Manufacturing multilayer circuits

Industry

CPC
H05K3/46

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/46Manufacturing multilayer circuits

Industries

Patents Grantslast 30 patents

Information Patent Grant
Package device
- Patent number 12,200,857
- Issue date Jan 14, 2025
- Innolux Corporation
- Yeong-E Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component-containing substrate
- Patent number 12,200,871
- Issue date Jan 14, 2025
- Shinko Electric Industries Co., Ltd.
- Takao Koshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board, circuit board connection structure, and method of ma...
- Patent number 12,191,549
- Issue date Jan 7, 2025
- Murata Manufacturing Co., Ltd.
- Kentarou Kawabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluoroscopic imaging-compatible and X-ray dose reducing electromagn...
- Patent number 12,193,169
- Issue date Jan 7, 2025
- RadWave Technologies Inc.
- Lev Koyrakh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer body
- Patent number 12,193,153
- Issue date Jan 7, 2025
- Mitsui Mining & Smelting Co., Ltd.
- Rintaro Ishii
- B32 - LAYERED PRODUCTS
Information Patent Grant
Circuit board with rigid portion and flexible portion having connec...
- Patent number 12,185,456
- Issue date Dec 31, 2024
- First Hi-tec Enterprise Co., Ltd.
- Min-Lin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitive compensation for vertical interconnect accesses
- Patent number 12,185,462
- Issue date Dec 31, 2024
- Achronix Semiconductor Corporation
- Hansel Desmond Dsilva
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Ceramic laminated substrate, module, and method of manufacturing ce...
- Patent number 12,183,666
- Issue date Dec 31, 2024
- Murata Manufacturing Co., Ltd.
- Takuya Goitsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 12,185,461
- Issue date Dec 31, 2024
- Innolux Corporation
- Cheng-Chi Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
RF absorbing structures
- Patent number 12,185,453
- Issue date Dec 31, 2024
- Pivotal Commware, Inc.
- Jay Howard McCandless
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring circuit board and method of producing the same
- Patent number 12,185,463
- Issue date Dec 31, 2024
- Nitto Denko Corporation
- Kanayo Sawashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board having embedded component
- Patent number 12,185,478
- Issue date Dec 31, 2024
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald Weidinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedded printed circuit board
- Patent number 12,185,470
- Issue date Dec 31, 2024
- Shinko Electric Industries Co., Ltd.
- Yukinori Hatori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible circuit board and manufacturing method thereof
- Patent number 12,185,479
- Issue date Dec 31, 2024
- Unimicron Technology Corp.
- Cheng-Ta Ko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper-clad laminate and method of forming the same
- Patent number 12,173,201
- Issue date Dec 24, 2024
- VERSIV COMPOSITES LIMITED
- Jennifer Adamchuk
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Circuit board
- Patent number 12,177,978
- Issue date Dec 24, 2024
- Toppan Printing Co., Ltd.
- Jun Onohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transformer guard trace
- Patent number 12,176,285
- Issue date Dec 24, 2024
- Texas Instruments Incorporated
- Vijaylaxmi Gumaste Khanolkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a printed circuit board with a self-aligned...
- Patent number 12,170,165
- Issue date Dec 17, 2024
- Vicor Corporation
- Patrizio Vinciarelli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing printed wiring board
- Patent number 12,171,067
- Issue date Dec 17, 2024
- Mitsui Mining & Smelting Co., Ltd.
- Yoshinori Shimizu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Manufacturing method for pcb with thermal conductor embedded therei...
- Patent number 12,171,057
- Issue date Dec 17, 2024
- SHENGYI ELECTRONICS CO., LTD.
- Lu Xiao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer substrate
- Patent number 12,167,545
- Issue date Dec 10, 2024
- Murata Manufacturing Co., Ltd.
- Takayuki Shimamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure and manufacturing method thereof
- Patent number 12,160,953
- Issue date Dec 3, 2024
- Unimicron Technology Corp.
- Kai-Ming Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Providing a lower inductance path in a routing substrate for a capa...
- Patent number 12,160,952
- Issue date Dec 3, 2024
- QUALCOMM Incorporated
- Biancun Xie
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for manufacturing wiring board
- Patent number 12,160,949
- Issue date Dec 3, 2024
- FUJIFILM Corporation
- Genya Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High frequency filter
- Patent number 12,160,217
- Issue date Dec 3, 2024
- Mitsubishi Electric Corporation
- Motomi Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Catheter splines with embedded circuit elements
- Patent number 12,150,751
- Issue date Nov 26, 2024
- BIOSENSE WEBSTER (ISRAEL) LTD.
- Assaf Govari
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing photoelectric composite circuit board
- Patent number 12,153,252
- Issue date Nov 26, 2024
- Avary Holding (Shenzhen) Co., Limited.
- Wei-Liang Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package carrier with improved heat dissipation efficiency and manuf...
- Patent number 12,156,325
- Issue date Nov 26, 2024
- Unimicron Technology Corp.
- Ming-Hao Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded circuit board and manufacturing method thereof
- Patent number 12,156,348
- Issue date Nov 26, 2024
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Cheng-Yi Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System for providing dynamic feedback for selective adhesion PCB pr...
- Patent number 12,150,248
- Issue date Nov 19, 2024
- Honeywell Federal Manufacturing & Technologies, LLC
- Jonathan Douglas Hatch
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ENHANCED MICROSTRIP TRACE
- Publication number 20250024586
- Publication date Jan 16, 2025
- Dell Products L.P.
- Sandor FARKAS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR POWER ENTITY AND METHOD FOR PRODUCING SUCH ENTITY BY...
- Publication number 20250022840
- Publication date Jan 16, 2025
- Huawei Digital Power Technologies Co., Ltd.
- Lasse Petteri PALM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH ELECTRODE SUBSTRATE AND MOUNTING SUBSTRATE
- Publication number 20250014979
- Publication date Jan 9, 2025
- DAI NIPPON PRINTING CO., LTD.
- Shinji MAEKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20250016909
- Publication date Jan 9, 2025
- Sumitomo Electric Industries, Ltd.
- Shun IGARASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250016921
- Publication date Jan 9, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Sang Ho JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF FABRICATING ELECTRONIC DEVICE
- Publication number 20250016926
- Publication date Jan 9, 2025
- BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Huiying Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PATTERNED ARTICLE INCLUDING ELECTRICALLY CONDUCTIVE ELEMENTS
- Publication number 20250016916
- Publication date Jan 9, 2025
- 3M Innovative Properties Company
- Raymond P. Johnston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR A LOW-PROFILE RECTIFIER FOR EV WIRELESS CHA...
- Publication number 20250016935
- Publication date Jan 9, 2025
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Yanghe Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CROSSTALK NOISE REDUCTION BY HIGH PERMEABILITY INSULATOR
- Publication number 20250006647
- Publication date Jan 2, 2025
- International Business Machines Corporation
- Hiroyuki Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20250008645
- Publication date Jan 2, 2025
- IBIDEN CO., LTD.
- Youhong WU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTING OF MULTILAYER CIRCUITS ON GRAPHICS
- Publication number 20240431038
- Publication date Dec 26, 2024
- Jabil Inc.
- Sai Guruva Reddy Avuthu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DESIGN OF A RECYCLABLE ELECTRONIC DEVICE
- Publication number 20240431037
- Publication date Dec 26, 2024
- NEDERLANDSE ORGANISATIE VOOR TOEGEPAST- NATUURWETENSCHAPPELIJK ONDERZOEK TNO
- Stephan HARKEMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ENVIRONMENTALLY FRIENDLY MULTI-LAYER PRINTED CIRCUIT BOARD
- Publication number 20240422899
- Publication date Dec 19, 2024
- Intel Corporation
- Srinivas B REDDY
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier With Continuously Extending Vertical Connection S...
- Publication number 20240422907
- Publication date Dec 19, 2024
- AT&S Austria Technologie & Systemtechnik AG
- Markus LEITGEB
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240422901
- Publication date Dec 19, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Jae Heun LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit board
- Publication number 20240422920
- Publication date Dec 19, 2024
- Avary Holding (Shenzhen) Co., Limited.
- WEN-ZHU WEI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRAL ELECTRONIC STACK
- Publication number 20240414845
- Publication date Dec 12, 2024
- 3M Innovative Properties Company
- Jeongwan Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Catalyzed Metal Foil and Uses Thereof
- Publication number 20240407106
- Publication date Dec 5, 2024
- Averatek Corporation
- Shinichi Iketani
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20240407099
- Publication date Dec 5, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Sang Hyun Jin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
X-Y SHIELDING OF SIGNAL PATHS WITHIN PCBS
- Publication number 20240407105
- Publication date Dec 5, 2024
- International Business Machines Corporation
- Kyle Indukummar Giesen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING STRUCTURE, METHOD FOR MANUFACTURING SAME, AND SEMICONDUCTOR...
- Publication number 20240397635
- Publication date Nov 28, 2024
- Resonac Corporation
- Masaya TOBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR INTEGRATING A COPPER-GRAPHENE LAMINATE (CGL) IN A MULTIL...
- Publication number 20240397636
- Publication date Nov 28, 2024
- NVIDIA Corporation
- Oren STEINBERG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, MULTIL...
- Publication number 20240393686
- Publication date Nov 28, 2024
- Resonac Corporation
- Hideyuki KATAGI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BURIED SKIP VIAS FOR IMPROVED SIGNAL AND POWER INTEGRITY
- Publication number 20240389230
- Publication date Nov 21, 2024
- NVIDIA Corporation
- Mingyi Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRETCHABLE AND FLEXIBLE METAL FILM STRUCTURES
- Publication number 20240389225
- Publication date Nov 21, 2024
- Liquid Wire Inc.
- Trevor Antonio Rivera
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240389241
- Publication date Nov 21, 2024
- DAEDUCK ELECTRONICS CO., LTD.
- Min-Geun JUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240389231
- Publication date Nov 21, 2024
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE LAMINATE MATERIAL
- Publication number 20240381528
- Publication date Nov 14, 2024
- THE CHEMOURS COMPANY FC, LLC
- RONG LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKA...
- Publication number 20240381529
- Publication date Nov 14, 2024
- Resonac Corporation
- Shunsuke OTAKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME
- Publication number 20240373554
- Publication date Nov 7, 2024
- LG Innotek Co., Ltd.
- Jae Man BAE
- H01 - BASIC ELECTRIC ELEMENTS

Manufacturing multilayer circuits

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Package device

Component-containing substrate

Circuit board, circuit board connection structure, and method of ma...

Fluoroscopic imaging-compatible and X-ray dose reducing electromagn...

Multilayer body

Circuit board with rigid portion and flexible portion having connec...

Capacitive compensation for vertical interconnect accesses

Ceramic laminated substrate, module, and method of manufacturing ce...

Electronic device

RF absorbing structures

Wiring circuit board and method of producing the same

Printed circuit board having embedded component

Embedded printed circuit board

Flexible circuit board and manufacturing method thereof

Copper-clad laminate and method of forming the same

Circuit board

Transformer guard trace

Method of manufacturing a printed circuit board with a self-aligned...

Method of manufacturing printed wiring board

Manufacturing method for pcb with thermal conductor embedded therei...

Multilayer substrate

Circuit board structure and manufacturing method thereof

Providing a lower inductance path in a routing substrate for a capa...

Wiring board and method for manufacturing wiring board

High frequency filter

Catheter splines with embedded circuit elements

Method for manufacturing photoelectric composite circuit board

Package carrier with improved heat dissipation efficiency and manuf...

Embedded circuit board and manufacturing method thereof

System for providing dynamic feedback for selective adhesion PCB pr...

Patents Applicationslast 30 patents

ENHANCED MICROSTRIP TRACE

SEMICONDUCTOR POWER ENTITY AND METHOD FOR PRODUCING SUCH ENTITY BY...

THROUGH ELECTRODE SUBSTRATE AND MOUNTING SUBSTRATE

PRINTED WIRING BOARD

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC DEVICE AND METHOD OF FABRICATING ELECTRONIC DEVICE

PATTERNED ARTICLE INCLUDING ELECTRICALLY CONDUCTIVE ELEMENTS

SYSTEMS AND METHODS FOR A LOW-PROFILE RECTIFIER FOR EV WIRELESS CHA...

CROSSTALK NOISE REDUCTION BY HIGH PERMEABILITY INSULATOR

PRINTED WIRING BOARD

PRINTING OF MULTILAYER CIRCUITS ON GRAPHICS

DESIGN OF A RECYCLABLE ELECTRONIC DEVICE

ENVIRONMENTALLY FRIENDLY MULTI-LAYER PRINTED CIRCUIT BOARD

Component Carrier With Continuously Extending Vertical Connection S...

PRINTED CIRCUIT BOARD

Circuit board

INTEGRAL ELECTRONIC STACK

Catalyzed Metal Foil and Uses Thereof

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

X-Y SHIELDING OF SIGNAL PATHS WITHIN PCBS

WIRING STRUCTURE, METHOD FOR MANUFACTURING SAME, AND SEMICONDUCTOR...

METHOD FOR INTEGRATING A COPPER-GRAPHENE LAMINATE (CGL) IN A MULTIL...

PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, MULTIL...

BURIED SKIP VIAS FOR IMPROVED SIGNAL AND POWER INTEGRITY

STRETCHABLE AND FLEXIBLE METAL FILM STRUCTURES

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

PRINTED WIRING BOARD

FLEXIBLE LAMINATE MATERIAL

METHOD FOR MANUFACTURING SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKA...

CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME