORPORATION
- Yoshiaki Sakaniwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT STRUCTURE
- Publication number 20230113728
- Publication date Apr 13, 2023
- AUTONETWORKS TECHNOLOGIES, LTD.
- Akira Haraguchi
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
MANUFACTURING METHOD FOR DOUBLE-SIDED WIRING CIRCUIT BOARD AND DOUB...
- Publication number 20230008736
- Publication date Jan 12, 2023
- Nitto Denko Corporation
- Shusaku SHIBATA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME
- Publication number 20230009006
- Publication date Jan 12, 2023
- Nitto Denko Corporation
- Masaki ITO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20220408563
- Publication date Dec 22, 2022
- Kuan-Yu Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for coating and forming novel material layer structure of hi...
- Publication number 20220304165
- Publication date Sep 22, 2022
- LongKai LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INSULATION LAYER FORMATION METHOD, MEMBER WITH INSULATION LAYER, RE...
- Publication number 20220251712
- Publication date Aug 11, 2022
- NEXT INNOVATION INC.
- Hiroshi Michiwaki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
WIRING CIRCUIT BOARD
- Publication number 20220256712
- Publication date Aug 11, 2022
- Nitto Denko Corporation
- Kenya TAKIMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THROUGH-HOLE ELECTRODE SUBSTRATE
- Publication number 20220246512
- Publication date Aug 4, 2022
- DAI NIPPON PRINTING CO., LTD.
- Satoru KURAMOCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPENING DETECTION SHEET, PACKAGING MATERIAL, OPENING DETECTION DEVI...
- Publication number 20220242640
- Publication date Aug 4, 2022
- UACJ FOIL CORPORATION
- Hisaya Kato
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
DIELECTRIC MATERIAL CHANGE TO OPTIMIZE ELECTRICAL AND MECHANICAL PR...
- Publication number 20220201839
- Publication date Jun 23, 2022
- International Business Machines Corporation
- John R. Dangler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING CIRCUIT BOARD
- Publication number 20220201871
- Publication date Jun 23, 2022
- Nitto Denko Corporation
- Kenya TAKIMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER-CLAD LAMINATE AND METHOD OF FORMING THE SAME
- Publication number 20220039256
- Publication date Feb 3, 2022
- SAINT-GOBAIN PERFORMANCE PLASTICS CORPORATION
- Jennifer ADAMCHUK
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
WIRING CIRCUIT BOARD, PRODUCING METHOD THEREOF, AND WIRING CIRCUIT...
- Publication number 20210212196
- Publication date Jul 8, 2021
- Nitto Denko Corporation
- Masaki ITO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF PRINTED CIRCUIT BOARD
- Publication number 20210204413
- Publication date Jul 1, 2021
- SHENNAN CIRCUITS CO., LTD.
- Hegen ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier and Method of Manufacturing the Same
- Publication number 20210112666
- Publication date Apr 15, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Heinz Moitzi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF MANUFACTURING A HIGH IMPEDANCE SURFACE (HIS) ENHANCED BY...
- Publication number 20210029836
- Publication date Jan 28, 2021
- The Boeing Company
- Charles Muwonge
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THROUGH-HOLE ELECTRODE SUBSTRATE
- Publication number 20200357733
- Publication date Nov 12, 2020
- DAI NIPPON PRINTING CO., LTD.
- Satoru KURAMOCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Systems and Methods for a Smart Module Directly Embedded on a Light...
- Publication number 20200332991
- Publication date Oct 22, 2020
- Fluence Bioengineering, Inc.
- Dung Duong
- F21 - LIGHTING
Information Patent Application
MULTILAYER BOARD AND MANUFACTURING METHOD OF THE SAME
- Publication number 20200315032
- Publication date Oct 1, 2020
- Taiyo Yuden Co., Ltd.
- Yuichi SUGIYAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Manufacture insulated metal core circuits or other insulated electrically conductive core circuits

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Heat-dissipating circuit board, heat-dissipating member, and produc...

Method of manufacturing a printed circuit board with a self-aligned...

Circuit structure

Insulated circuit substrate manufacturing method

Manufacturing method for double-sided wiring circuit board and doub...

Manufacturing method of insulated metal substrate

Through-hole electrode substrate

Wiring circuit board

Methods of forming interconnect circuits

Manufacturing method of printed circuit board

Method of manufacturing a self-aligned planar magnetic structure

Light- or heat-curing method and curable resin composition

Metal base circuit board and method of manufacturing the metal base...

Metal substrate and method of manufacturing the same

Insulated metal substrate

Dielectric material change to optimize electrical and mechanical pr...

Through-hole electrode substrate

Substrate, imaging unit and imaging device

Systems and methods for a smart module directly embedded on a light...

Component carrier and method of manufacturing the same

Multilayer laminate and method for producing multilayer printed wir...

Wiring circuit board, producing method thereof, and wiring circuit...

Methods of manufacturing a high impedance surface (HIS) enhanced by...

Multilayer board and manufacturing method of the same

Systems and methods for lighting fixtures

Printed circuit board for integrated LED driver

Systems and methods for lighting fixtures

Systems and methods for lighting fixtures

Printed circuit board for integrated LED driver

Through-hole electrode substrate

Patents Applicationslast 30 patents

THROUGH-HOLE ELECTRODE SUBSTRATE

SUBSTRATE-ON-FOIL WITH METAL PATTERNED COMPONENTS FORMED THEREIN AN...

Interconnect Circuit Methods And Devices

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

HEAT-DISSIPATING CIRCUIT BOARD, HEAT-DISSIPATING MEMBER, AND PRODUC...

Method for coating and forming novel material layer structure of hi...

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

WIRING CIRCUIT BOARD

COOLING SYSTEM AND METHODS

CIRCUIT STRUCTURE

INSULATED CIRCUIT SUBSTRATE MANUFACTURING METHOD

CIRCUIT STRUCTURE

MANUFACTURING METHOD FOR DOUBLE-SIDED WIRING CIRCUIT BOARD AND DOUB...

WIRING CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

Method for coating and forming novel material layer structure of hi...

INSULATION LAYER FORMATION METHOD, MEMBER WITH INSULATION LAYER, RE...

WIRING CIRCUIT BOARD

THROUGH-HOLE ELECTRODE SUBSTRATE

OPENING DETECTION SHEET, PACKAGING MATERIAL, OPENING DETECTION DEVI...

DIELECTRIC MATERIAL CHANGE TO OPTIMIZE ELECTRICAL AND MECHANICAL PR...

WIRING CIRCUIT BOARD

COPPER-CLAD LAMINATE AND METHOD OF FORMING THE SAME

WIRING CIRCUIT BOARD, PRODUCING METHOD THEREOF, AND WIRING CIRCUIT...

MANUFACTURING METHOD OF PRINTED CIRCUIT BOARD

Component Carrier and Method of Manufacturing the Same

METHODS OF MANUFACTURING A HIGH IMPEDANCE SURFACE (HIS) ENHANCED BY...

THROUGH-HOLE ELECTRODE SUBSTRATE

Systems and Methods for a Smart Module Directly Embedded on a Light...

MULTILAYER BOARD AND MANUFACTURING METHOD OF THE SAME