Material of the auxiliary connecting means

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CPC
H01L2224/40499

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/40499Material of the auxiliary connecting means

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Leadframe package with adjustable clip
- Patent number 12,046,540
- Issue date Jul 23, 2024
- Infineon Technologies AG
- Christian Feuerbaum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,040,301
- Issue date Jul 16, 2024
- Rohm Co., Ltd.
- Katsuhiko Yoshihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and electronic device
- Patent number 12,033,922
- Issue date Jul 9, 2024
- Denso Corporation
- Akihiro Fukatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,676,931
- Issue date Jun 13, 2023
- JMJ KOREA CO., LTD.
- Yun Hwa Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of making the same
- Patent number 11,557,530
- Issue date Jan 17, 2023
- Semiconductor Components Industries, LLC
- Swee Har Khor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for die and clip attachment
- Patent number 11,289,447
- Issue date Mar 29, 2022
- Alpha Assembly Solutions, Inc.
- Oscar Khaselev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,270,969
- Issue date Mar 8, 2022
- JMJ KOREA CO., LTD.
- Yun Hwa Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked transistor assembly with dual middle mounting clips
- Patent number 11,075,148
- Issue date Jul 27, 2021
- Semiconductor Components Industries, LLC
- Jeffrey Peter Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for electrically contacting a component by galvanic connecti...
- Patent number 11,037,862
- Issue date Jun 15, 2021
- Siemens Aktiengesellschaft
- Hubert Baueregger
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Solid top terminal for discrete power devices
- Patent number 10,872,846
- Issue date Dec 22, 2020
- RENESAS ELECTRONICS AMERICA INC.
- Jean Claude Harel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of making the same
- Patent number 10,727,170
- Issue date Jul 28, 2020
- Semiconductor Components Industries, LLC
- Swee Har Khor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with vertical interconnect between carrier and clip
- Patent number 10,707,158
- Issue date Jul 7, 2020
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module
- Patent number 10,559,538
- Issue date Feb 11, 2020
- Mitsubishi Electric Corporation
- Junji Fujino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating stack die package
- Patent number 10,546,840
- Issue date Jan 28, 2020
- Vishay SIliconix, LLC
- Kyle Terrill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module
- Patent number 10,510,636
- Issue date Dec 17, 2019
- Shindengen Electric Manufacturing Co., Ltd.
- Kosuke Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of making the same
- Patent number 10,490,488
- Issue date Nov 26, 2019
- Semiconductor Components Industries, LLC
- Roger M. Arbuthnot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and conductive member for semiconductor module...
- Patent number 10,475,667
- Issue date Nov 12, 2019
- Mitsubishi Electric Corporation
- Masakazu Tani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier and clip each having sinterable, solidified paste for conne...
- Patent number 10,347,566
- Issue date Jul 9, 2019
- Heraeus Deutschland GmbH & Co. KG
- Michael Benedikt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of making the same
- Patent number 10,325,835
- Issue date Jun 18, 2019
- Semiconductor Components Industries, LLC
- Roger M. Arbuthnot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, and alternator and power conversion device wh...
- Patent number 10,319,849
- Issue date Jun 11, 2019
- Hitachi Power Semiconductor Device, Ltd.
- Tetsuya Ishimaru
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Die package component with jumper structure
- Patent number 10,312,183
- Issue date Jun 4, 2019
- Taiwan Semiconductor Co., Ltd.
- Reyn Qin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die package component with jumper structure and manufacturing metho...
- Patent number 10,297,535
- Issue date May 21, 2019
- Taiwan Semiconductor Co., Ltd.
- Reyn Qin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clip and related methods
- Patent number 10,121,763
- Issue date Nov 6, 2018
- Semiconductor Components Industries, LLC
- Chee Hiong Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,109,611
- Issue date Oct 23, 2018
- Rohm Co., Ltd.
- Mamoru Yamagami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Arrangement of multiple power semiconductor chips and method of man...
- Patent number 10,049,962
- Issue date Aug 14, 2018
- Infineon Technologies AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,028,400
- Issue date Jul 17, 2018
- Fuji Electric Co., Ltd.
- Shin Soyano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clip and related methods
- Patent number 9,911,712
- Issue date Mar 6, 2018
- Semiconductor Components Industries, LLC
- Chee Hiong Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having multiple contact clips
- Patent number 9,837,380
- Issue date Dec 5, 2017
- Infineon Technologies Austria AG
- Tian San Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,831,212
- Issue date Nov 28, 2017
- Rohm Co., Ltd.
- Mamoru Yamagami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging solutions for devices and systems comprising lateral GaN...
- Patent number 9,824,949
- Issue date Nov 21, 2017
- GaN Systems Inc.
- Cameron McKnight-MacNeil
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240321813
- Publication date Sep 26, 2024
- Kabushiki Kaisha Toshiba
- Syotaro Ono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240282692
- Publication date Aug 22, 2024
- ROHM CO., LTD.
- Yo MOCHIZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240282744
- Publication date Aug 22, 2024
- Fuji Electric Co., Ltd.
- Takafumi YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER STRUCTURE WITH DISRUPTABLE COATING AS SOLDER SPREADING PROTE...
- Publication number 20240274563
- Publication date Aug 15, 2024
- INFINEON TECHNOLOGIES AG
- Hock Heng CHONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND POWER CONVERTING DEVICE
- Publication number 20240274557
- Publication date Aug 15, 2024
- Mitsubishi Electric Corporation
- Yo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINGERPRINT SENSOR PACKAGE AND SMART CARD HAVING THE SAME
- Publication number 20240105703
- Publication date Mar 28, 2024
- Samsung Electronics Co., Ltd.
- Jaehyun Lim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Two-In-One Lead Frame Package
- Publication number 20240071878
- Publication date Feb 29, 2024
- Littelfuse Semiconductor (Wuxi) Co., Ltd
- Lei Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240014193
- Publication date Jan 11, 2024
- Rohm Co., Ltd.
- Hiroto SAKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230411338
- Publication date Dec 21, 2023
- Rohm Co., Ltd.
- Takukazu OTSUKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...
- Publication number 20230369279
- Publication date Nov 16, 2023
- STMicroelectronics S.r.l
- Thomas GOTTARDI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL PCB FOR TOPSIDE POWER DELIVERY
- Publication number 20230317706
- Publication date Oct 5, 2023
- Intel Corporation
- Kyle ARRINGTON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH BACKSIDE LEAD FOR CLOCK TREE OR POW...
- Publication number 20230290765
- Publication date Sep 14, 2023
- MICROCHIP TECHNOLOGY INCORPORATED
- Justin Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20230268311
- Publication date Aug 24, 2023
- Rohm Co., Ltd.
- Koshun SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20230245954
- Publication date Aug 3, 2023
- Rohm Co., Ltd.
- Koshun SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE
- Publication number 20230223441
- Publication date Jul 13, 2023
- Fuji Electric Co., Ltd.
- Hayato NAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND JIG SET
- Publication number 20230154889
- Publication date May 18, 2023
- Fuji Electric Co., Ltd.
- Manabu ISHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230078259
- Publication date Mar 16, 2023
- Kabushiki Kaisha Toshiba
- Yuchen HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing Power Semiconductor Module and Power Semicondu...
- Publication number 20220406679
- Publication date Dec 22, 2022
- Huawei Digital Power Technologies Co., Ltd.
- Ruoyang Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220148998
- Publication date May 12, 2022
- JMJ KOREA CO., LTD.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210407954
- Publication date Dec 30, 2021
- Rohm Co., Ltd.
- Katsuhiko YOSHIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED TRANSISTOR ASSEMBLY WITH DUAL MIDDLE MOUNTING CLIPS
- Publication number 20210111106
- Publication date Apr 15, 2021
- Semiconductor Components Industries, LLC
- Jeffrey Peter GAMBINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20200388588
- Publication date Dec 10, 2020
- JMJ KOREA CO., LTD.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME
- Publication number 20190326202
- Publication date Oct 24, 2019
- Semiconductor Components Industries, LLC
- Roger M. Arbuthnot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLIP AND RELATED METHODS
- Publication number 20180197836
- Publication date Jul 12, 2018
- Semiconductor Components Industries, LLC
- Chee Hiong CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME
- Publication number 20180138109
- Publication date May 17, 2018
- Semiconductor Components Industries, LLC
- Roger M. Arbuthnot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180047698
- Publication date Feb 15, 2018
- Rohm Co., Ltd.
- Mamoru YAMAGAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20170338190
- Publication date Nov 23, 2017
- Mitsubishi Electric Corporation
- Junji FUJINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER AND CLIP EACH HAVING SINTERABLE, SOLIDIFIED PASTE FOR CONNE...
- Publication number 20170117209
- Publication date Apr 27, 2017
- Heraeus Deutschland GmbH & Co. KG
- Michael BENEDIKT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140327138
- Publication date Nov 6, 2014
- RENESAS ELECTRONICS CORPORATION
- Hiroyasu Miyamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140291828
- Publication date Oct 2, 2014
- Rohm Co., Ltd.
- Koji YASUNAGA
- H01 - BASIC ELECTRIC ELEMENTS

Material of the auxiliary connecting means

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Leadframe package with adjustable clip

Semiconductor device

Semiconductor device and electronic device

Semiconductor package

Semiconductor devices and methods of making the same

Method for die and clip attachment

Semiconductor package

Stacked transistor assembly with dual middle mounting clips

Method for electrically contacting a component by galvanic connecti...

Solid top terminal for discrete power devices

Semiconductor devices and methods of making the same

Package with vertical interconnect between carrier and clip

Power module

Method for fabricating stack die package

Electronic module

Semiconductor devices and methods of making the same

Semiconductor module and conductive member for semiconductor module...

Carrier and clip each having sinterable, solidified paste for conne...

Semiconductor devices and methods of making the same

Semiconductor device, and alternator and power conversion device wh...

Die package component with jumper structure

Die package component with jumper structure and manufacturing metho...

Clip and related methods

Semiconductor device

Arrangement of multiple power semiconductor chips and method of man...

Semiconductor device

Clip and related methods

Semiconductor device having multiple contact clips

Semiconductor device

Packaging solutions for devices and systems comprising lateral GaN...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SOLDER STRUCTURE WITH DISRUPTABLE COATING AS SOLDER SPREADING PROTE...

SEMICONDUCTOR DEVICE AND POWER CONVERTING DEVICE

FINGERPRINT SENSOR PACKAGE AND SMART CARD HAVING THE SAME

Two-In-One Lead Frame Package

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...

METAL PCB FOR TOPSIDE POWER DELIVERY

INTEGRATED CIRCUIT PACKAGE WITH BACKSIDE LEAD FOR CLOCK TREE OR POW...

SEMICONDUCTOR DEVICE, AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE, AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND JIG SET

SEMICONDUCTOR DEVICE

Method for Producing Power Semiconductor Module and Power Semicondu...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

STACKED TRANSISTOR ASSEMBLY WITH DUAL MIDDLE MOUNTING CLIPS

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME

CLIP AND RELATED METHODS

SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME

SEMICONDUCTOR DEVICE

POWER MODULE

CARRIER AND CLIP EACH HAVING SINTERABLE, SOLIDIFIED PASTE FOR CONNE...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME