Manufacturing multilayer circuits

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CPC
H05K3/46

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/46Manufacturing multilayer circuits

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing component carrier and component carrier int...
- Patent number 12,262,482
- Issue date Mar 25, 2025
- AT&SAustria Technologie & Systemtechnik Aktiengesellschaft
- Marco Gavagnin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Active antenna module using printed circuit board technology
- Patent number 12,262,473
- Issue date Mar 25, 2025
- ALTUM RF IP B.V.
- Niels Kramer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer line structure
- Patent number 12,255,145
- Issue date Mar 18, 2025
- Dai Nippon Printing Co., Ltd.
- Hiroshi Kudo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Prepreg, laminate, and production methods therefor, as well as prin...
- Patent number 12,256,490
- Issue date Mar 18, 2025
- Resonac Corporation
- Mari Shimizu
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Hybrid boards with embedded planes
- Patent number 12,256,487
- Issue date Mar 18, 2025
- Intel Corporation
- Jackson Chung Peng Kong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 12,256,501
- Issue date Mar 18, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- In Gun Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic element mounting substrate and electronic device
- Patent number 12,249,546
- Issue date Mar 11, 2025
- Kyocera Corporation
- Sadamu Kajisa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board
- Patent number 12,245,366
- Issue date Mar 4, 2025
- Kyocera Corporation
- Hidetoshi Yugawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Current sensing device
- Patent number 12,241,914
- Issue date Mar 4, 2025
- Koa Corporation
- Miyahito Kinoshita
- G01 - MEASURING TESTING
Information Patent Grant
Information handling system and peripheral printed circuit board ha...
- Patent number 12,245,372
- Issue date Mar 4, 2025
- Dell Products L.P.
- Peng Lip Goh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of preparing a high density interconnect printed circuit boa...
- Patent number 12,245,383
- Issue date Mar 4, 2025
- Atotech Deutschland GmbH & Co. KG
- Bert Reents
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Composite printed wiring board and method of manufacturing composit...
- Patent number 12,238,861
- Issue date Feb 25, 2025
- Mitsubishi Electric Corporation
- Tatsuya Sakamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing component embedded circuit board
- Patent number 12,238,871
- Issue date Feb 25, 2025
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Yong-Chao Wei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method for manufacturing the same
- Patent number 12,238,852
- Issue date Feb 25, 2025
- Avary Holding (Shenzhen) Co., Limited.
- Ying Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Additive manufacturing process of 3D electronic substrate
- Patent number 12,226,822
- Issue date Feb 18, 2025
- Schlumberger Technology Corporation
- Steven O. Dunford
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Component carriers connected by staggered interconnect elements
- Patent number 12,232,263
- Issue date Feb 18, 2025
- AT&SAustria Technologie & Systemtechnik Aktiengesellschaft
- Abderrazzaq Ifis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and manufacturing method thereof
- Patent number 12,232,254
- Issue date Feb 18, 2025
- Unimicron Technology Corporation
- Po-Hsiang Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and method for manufacturing wiring substrate
- Patent number 12,232,268
- Issue date Feb 18, 2025
- Ibiden Co., Ltd.
- Hirotaka Taniguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component and method for producing electronic component
- Patent number 12,224,097
- Issue date Feb 11, 2025
- Murata Manufacturing Co., Ltd.
- Kouhei Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board assembly for blocking unwanted light, camera module,...
- Patent number 12,225,660
- Issue date Feb 11, 2025
- TRIPLE WIN TECHNOLOGY(SHENZHEN) CO. LTD.
- Ying-Lin Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Component carrier
- Patent number 12,219,701
- Issue date Feb 4, 2025
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Abderrazzaq Ifis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible devices incorporating electronically-conductive layers, in...
- Patent number 12,216,010
- Issue date Feb 4, 2025
- The University Court of the University of Edinburgh
- Philip James Walton Hands
- G01 - MEASURING TESTING
Information Patent Grant
Printed circuit board and package substrate including same
- Patent number 12,211,781
- Issue date Jan 28, 2025
- LG Innotek Co., Ltd
- Se Woong Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacture for embedded IC chip directly connected to PCB
- Patent number 12,213,258
- Issue date Jan 28, 2025
- AVERATEK CORPORATION
- Haris Basit
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier having a double dielectric layer and method of ma...
- Patent number 12,207,399
- Issue date Jan 21, 2025
- AT&S (Chongqing) Company Limited
- Jeesoo Mok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package device
- Patent number 12,200,857
- Issue date Jan 14, 2025
- Innolux Corporation
- Yeong-E Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component-containing substrate
- Patent number 12,200,871
- Issue date Jan 14, 2025
- Shinko Electric Industries Co., Ltd.
- Takao Koshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fluoroscopic imaging-compatible and X-ray dose reducing electromagn...
- Patent number 12,193,169
- Issue date Jan 7, 2025
- RadWave Technologies Inc.
- Lev Koyrakh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board, circuit board connection structure, and method of ma...
- Patent number 12,191,549
- Issue date Jan 7, 2025
- Murata Manufacturing Co., Ltd.
- Kentarou Kawabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer body
- Patent number 12,193,153
- Issue date Jan 7, 2025
- Mitsui Mining & Smelting Co., Ltd.
- Rintaro Ishii
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250106992
- Publication date Mar 27, 2025
- InnoLux Corporation
- Chen-Kuan KAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS AND APPARATUS TO MANAGE NOISE FOR TIMING CIRCUITRY
- Publication number 20250107003
- Publication date Mar 27, 2025
- Intel Corporation
- Chin Mian Choong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT CARRIER AND METHOD
- Publication number 20250106993
- Publication date Mar 27, 2025
- Vitesco Technologies GMBH
- Detlev BAGUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COATED ELECTRICAL ASSEMBLY
- Publication number 20250098077
- Publication date Mar 20, 2025
- HZO, Inc.
- Gianfranco Aresta
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CHIP PACKAGE WITH EMBEDDED AND SHIELDED INDUCTORS
- Publication number 20250096089
- Publication date Mar 20, 2025
- ADVANCED MICRO DEVICES, INC.
- Robert Grant SPURNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Increasing Skin Depth and Reducing Eddy Cu...
- Publication number 20250087483
- Publication date Mar 13, 2025
- Atlas Magnetics
- John Othniel McDonald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES AND METHODS RELATED TO METALLIZATION OF CERAMIC SUBSTRATES...
- Publication number 20250089154
- Publication date Mar 13, 2025
- Skyworks Solutions, Inc.
- Shaul BRANCHEVSKY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CATHETER SPLINES WITH EMBEDDED CIRCUIT ELEMENTS
- Publication number 20250082220
- Publication date Mar 13, 2025
- BIOSENSE WEBSTER (ISRAEL) LTD.
- Assaf Govari
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250089164
- Publication date Mar 13, 2025
- InnoLux Corporation
- Cheng-Chi WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
GENERATION OF RANDOM SECURITY CIRCUIT PATTERNS FOR IN-SITU FABRICAT...
- Publication number 20250089174
- Publication date Mar 13, 2025
- International Business Machines Corporation
- Hongqing ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250081338
- Publication date Mar 6, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Sang Ho JEONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYER ELECTRICAL STRUCTURES
- Publication number 20250081339
- Publication date Mar 6, 2025
- Qorvo US, Inc.
- Jerry Holt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20250081358
- Publication date Mar 6, 2025
- Shinko Electric Industries Co., Ltd.
- Takashi NISHIYAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BRIDGE PRINTED CIRCUIT BOARD EMBEDDED WITHIN ANOTHER PRINTED CIRCUI...
- Publication number 20250081348
- Publication date Mar 6, 2025
- Intel Corporation
- Arumanayagam RAJASEKAR
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE INCLUDING FLEXIBLE CIRCUIT BOARD
- Publication number 20250081360
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Youngsun LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND LAMINATED WIRING BOARD
- Publication number 20250081329
- Publication date Mar 6, 2025
- Shinko Electric Industries Co., Ltd.
- Yoshihiro Kobayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FIELD DEVICE TRANSMITTER HOUSING
- Publication number 20250081359
- Publication date Mar 6, 2025
- Endress + Hauser Flowtec AG
- Robert Lalla
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250071912
- Publication date Feb 27, 2025
- InnoLux Corporation
- Ming-Chih TSAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SHEET FIXING DEVICE, SHEET PEELING DEVICE, AND SHEET PEELING METHOD
- Publication number 20250065617
- Publication date Feb 27, 2025
- Mitsui Mining and Smelting Co., Ltd.
- Takenori YANAI
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD OF MANUFACTURING CIRCUIT BOARD
- Publication number 20250071909
- Publication date Feb 27, 2025
- HAESUNG DS CO., LTD.
- Soon-Chul KWON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER SUBSTRATE AND JIG
- Publication number 20250063660
- Publication date Feb 20, 2025
- NIDEC ADVANCE TECHNOLOGY CORPORATION
- Shigeki SAKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20250056721
- Publication date Feb 13, 2025
- HongQiSheng Precision Electronics (QinHuangdao) Co., Ltd.
- Cheng-Jia LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE CIRCUIT BOARD AND METHOD FOR FABRICATING THE SAME
- Publication number 20250056715
- Publication date Feb 13, 2025
- HongQiSheng Precision Electronics (QinHuangdao) Co., Ltd.
- Chao WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH-INTEGRATION-LEVEL CARRIER PLATE AND MANUFACTURING METHOD
- Publication number 20250056722
- Publication date Feb 13, 2025
- SHANGHAI METAPWR ELECTRONICS CO., LTD
- Shouyu Hong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20250048557
- Publication date Feb 6, 2025
- LG Innotek Co., Ltd.
- Soo Min LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD AND MULTIL...
- Publication number 20250040059
- Publication date Jan 30, 2025
- Panasonic Intellectual Property Management Co., Ltd.
- Tomoyuki KAWAHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH-PRECISION MULTILAYER PRINTED CIRCUIT BOARD AND 3D PRINTING PRE...
- Publication number 20250040060
- Publication date Jan 30, 2025
- enovate3D (Hangzhou) Technology Development Co., Ltd.
- Wangcan Cai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF PACKAGE CARRIER
- Publication number 20250040026
- Publication date Jan 30, 2025
- Unimicron Technology Corp.
- Ming-Hao Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITIVE ELEMENT, CIRCUIT CARRIER HAVING THE SAME AND FABRICATION...
- Publication number 20250040051
- Publication date Jan 30, 2025
- Unimicron Technology Corp.
- Chun Hung KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF FRONT-END FUNCTIONALITY INTEGRATED IN A COMPONENT CARRIER STACK
- Publication number 20250040028
- Publication date Jan 30, 2025
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Patrick LENHARDT
- H01 - BASIC ELECTRIC ELEMENTS

Manufacturing multilayer circuits

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of manufacturing component carrier and component carrier int...

Active antenna module using printed circuit board technology

Multi-layer line structure

Prepreg, laminate, and production methods therefor, as well as prin...

Hybrid boards with embedded planes

Printed circuit board

Electronic element mounting substrate and electronic device

Wiring board

Current sensing device

Information handling system and peripheral printed circuit board ha...

Method of preparing a high density interconnect printed circuit boa...

Composite printed wiring board and method of manufacturing composit...

Method for manufacturing component embedded circuit board

Circuit board and method for manufacturing the same

Additive manufacturing process of 3D electronic substrate

Component carriers connected by staggered interconnect elements

Printed circuit board and manufacturing method thereof

Wiring substrate and method for manufacturing wiring substrate

Electronic component and method for producing electronic component

Circuit board assembly for blocking unwanted light, camera module,...

Component carrier

Flexible devices incorporating electronically-conductive layers, in...

Printed circuit board and package substrate including same

Method of manufacture for embedded IC chip directly connected to PCB

Component carrier having a double dielectric layer and method of ma...

Package device

Component-containing substrate

Fluoroscopic imaging-compatible and X-ray dose reducing electromagn...

Circuit board, circuit board connection structure, and method of ma...

Multilayer body

Patents Applicationslast 30 patents

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

METHODS AND APPARATUS TO MANAGE NOISE FOR TIMING CIRCUITRY

CIRCUIT CARRIER AND METHOD

COATED ELECTRICAL ASSEMBLY

CHIP PACKAGE WITH EMBEDDED AND SHIELDED INDUCTORS

Method and Apparatus for Increasing Skin Depth and Reducing Eddy Cu...

DEVICES AND METHODS RELATED TO METALLIZATION OF CERAMIC SUBSTRATES...

CATHETER SPLINES WITH EMBEDDED CIRCUIT ELEMENTS

ELECTRONIC DEVICE

GENERATION OF RANDOM SECURITY CIRCUIT PATTERNS FOR IN-SITU FABRICAT...

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

MULTI-LAYER ELECTRICAL STRUCTURES

WIRING BOARD

BRIDGE PRINTED CIRCUIT BOARD EMBEDDED WITHIN ANOTHER PRINTED CIRCUI...

ELECTRONIC DEVICE INCLUDING FLEXIBLE CIRCUIT BOARD

WIRING BOARD AND LAMINATED WIRING BOARD

FIELD DEVICE TRANSMITTER HOUSING

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

SHEET FIXING DEVICE, SHEET PEELING DEVICE, AND SHEET PEELING METHOD

METHOD OF MANUFACTURING CIRCUIT BOARD

MULTILAYER SUBSTRATE AND JIG

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

FLEXIBLE CIRCUIT BOARD AND METHOD FOR FABRICATING THE SAME

HIGH-INTEGRATION-LEVEL CARRIER PLATE AND MANUFACTURING METHOD

CIRCUIT BOARD

METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD AND MULTIL...

HIGH-PRECISION MULTILAYER PRINTED CIRCUIT BOARD AND 3D PRINTING PRE...

MANUFACTURING METHOD OF PACKAGE CARRIER

CAPACITIVE ELEMENT, CIRCUIT CARRIER HAVING THE SAME AND FABRICATION...

RF FRONT-END FUNCTIONALITY INTEGRATED IN A COMPONENT CARRIER STACK