Manufacturing multilayer circuits

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CPC
H05K3/46

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/46Manufacturing multilayer circuits

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Non-planar antennas for portable storage devices
- Patent number 12,369,279
- Issue date Jul 22, 2025
- Western Digital Technologies, Inc.
- Aadesh Gupta
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Patterned conductive article
- Patent number 12,363,825
- Issue date Jul 15, 2025
- 3M Innovative Properties Company
- Raymond P. Johnston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board module and manufacturing method thereof
- Patent number 12,363,834
- Issue date Jul 15, 2025
- LEOTEK CORPORATION
- Cheng-Ta Tsai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component-incorporated substrate and method for manufacturing same
- Patent number 12,356,556
- Issue date Jul 8, 2025
- Fujikura Ltd.
- Masahiro Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing wiring substrate
- Patent number 12,356,557
- Issue date Jul 8, 2025
- Ibiden Co., Ltd.
- Keisuke Shimizu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electronic assembly having circuit carrier
- Patent number 12,356,558
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun-Yi Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminated assembly comprising radio-frequency interface board
- Patent number 12,356,539
- Issue date Jul 8, 2025
- AGC GLASS EUROPE
- Mohsen Yousefbeiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package, electronic structure and manufacturing method t...
- Patent number 12,354,885
- Issue date Jul 8, 2025
- Siliconware Precision Industries Co., Ltd.
- Yi-Ling Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Recyclable electronic device
- Patent number 12,349,286
- Issue date Jul 1, 2025
- Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Stephan Harkema
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus, system, and method for achieving certain characteristics...
- Patent number 12,349,267
- Issue date Jul 1, 2025
- Juniper Networks, Inc.
- Dylan G. Rust-Nguyen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board including a core layer provided with plurality of ins...
- Patent number 12,349,288
- Issue date Jul 1, 2025
- LG Innotek Co., Ltd
- Myung Jae Kwon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component and method for manufacturing electronic component
- Patent number 12,342,471
- Issue date Jun 24, 2025
- Murata Manufacturing Co., Ltd.
- Hirofumi Oie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a printed circuit board, and printed circuit b...
- Patent number 12,342,466
- Issue date Jun 24, 2025
- UNIMICRON GERMANY GMBH
- Oliver Holz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods to fill through-holes of a substrate with metal paste
- Patent number 12,342,470
- Issue date Jun 24, 2025
- Reophotonics, Ltd.
- Michael Zenou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Customized thermal pathways in a PCB
- Patent number 12,342,474
- Issue date Jun 24, 2025
- Todd Robinson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method of producing wiring board
- Patent number 12,342,473
- Issue date Jun 24, 2025
- TOPPAN INC.
- Takeshi Tamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate unit and substrate assembly, and camera module using same
- Patent number 12,342,475
- Issue date Jun 24, 2025
- LG Innotek Co., Ltd
- Hyun Woo Ryou
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Prepregs and laminates having a UV curable resin layer
- Patent number 12,336,103
- Issue date Jun 17, 2025
- Isola USA Corp.
- Roland Schönholz
- B32 - LAYERED PRODUCTS
Information Patent Grant
Multilayer board and method of manufacturing the same
- Patent number 12,336,093
- Issue date Jun 17, 2025
- Murata Manufacturing Co., Ltd.
- Kosuke Nishio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and method for manufacturing wiring substrate
- Patent number 12,336,095
- Issue date Jun 17, 2025
- Ibiden Co., Ltd.
- Toshiki Furutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing circuit board
- Patent number 12,328,828
- Issue date Jun 10, 2025
- Unimicron Technology Corp.
- Chun-Hung Kuo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connection structure and connection structure manufacturing method
- Patent number 12,324,098
- Issue date Jun 3, 2025
- Murata Manufacturing Co., Ltd.
- Yuma Otsuka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Maleimide resin composition, prepreg, resin film, laminated board,...
- Patent number 12,324,105
- Issue date Jun 3, 2025
- Resonac Corporation
- Chihiro Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive film and flexible printed circuit board
- Patent number 12,312,510
- Issue date May 27, 2025
- MEKTEC CORPORATION
- Hisae Oba
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Laminated wiring board
- Patent number 12,317,426
- Issue date May 27, 2025
- Shinko Electric Industries Co., Ltd.
- Shota Miki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
UV curable dielectric materials for 3D printing and 3D printing sys...
- Patent number 12,317,427
- Issue date May 27, 2025
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Tianzhu Fan
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Insulating layer for multilayer printed circuit board, multilayer p...
- Patent number 12,313,973
- Issue date May 27, 2025
- LG Chem, Ltd.
- Jeong Wook Mun
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Wiring substrate
- Patent number 12,309,920
- Issue date May 20, 2025
- Ibiden Co., Ltd.
- Shogo Fukui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 12,309,941
- Issue date May 20, 2025
- LG Innotek Co., Ltd
- Se Woong Na
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting of capacitors on printed circuit boards for non-volatile m...
- Patent number 12,309,942
- Issue date May 20, 2025
- SanDisk Technologies, Inc.
- Uthayarajan A L Rasalingam
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POWER DELIVERY SYSTEM FOR HIGH DENSITY SIGNALING AND HIGH POWER DEL...
- Publication number 20250240870
- Publication date Jul 24, 2025
- Cisco Technology, Inc.
- Wenbin Ma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER SUBSTRATE AND METHOD FOR MANUFACTURING MULTILAYER SUBSTRATE
- Publication number 20250240874
- Publication date Jul 24, 2025
- Murata Manufacturing Co., Ltd.
- Ryutatsu MIZUKAMI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250240889
- Publication date Jul 24, 2025
- Unimicron Technology Corp.
- Chin-Sheng Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF ELECTRONIC DEVICE
- Publication number 20250240898
- Publication date Jul 24, 2025
- InnoLux Corporation
- Chun-Hung CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICES, SYSTEMS, AND METHODS FOR MAKING AND USING A FLUID-FILLABLE...
- Publication number 20250240879
- Publication date Jul 24, 2025
- Liquid Wire Inc.
- Jorge E. Carbo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PREPREG, LAMINATE, AND PRODUCTION METHODS THEREFOR, AS WELL AS PRIN...
- Publication number 20250234456
- Publication date Jul 17, 2025
- Resonac Corporation
- Mari SHIMIZU
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
METHOD FOR PRODUCING PRINTED WIRING BOARD WITH BUILT-IN CAPACITOR A...
- Publication number 20250227856
- Publication date Jul 10, 2025
- Mitsui Mining and Smelting Co., Ltd.
- Yoshihiro YONEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COVERLAY AS PRINTED CIRCUIT BOARD (PCB) VOLTAGE INSULATOR UNDER CON...
- Publication number 20250227854
- Publication date Jul 10, 2025
- HAMILTON SUNDSTRAND CORPORATION
- Robert C. Cooney
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF CIRCUIT CARRIER
- Publication number 20250227857
- Publication date Jul 10, 2025
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Embedding a Component in a Printed Circuit Board
- Publication number 20250227850
- Publication date Jul 10, 2025
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Timo Schwarz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE HAVING THE SAME
- Publication number 20250218913
- Publication date Jul 3, 2025
- LG Innotek Co., Ltd.
- Su Min LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low Sheet Resistance Coating
- Publication number 20250220824
- Publication date Jul 3, 2025
- Vitro Flat Glass LLC
- Zhixun Ma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RIGID-FLEXIBLE PRINTED CIRCUIT BOARD AND PREPARATION METHOND THEREFOR
- Publication number 20250220825
- Publication date Jul 3, 2025
- TRIPLE WIN TECHNOLOGY (SHENZHEN) CO.LTD.
- YUN-YEN LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PASSIVE COMPONENT ASSEMBLY FOR THICKNESS MODIFICATION TO MATCH CORE...
- Publication number 20250218999
- Publication date Jul 3, 2025
- Intel Corporation
- Bohan SHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND SEMICONDUCTOR DEVICE
- Publication number 20250221079
- Publication date Jul 3, 2025
- KYOCERA CORPORATION
- Yuhei MATSUMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC SUBSTRATE AND METHOD FOR MANUFACTURING CERAMIC SUBSTRATE
- Publication number 20250214324
- Publication date Jul 3, 2025
- Murata Manufacturing Co., Ltd.
- Atsushi KISHIMOTO
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
PRINTED CIRCUIT BOARD WITH A BUILT-IN VAPOR CHAMBER
- Publication number 20250212312
- Publication date Jun 26, 2025
- Intel Corporation
- Jose DIAZ MARIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYER LINE STRUCTURE
- Publication number 20250210524
- Publication date Jun 26, 2025
- DAI NIPPON PRINTING CO., LTD.
- Hiroshi Kudo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE SUBSTRATE AND CARRIER PLATE WIRING STRUCTURE WITH FILTER...
- Publication number 20250212337
- Publication date Jun 26, 2025
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20250203767
- Publication date Jun 19, 2025
- IBIDEN CO., LTD.
- Jun SAKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250203785
- Publication date Jun 19, 2025
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- CHUNG-HO WEI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMAGE SENSOR PACKAGE AND CAMERA DEVICE COMPRISING SAME
- Publication number 20250203181
- Publication date Jun 19, 2025
- LG Innotek Co., Ltd.
- Seong Su EOM
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
FLEXIBLE CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME
- Publication number 20250203763
- Publication date Jun 19, 2025
- Heraeus Medevio GmbH & Co. KG
- Ilias NIKOLAIDIS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD, METAL-CERAMIC SUBSTRATE AS AN INSERT, AND ME...
- Publication number 20250203752
- Publication date Jun 19, 2025
- Rogers Germany GmbH
- Andreas Meyer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING A CARRIER ARRANGEMENT
- Publication number 20250203764
- Publication date Jun 19, 2025
- Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung e.V.
- Mathias Bottcher
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT CARRIER AND METHOD FOR MANUFACTURING A COMPONENT CARRIER
- Publication number 20250194018
- Publication date Jun 12, 2025
- AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT
- Daniel SCHLICK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME
- Publication number 20250185160
- Publication date Jun 5, 2025
- LG Innotek Co., Ltd.
- Myung Jae KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RIGID-FLEXIBLE PCB, POWER MODULE INCLUDING THE PCB, AND MANUFACTURI...
- Publication number 20250176113
- Publication date May 29, 2025
- STMicroelectronics International N.V.
- Luciano ZIZZA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICROFLUIDIC PRINTED CIRCUIT BOARD COOLING
- Publication number 20250176095
- Publication date May 29, 2025
- Microsoft Technology Licensing, LLC
- Shubhangi TEWARI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flexible Interconnect Circuits for Battery Packs
- Publication number 20250176112
- Publication date May 29, 2025
- CelLink Corporation
- Jean-Paul Ortiz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Manufacturing multilayer circuits

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Non-planar antennas for portable storage devices

Patterned conductive article

Circuit board module and manufacturing method thereof

Component-incorporated substrate and method for manufacturing same

Method for manufacturing wiring substrate

Electronic assembly having circuit carrier

Laminated assembly comprising radio-frequency interface board

Electronic package, electronic structure and manufacturing method t...

Recyclable electronic device

Apparatus, system, and method for achieving certain characteristics...

Circuit board including a core layer provided with plurality of ins...

Electronic component and method for manufacturing electronic component

Method for producing a printed circuit board, and printed circuit b...

Methods to fill through-holes of a substrate with metal paste

Customized thermal pathways in a PCB

Wiring board and method of producing wiring board

Substrate unit and substrate assembly, and camera module using same

Prepregs and laminates having a UV curable resin layer

Multilayer board and method of manufacturing the same

Wiring substrate and method for manufacturing wiring substrate

Method for manufacturing circuit board

Connection structure and connection structure manufacturing method

Maleimide resin composition, prepreg, resin film, laminated board,...

Adhesive film and flexible printed circuit board

Laminated wiring board

UV curable dielectric materials for 3D printing and 3D printing sys...

Insulating layer for multilayer printed circuit board, multilayer p...

Wiring substrate

Circuit board

Mounting of capacitors on printed circuit boards for non-volatile m...

Patents Applicationslast 30 patents

POWER DELIVERY SYSTEM FOR HIGH DENSITY SIGNALING AND HIGH POWER DEL...

MULTILAYER SUBSTRATE AND METHOD FOR MANUFACTURING MULTILAYER SUBSTRATE

SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF

MANUFACTURING METHOD OF ELECTRONIC DEVICE

DEVICES, SYSTEMS, AND METHODS FOR MAKING AND USING A FLUID-FILLABLE...

PREPREG, LAMINATE, AND PRODUCTION METHODS THEREFOR, AS WELL AS PRIN...

METHOD FOR PRODUCING PRINTED WIRING BOARD WITH BUILT-IN CAPACITOR A...

COVERLAY AS PRINTED CIRCUIT BOARD (PCB) VOLTAGE INSULATOR UNDER CON...

MANUFACTURING METHOD OF CIRCUIT CARRIER

Method for Embedding a Component in a Printed Circuit Board

CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE HAVING THE SAME

Low Sheet Resistance Coating

RIGID-FLEXIBLE PRINTED CIRCUIT BOARD AND PREPARATION METHOND THEREFOR

PASSIVE COMPONENT ASSEMBLY FOR THICKNESS MODIFICATION TO MATCH CORE...

WIRING BOARD AND SEMICONDUCTOR DEVICE

CERAMIC SUBSTRATE AND METHOD FOR MANUFACTURING CERAMIC SUBSTRATE

PRINTED CIRCUIT BOARD WITH A BUILT-IN VAPOR CHAMBER

MULTI-LAYER LINE STRUCTURE

CONDUCTIVE SUBSTRATE AND CARRIER PLATE WIRING STRUCTURE WITH FILTER...

PRINTED WIRING BOARD

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

IMAGE SENSOR PACKAGE AND CAMERA DEVICE COMPRISING SAME

FLEXIBLE CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME

PRINTED CIRCUIT BOARD, METAL-CERAMIC SUBSTRATE AS AN INSERT, AND ME...

METHOD FOR PRODUCING A CARRIER ARRANGEMENT

COMPONENT CARRIER AND METHOD FOR MANUFACTURING A COMPONENT CARRIER

CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME

RIGID-FLEXIBLE PCB, POWER MODULE INCLUDING THE PCB, AND MANUFACTURI...

MICROFLUIDIC PRINTED CIRCUIT BOARD COOLING

Flexible Interconnect Circuits for Battery Packs