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  • CPC
  • H01L2224/79988
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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/79988Material of the auxiliary member
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Patents Grantslast 30 patents

  • Information Patent Grant

    3608809
    • Patent number 3,608,809
    • Issue date Sep 28, 1971
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    THERMOCOMPRESSION BONDING DEVICE
    • Publication number 20200411466
    • Publication date Dec 31, 2020
    • Sakai Display Products Corporation
    • YOHICHIROH SAKAKI
    • G02 - OPTICS