3713575

Information

• Patent Grant
• 3713575

• References
• Source

• Patent Number

  3,713,575

• Date Filed

  Not available

• Date Issued

  Tuesday, January 30, 1973
  51 years ago

• CPC

  • H01L24/83 - using a layer connector
  • B23K20/023 - Thermo-compression bonding
  • B23K20/26 - Auxiliary equipment
  • H01L21/67144 - Apparatus for mounting on conductive members
  • H01L24/75 - Apparatus for connecting with bump connectors or layer connectors
  • H01L2224/75 - Apparatus for connecting with bump connectors or layer connectors
  • H01L2224/75315 - Elastomer inlay
  • H01L2224/7532 - Material of the auxiliary member
  • H01L2224/75753 - Means for optical alignment
  • H01L2224/75755 - in the lower part of the bonding apparatus
  • H01L2224/75983 - of the mounting surface
  • H01L2224/75985 - Material
  • H01L2224/81203 - Thermocompression bonding
  • H01L2224/8319 - Arrangement of the layer connectors prior to mounting
  • H01L2224/83801 - Soldering or alloying
  • H01L2924/01029 - Copper [Cu]
  • H01L2924/01033 - Arsenic [As]
  • H01L2924/01079 - Gold [Au]
  • H01L2924/01082 - Lead [Pb]
  • H01L2924/14 - Integrated circuits
  • Y10T29/49121 - Beam lead frame or beam lead device
  • Y10T29/49769 - Using optical instrument [excludes mere human eyeballing]

• US Classifications

  • 228 - Metal fusion bonding
  • 029 - Metal working
  • 219 - Electric heating
  • 257 - Active solid-state devices