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H01L2224/79988

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/79988Material of the auxiliary member

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Patents Grantslast 30 patents

Information Patent Grant
3608809
- Patent number 3,608,809
- Issue date Sep 28, 1971
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
THERMOCOMPRESSION BONDING DEVICE
- Publication number 20200411466
- Publication date Dec 31, 2020
- Sakai Display Products Corporation
- YOHICHIROH SAKAKI
- G02 - OPTICS