Marks applied to semiconductor devices or parts

Industry

CPC
H01L23/544

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/544Marks applied to semiconductor devices or parts

Industries

Patents Grantslast 30 patents

Information Patent Grant
Reducing device overlay errors
- Patent number 11,971,664
- Issue date Apr 30, 2024
- KLA-Tencor Corporation
- Liran Yerushalmi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus with circuit-locating mechanism
- Patent number 11,967,390
- Issue date Apr 23, 2024
- Micron Technology, Inc.
- Itamar Lavy
- G11 - INFORMATION STORAGE
Information Patent Grant
Method for producing overlay results with absolute reference for se...
- Patent number 11,966,171
- Issue date Apr 23, 2024
- Tokyo Electron Limited
- Anton J. deVilliers
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Organic light emitting display device including dam structure and a...
- Patent number 11,968,860
- Issue date Apr 23, 2024
- LG Display Co., Ltd.
- Dongjin Kim
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Display substrate, manufacturing method thereof, and display apparatus
- Patent number 11,968,879
- Issue date Apr 23, 2024
- BOE Technology Group Co., Ltd.
- Yunlong Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 11,967,564
- Issue date Apr 23, 2024
- Denso Corporation
- Aiko Kaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
On-product overlay targets
- Patent number 11,967,535
- Issue date Apr 23, 2024
- KLA Corporation
- Amnon Manassen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel, manufacturing method thereof, and display device
- Patent number 11,957,033
- Issue date Apr 9, 2024
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Huijuan Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assemblies with system and methods for aligning dies...
- Patent number 11,955,461
- Issue date Apr 9, 2024
- Micron Technology, Inc.
- Shiro Uchiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming package structure
- Patent number 11,951,571
- Issue date Apr 9, 2024
- Integrated Silicon Solution Inc.
- Cheng-Fu Yu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for III-v/silicon hybrid integration
- Patent number 11,953,728
- Issue date Apr 9, 2024
- Rockley Photonics Limited
- Guomin Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 11,955,435
- Issue date Apr 9, 2024
- SK hynix Inc.
- Ki Yong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 11,948,896
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation scheme design for wafer singulation
- Patent number 11,942,436
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of forming the same
- Patent number 11,942,451
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Mao-Yen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Overlay alignment mark and method for measuring overlay error
- Patent number 11,934,109
- Issue date Mar 19, 2024
- Zhongke Jingyuan Electron Limited, Beijing (CN)
- Weimin Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die and manufacturing method of semiconductor device
- Patent number 11,935,788
- Issue date Mar 19, 2024
- United Microelectronics Corp.
- Po-Yu Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate assembly
- Patent number 11,935,487
- Issue date Mar 19, 2024
- Innolux Corporation
- Kuan-Feng Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and system for fabricating fiducials using selective area gr...
- Patent number 11,935,838
- Issue date Mar 19, 2024
- NEXGEN POWER SYSTEMS, INC.
- Clifford Drowley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside metal patterning die singulation system and related methods
- Patent number 11,929,285
- Issue date Mar 12, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroplating apparatus and electroplating method
- Patent number 11,926,920
- Issue date Mar 12, 2024
- ACM RESEARCH (SHANGHAI), INC.
- Zhaowei Jia
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of manufacturing semiconductor package
- Patent number 11,923,318
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Hsien Chiang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Photomask, display device, and manufacturing method thereof
- Patent number 11,923,383
- Issue date Mar 5, 2024
- Samsung Display Co., Ltd.
- Dong Hee Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices
- Patent number 11,923,317
- Issue date Mar 5, 2024
- Samsung Electronics Co., Ltd.
- Changjoon Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Storage system, memory chip unit, and wafer
- Patent number 11,923,325
- Issue date Mar 5, 2024
- Kioxia Corporation
- Yasuhito Yoshimizu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor integrated fluxgate device shielded by discrete magne...
- Patent number 11,921,134
- Issue date Mar 5, 2024
- Texas Instruments Incorporated
- Dok Won Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device having information code on a lateral side of display...
- Patent number 11,923,316
- Issue date Mar 5, 2024
- Samsung Display Co., Ltd.
- Sun Kwun Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing
- Patent number 11,916,031
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photolithography alignment process for bonded wafers
- Patent number 11,916,022
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yeong-Jyh Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a chip package
- Patent number 11,908,692
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED STEALTH LASER FOR WAFER EDGE TRIMMING PROCESS
- Publication number 20240136174
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Tung Wu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
OVERLAY MARK FORMING MOIRE PATTERN, OVERLAY MEASUREMENT METHOD USIN...
- Publication number 20240136300
- Publication date Apr 25, 2024
- AUROS TECHNOLOGY, INC.
- Hyun Chul LEE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR WAFER, PROCESSING APPARATUS FOR OVERLAY SHIFT AND PRO...
- Publication number 20240134291
- Publication date Apr 25, 2024
- WINBOND ELECTRONICS CORP.
- Meng-Hsien TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO DEVICE ARRANGEMENT IN DONOR SUBSTRATE
- Publication number 20240133940
- Publication date Apr 25, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER ALIGNMENT STRUCTURE
- Publication number 20240136303
- Publication date Apr 25, 2024
- Tesla, Inc.
- Yong guo Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240136301
- Publication date Apr 25, 2024
- Power Master Semiconductor Co., Ltd.
- Sangwoo PAK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240136302
- Publication date Apr 25, 2024
- RENESAS ELECTRONICS CORPORATION
- Ryusei TAKAISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESOURCE MANAGEMENT WITH TIME AND EXPENSE TRACKING
- Publication number 20240128115
- Publication date Apr 18, 2024
- VueReal Inc.
- Heidi Elizabeth Bailey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240128135
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd.
- GYOSOO CHOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING AND PACKAGING
- Publication number 20240128199
- Publication date Apr 18, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Jane Qian Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND A CONNE...
- Publication number 20240128165
- Publication date Apr 18, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER INCLUDING ALIGNMENT KEY PATTERN LAYER INCLUDING...
- Publication number 20240128198
- Publication date Apr 18, 2024
- SK HYNIX INC.
- Heon Yong CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Carbon Assisted Semiconductor Dicing And Method
- Publication number 20240120284
- Publication date Apr 11, 2024
- ThinSiC Inc.
- Tirunelveli Subramaniam Ravi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240120199
- Publication date Apr 11, 2024
- Samsung Electronics Co., Ltd.
- So Young LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFFSET ALIGNMENT AND REPAIR IN MICRO DEVICE TRANSFER
- Publication number 20240120231
- Publication date Apr 11, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE HAVING A DIE POSITION MARK AND A SEMICONDUCTOR DIE STACK...
- Publication number 20240120285
- Publication date Apr 11, 2024
- SK HYNIX INC.
- Bok Gyu MIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OVERLAY MARK, MANUFACTURING METHOD USING THE SAME, AND SEMICONDUCTO...
- Publication number 20240120287
- Publication date Apr 11, 2024
- Samsung Electronics Co., Ltd.
- Sang Won PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME
- Publication number 20240120291
- Publication date Apr 11, 2024
- STATS ChipPAC Pte Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE HAVING AN OPTICAL DETECTION MARKER AND METHOD OF...
- Publication number 20240120298
- Publication date Apr 11, 2024
- Dietrich Bonart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH METAL LAYERS
- Publication number 20240120332
- Publication date Apr 11, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE, POWER SEMICONDUCTOR DEVICE AND METHOD F...
- Publication number 20240120255
- Publication date Apr 11, 2024
- Hitachi Energy Switzerland AG
- Dominik TRUESSEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240120286
- Publication date Apr 11, 2024
- Samsung Electronics Co., Ltd.
- Hyeonseok LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTRA-BONDING SEMICONDUCTOR INTEGRATED CIRCUIT CHIPS
- Publication number 20240113076
- Publication date Apr 4, 2024
- International Business Machines Corporation
- Frank Robert Libsch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE AND TRANSISTOR
- Publication number 20240113231
- Publication date Apr 4, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE DIE REINFORCED GALVANIC ISOLATION DEVICE
- Publication number 20240113042
- Publication date Apr 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Jeffrey Alan West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING SEMICONDUCTOR PACKAGE
- Publication number 20240113034
- Publication date Apr 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALLIC CHIPCARD
- Publication number 20240111981
- Publication date Apr 4, 2024
- IDEMIA France
- Ahmed ALI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE, BASE-SIDE SEMICONDUCTOR CHIP, AND BONDING-SID...
- Publication number 20240113035
- Publication date Apr 4, 2024
- LAPIS Technology Co., Ltd.
- JUNICHI IKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240105634
- Publication date Mar 28, 2024
- WINBOND ELECTRONICS CORP.
- Chang-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNMENT LAYER WITH LOW-K MATERIAL PROXIMATE TO VIAS
- Publication number 20240105635
- Publication date Mar 28, 2024
- Intel Corporation
- Abhishek Anil Sharma
- H01 - BASIC ELECTRIC ELEMENTS

Marks applied to semiconductor devices or parts

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Reducing device overlay errors

Apparatus with circuit-locating mechanism

Method for producing overlay results with absolute reference for se...

Organic light emitting display device including dam structure and a...

Display substrate, manufacturing method thereof, and display apparatus

Method for manufacturing semiconductor device

On-product overlay targets

Display panel, manufacturing method thereof, and display device

Semiconductor assemblies with system and methods for aligning dies...

Method of forming package structure

Method for III-v/silicon hybrid integration

Semiconductor packages

Package structure

Passivation scheme design for wafer singulation

Semiconductor structure and method of forming the same

Overlay alignment mark and method for measuring overlay error

Semiconductor die and manufacturing method of semiconductor device

Substrate assembly

Method and system for fabricating fiducials using selective area gr...

Backside metal patterning die singulation system and related methods

Electroplating apparatus and electroplating method

Method of manufacturing semiconductor package

Photomask, display device, and manufacturing method thereof

Semiconductor devices

Storage system, memory chip unit, and wafer

Semiconductor integrated fluxgate device shielded by discrete magne...

Display device having information code on a lateral side of display...

Semiconductor device and method of manufacturing

Photolithography alignment process for bonded wafers

Method for fabricating a chip package

Patents Applicationslast 30 patents

INTEGRATED STEALTH LASER FOR WAFER EDGE TRIMMING PROCESS

OVERLAY MARK FORMING MOIRE PATTERN, OVERLAY MEASUREMENT METHOD USIN...

SEMICONDUCTOR WAFER, PROCESSING APPARATUS FOR OVERLAY SHIFT AND PRO...

MICRO DEVICE ARRANGEMENT IN DONOR SUBSTRATE

WAFER ALIGNMENT STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

RESOURCE MANAGEMENT WITH TIME AND EXPENSE TRACKING

SEMICONDUCTOR DEVICE

SUBSTRATE PROCESSING AND PACKAGING

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND A CONNE...

SEMICONDUCTOR WAFER INCLUDING ALIGNMENT KEY PATTERN LAYER INCLUDING...

Carbon Assisted Semiconductor Dicing And Method

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

OFFSET ALIGNMENT AND REPAIR IN MICRO DEVICE TRANSFER

SUBSTRATE HAVING A DIE POSITION MARK AND A SEMICONDUCTOR DIE STACK...

OVERLAY MARK, MANUFACTURING METHOD USING THE SAME, AND SEMICONDUCTO...

SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME

SEMICONDUCTOR DIE HAVING AN OPTICAL DETECTION MARKER AND METHOD OF...

3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH METAL LAYERS

POWER SEMICONDUCTOR MODULE, POWER SEMICONDUCTOR DEVICE AND METHOD F...

SEMICONDUCTOR PACKAGE

INTRA-BONDING SEMICONDUCTOR INTEGRATED CIRCUIT CHIPS

COMPOSITE AND TRANSISTOR

SINGLE DIE REINFORCED GALVANIC ISOLATION DEVICE

METHODS FOR FORMING SEMICONDUCTOR PACKAGE

METALLIC CHIPCARD

SEMICONDUCTOR DEVICE, BASE-SIDE SEMICONDUCTOR CHIP, AND BONDING-SID...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SELF-ALIGNMENT LAYER WITH LOW-K MATERIAL PROXIMATE TO VIAS