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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/7532Material of the auxiliary member

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Thermocompression bond tips and related apparatus and methods
- Patent number 11,705,425
- Issue date Jul 18, 2023
- Micron Technology, Inc.
- Benjamin L. McClain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive for semiconductor device, and high productivity method for...
- Patent number 11,608,455
- Issue date Mar 21, 2023
- SHOWA DENKO MATERIALS CO., LTD.
- Kazutaka Honda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Sintering tool and method for sintering an electronic subassembly
- Patent number 11,400,514
- Issue date Aug 2, 2022
- Danfoss Silicon Power GmbH
- Frank Osterwald
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Sintering press and method for sintering electronic components on a...
- Patent number 11,380,647
- Issue date Jul 5, 2022
- AMX—AUTOMATRIX S.R.L.
- Nicola Schivalocchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression bond tips and related apparatus and methods
- Patent number 11,024,595
- Issue date Jun 1, 2021
- Micron Technology, Inc.
- Benjamin L. McClain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sintering tool and method for sintering an electronic subassembly
- Patent number 10,814,396
- Issue date Oct 27, 2020
- Danfoss Silicon Power GmbH
- Frank Osterwald
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method for manufacturing semiconductor device including heating and...
- Patent number 10,669,454
- Issue date Jun 2, 2020
- Hitachi Chemical Company, Ltd.
- Kazutaka Honda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for the material-bonded connection of connection partners...
- Patent number 10,603,741
- Issue date Mar 31, 2020
- Semikron Elektronik GmbH & Co., KG
- Ingo Bogen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sintering device
- Patent number 10,483,229
- Issue date Nov 19, 2019
- Danfoss Silicon Power GmbH
- Frank Osterwald
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Press fitting head and semiconductor manufacturing apparatus using...
- Patent number 10,388,625
- Issue date Aug 20, 2019
- J-DEVICES CORPORATION
- Minoru Kai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for simultaneously bonding multiple chips of different heigh...
- Patent number 10,147,702
- Issue date Dec 4, 2018
- Palo Alto Research Center Incorporated
- Brent S. Krusor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device, heat insulating load...
- Patent number 10,020,282
- Issue date Jul 10, 2018
- Nissan Motor Co., Ltd.
- Satoshi Tanimoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pressure transmitting device for bonding chips onto a substrate
- Patent number 9,305,813
- Issue date Apr 5, 2016
- EV GROUP E. THALLNER GMBH
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for producing a bond and a semiconductor module
- Patent number 9,202,800
- Issue date Dec 1, 2015
- Infineon Technologies AG
- Tao Hong
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Bonding apparatus and bonding method
- Patent number 9,016,342
- Issue date Apr 28, 2015
- Apic Yamada Corporation
- Kazuhiko Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Buffer film for multi-chip packaging
- Patent number 8,758,546
- Issue date Jun 24, 2014
- Dexerials Corporation
- Akira Ishigami
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for thin die-to-wafer bonding
- Patent number 8,697,542
- Issue date Apr 15, 2014
- The Research Foundation of State University of New York
- Daniel Pascual
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip mounting method utilizing ultrasonic vibrations
- Patent number 6,269,999
- Issue date Aug 7, 2001
- Texas Instruments Incorporated
- Tomohiro Okazaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
3713575
- Patent number 3,713,575
- Issue date Jan 30, 1973
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SOFT TOUCH EUTECTIC SOLDER PRESSURE PAD
- Publication number 20230268312
- Publication date Aug 24, 2023
- BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC
- Peter M. Wallace
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR USING A BUFFER SHEET
- Publication number 20230095879
- Publication date Mar 30, 2023
- Showa Denko Materials Co., Ltd.
- Yuta Koseki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND BONDING METHOD USING THE SAME
- Publication number 20230057934
- Publication date Feb 23, 2023
- SAMSUNG DISPLAY CO., LTD.
- SANGDUK LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOCOMPRESSION BOND TIPS AND RELATED APPARATUS AND METHODS
- Publication number 20210233887
- Publication date Jul 29, 2021
- Micron Technology, Inc.
- Benjamin L. McClain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINTERING TOOL AND METHOD FOR SINTERING AN ELECTRONIC SUBASSEMBLY
- Publication number 20210016353
- Publication date Jan 21, 2021
- DANFOSS SILICON POWER GMBH
- Frank Osterwald
- B22 - CASTING POWDER METALLURGY
Information Patent Application
ADHESIVE FOR SEMICONDUCTOR, SEMICONDUCTOR DEVICE, AND METHOD FOR MA...
- Publication number 20200095481
- Publication date Mar 26, 2020
- Hitachi Chemical Company, Ltd.
- Kazutaka HONDA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SINTERING PRESS AND METHOD FOR SINTERING ELECTRONIC COMPONENTS ON A...
- Publication number 20190326250
- Publication date Oct 24, 2019
- AMX - AUTOMATRIX S.R.L.
- Nicola SCHIVALOCCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOCOMPRESSION BOND TIPS AND RELATED APPARATUS AND METHODS
- Publication number 20180366434
- Publication date Dec 20, 2018
- Micron Technology, Inc.
- Benjamin L. McClain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINTERING DEVICE
- Publication number 20170229418
- Publication date Aug 10, 2017
- DANFOSS SILICON POWER GMBH
- Frank Osterwald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINTERING TOOL AND METHOD FOR SINTERING AN ELECTRONIC SUBASSEMBLY
- Publication number 20170216920
- Publication date Aug 3, 2017
- DANFOSS SILICON POWER GMBH
- Frank Osterwald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUFFER FILM FOR MULTI-CHIP PACKAGING
- Publication number 20140248477
- Publication date Sep 4, 2014
- DEXERIALS CORPORATION
- Akira Ishigami
- B32 - LAYERED PRODUCTS
Information Patent Application
METHODS FOR PRODUCING A BOND AND A SEMICONDUCTOR MODULE
- Publication number 20140013595
- Publication date Jan 16, 2014
- Tao Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR THIN DIE-TO-WAFER BONDING
- Publication number 20130273691
- Publication date Oct 17, 2013
- THE RESEARCH FOUNDATION OF STATE UNIVERSITY OF NEW YORK
- Daniel PASCUAL
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD MANUFACTURING METHOD
- Publication number 20130255878
- Publication date Oct 3, 2013
- Fujitsu Limited
- Tetsuya TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUFFER FILM FOR MULTI-CHIP PACKAGING
- Publication number 20130092310
- Publication date Apr 18, 2013
- DEXERIALS CORPORATION
- Akira Ishigami
- B32 - LAYERED PRODUCTS
Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20120247664
- Publication date Oct 4, 2012
- Kazuhiko KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic assembly with detachable components
- Publication number 20110228506
- Publication date Sep 22, 2011
- Kong-Chen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic assembly with detachable components
- Publication number 20110222253
- Publication date Sep 15, 2011
- Kong-Chen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic assembly with detachable components
- Publication number 20110223695
- Publication date Sep 15, 2011
- Kong-Chen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic assembly with detachable components
- Publication number 20110222252
- Publication date Sep 15, 2011
- Kong-Chen Chen
- H01 - BASIC ELECTRIC ELEMENTS

Material of the auxiliary member

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Thermocompression bond tips and related apparatus and methods

Adhesive for semiconductor device, and high productivity method for...

Sintering tool and method for sintering an electronic subassembly

Sintering press and method for sintering electronic components on a...

Thermocompression bond tips and related apparatus and methods

Sintering tool and method for sintering an electronic subassembly

Method for manufacturing semiconductor device including heating and...

Apparatus for the material-bonded connection of connection partners...

Sintering device

Press fitting head and semiconductor manufacturing apparatus using...

Method for simultaneously bonding multiple chips of different heigh...

Method for manufacturing semiconductor device, heat insulating load...

Pressure transmitting device for bonding chips onto a substrate

Methods for producing a bond and a semiconductor module

Bonding apparatus and bonding method

Buffer film for multi-chip packaging

Method for thin die-to-wafer bonding

Semiconductor chip mounting method utilizing ultrasonic vibrations

3713575

Patents Applicationslast 30 patents

SOFT TOUCH EUTECTIC SOLDER PRESSURE PAD

METHOD FOR USING A BUFFER SHEET

BONDING APPARATUS AND BONDING METHOD USING THE SAME

THERMOCOMPRESSION BOND TIPS AND RELATED APPARATUS AND METHODS

SINTERING TOOL AND METHOD FOR SINTERING AN ELECTRONIC SUBASSEMBLY

ADHESIVE FOR SEMICONDUCTOR, SEMICONDUCTOR DEVICE, AND METHOD FOR MA...

SINTERING PRESS AND METHOD FOR SINTERING ELECTRONIC COMPONENTS ON A...

THERMOCOMPRESSION BOND TIPS AND RELATED APPARATUS AND METHODS

SINTERING DEVICE

SINTERING TOOL AND METHOD FOR SINTERING AN ELECTRONIC SUBASSEMBLY

BUFFER FILM FOR MULTI-CHIP PACKAGING

METHODS FOR PRODUCING A BOND AND A SEMICONDUCTOR MODULE

APPARATUS AND METHOD FOR THIN DIE-TO-WAFER BONDING

PRINTED CIRCUIT BOARD MANUFACTURING METHOD

BUFFER FILM FOR MULTI-CHIP PACKAGING

BONDING APPARATUS AND BONDING METHOD

Electronic assembly with detachable components

Electronic assembly with detachable components

Electronic assembly with detachable components

Electronic assembly with detachable components