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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/0215Material of the auxiliary member

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 12,050,398
- Issue date Jul 30, 2024
- Micron Technology, Inc.
- Hidenori Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer, method for fabricating the same, and semiconductor pack...
- Patent number 11,984,415
- Issue date May 14, 2024
- Samsung Electronics Co., Ltd.
- Yukyung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderless interconnection structure and method of forming same
- Patent number 11,961,810
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 11,855,014
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polyimide profile control
- Patent number 11,855,015
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Chi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 11,810,837
- Issue date Nov 7, 2023
- Samsung Electronics Co., Ltd.
- Chulyong Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods related to stack structures including passivati...
- Patent number 11,804,460
- Issue date Oct 31, 2023
- Skyworks Solutions, Inc.
- Jiro Yota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer (RDL) structure, semiconductor device and manu...
- Patent number 11,605,605
- Issue date Mar 14, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ping-Heng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus
- Patent number 11,410,946
- Issue date Aug 9, 2022
- Mitsubishi Electric Corporation
- Daisuke Hirata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack structures in electronic devices including passivation layers...
- Patent number 11,257,774
- Issue date Feb 22, 2022
- Skyworks Solutions, Inc.
- Jiro Yota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderless interconnection structure and method of forming same
- Patent number 11,043,462
- Issue date Jun 22, 2021
- Taiwan Semiconductor Manufacturing Company
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress relieving structure for semiconductor device
- Patent number 10,896,887
- Issue date Jan 19, 2021
- Infineon Technologies AG
- Marius Aurel Bodea
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 10,867,941
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Final passivation for wafer level warpage and ULK stress reduction
- Patent number 10,622,319
- Issue date Apr 14, 2020
- International Business Machines Corporation
- Ekta Misra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderless interconnection structure and method of forming same
- Patent number 10,319,691
- Issue date Jun 11, 2019
- Taiwan Semiconductor Manufacturing Company
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level package and method
- Patent number 10,026,707
- Issue date Jul 17, 2018
- Microchip Technology Incorportated
- George Chu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Integrated circuit chip and integrated circuit wafer with guard ring
- Patent number 10,026,699
- Issue date Jul 17, 2018
- Synaptics Japan GK
- Atsushi Obuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures having a tapering curved profile and methods of making same
- Patent number 10,008,459
- Issue date Jun 26, 2018
- Taiwan Semiconductor Manufacturing Company
- Pei-Chun Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure and method of forming same
- Patent number 9,966,346
- Issue date May 8, 2018
- Taiwan Semiconductor Manufacturing Company
- Guan-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive contacts having varying widths and method of manufacturi...
- Patent number 9,953,939
- Issue date Apr 24, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Liang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 9,922,928
- Issue date Mar 20, 2018
- Renesas Electronics Corporation
- Takashi Tonegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underbump metallization structure
- Patent number 9,859,235
- Issue date Jan 2, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Wen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Concentric bump design for the alignment in die stacking
- Patent number 9,721,916
- Issue date Aug 1, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jung Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress buffer structures in a mounting structure of a semiconductor...
- Patent number 9,337,118
- Issue date May 10, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with low-melting-temperature conductive reg...
- Patent number 9,318,313
- Issue date Apr 19, 2016
- STMicroelectronics S.r.l.
- Alberto Pagani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a structure for microelectronic device assembly
- Patent number 9,241,403
- Issue date Jan 19, 2016
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Gabriel Pares
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of manufacturing stress buffer structures in a mounting str...
- Patent number 8,906,798
- Issue date Dec 9, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming multi-layered UBM with i...
- Patent number 8,642,469
- Issue date Feb 4, 2014
- STATS ChipPAC, Ltd.
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and fabricating method thereof
- Patent number 8,618,658
- Issue date Dec 31, 2013
- Amkor Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protection film having a plurality of openings above an electrode pad
- Patent number 8,508,051
- Issue date Aug 13, 2013
- Panasonic Corporation
- Noriyuki Nagai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT (IC) CHIP WITH BUMP INTERCONNECTS EACH HAVING MU...
- Publication number 20240387429
- Publication date Nov 21, 2024
- QUALCOMM Incorporated
- Yujen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER, METHOD FOR FABRICATING THE SAME, AND SEMICONDUCTOR PACK...
- Publication number 20240274553
- Publication date Aug 15, 2024
- Samsung Electronics Co., Ltd.
- Yukyung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH AIR GAP AND METHOD FOR PREPARING THE SAME
- Publication number 20240162174
- Publication date May 16, 2024
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH AIR GAP
- Publication number 20240162177
- Publication date May 16, 2024
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE INCLUDING A BONDING STRUCTURE
- Publication number 20240153900
- Publication date May 9, 2024
- NANYA TECHNOLOGY CORPORATION
- Sheng-Fu HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE INCLUDING A BONDING STRUCTURE
- Publication number 20240153902
- Publication date May 9, 2024
- NANYA TECHNOLOGY CORPORATION
- Sheng-Fu HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR HYBRID BOND CRACKSTOP WITH AIRGAPS
- Publication number 20240113055
- Publication date Apr 4, 2024
- International Business Machines Corporation
- Nicholas Alexander Polomoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME
- Publication number 20240055379
- Publication date Feb 15, 2024
- Samsung Electronics Co., Ltd.
- HASEOB SEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20240030104
- Publication date Jan 25, 2024
- Samsung Electronics Co., Ltd.
- Chulyong Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYIMIDE PROFILE CONTROL
- Publication number 20230387050
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Chi HUANG
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
REDUCED PARASITIC CAPACITANCE IN BONDED STRUCTURES
- Publication number 20230122531
- Publication date Apr 20, 2023
- Invensas LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL, DISPLAY DEVICE INCLUDING THE SAME, AND METHOD OF MAN...
- Publication number 20220392869
- Publication date Dec 8, 2022
- SAMSUNG DISPLAY CO., LTD.
- Byoungyong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYIMIDE PROFILE CONTROL
- Publication number 20220344290
- Publication date Oct 27, 2022
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Chen-Chi HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES AND METHODS RELATED TO STACK STRUCTURES INCLUDING PASSIVATI...
- Publication number 20220336396
- Publication date Oct 20, 2022
- Skyworks Solutions, Inc.
- Jiro YOTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20220102245
- Publication date Mar 31, 2022
- Samsung Electronics Co., Ltd.
- Chulyong Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING PAD STRUCTURE, SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR PACKA...
- Publication number 20220084966
- Publication date Mar 17, 2022
- CHANGXIN MEMORY TECHNOLOGIES, INC
- PING-HENG WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION LAYER (RDL) STRUCTURE, SEMICONDUCTOR DEVICE AND MANU...
- Publication number 20210225787
- Publication date Jul 22, 2021
- Changxin Memory Technologies, Inc.
- Ping-Heng WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stress Relieving Structure for Semiconductor Device
- Publication number 20190348382
- Publication date Nov 14, 2019
- Marius Aurel Bodea
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LARGE SCALE INTEGRATED CIRCUIT CHIP AND LARGE SCALE INTEGRATED CIRC...
- Publication number 20170278805
- Publication date Sep 28, 2017
- Synaptics Japan GK
- Atsushi OBUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20170148752
- Publication date May 25, 2017
- XINTEC INC.
- Yen-Shih HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE CONTACTS HAVING VARYING WIDTHS AND METHOD OF MANUFACTURI...
- Publication number 20170069587
- Publication date Mar 9, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Liang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Concentric Bump Design for the Alignment in Die Stacking
- Publication number 20160372436
- Publication date Dec 22, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jung Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPOSITE LAYER STRUCTURE AND SEMICONDUCTOR PACKAGING...
- Publication number 20140264855
- Publication date Sep 18, 2014
- Macronix International Co., Ltd.
- Ming-Tung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A STRUCTURE FOR MICROELECTRONIC DEVICE ASSEMBLY
- Publication number 20140144690
- Publication date May 29, 2014
- COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENE. ALT.
- Gabriel Pares
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Multi-Layered UBM with I...
- Publication number 20140070410
- Publication date Mar 13, 2014
- STATS ChipPAC, Ltd.
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH LOW-MELTING-TEMPERATURE CONDUCTIVE REG...
- Publication number 20130285056
- Publication date Oct 31, 2013
- STMicroelectronics S.r. I.
- Alberto PAGANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED DEVICE
- Publication number 20130234251
- Publication date Sep 12, 2013
- LAPIS Semiconductor Co., Ltd.
- Chikashi FUCHIGAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING STRESS BUFFER STRUCTURES IN A MOUNTING STR...
- Publication number 20130109169
- Publication date May 2, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Multi-Layered UBM with I...
- Publication number 20120211900
- Publication date Aug 23, 2012
- STATS ChipPAC, Ltd.
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE STRUCTURE FOR A SEMICONDUCTOR INTEGRATED CIRCUIT
- Publication number 20120018883
- Publication date Jan 26, 2012
- Geng-Shin Shen
- H01 - BASIC ELECTRIC ELEMENTS

Material of the auxiliary member

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and method of forming the same

Interposer, method for fabricating the same, and semiconductor pack...

Solderless interconnection structure and method of forming same

Semiconductor device and method

Polyimide profile control

Semiconductor packages

Devices and methods related to stack structures including passivati...

Redistribution layer (RDL) structure, semiconductor device and manu...

Semiconductor apparatus

Stack structures in electronic devices including passivation layers...

Solderless interconnection structure and method of forming same

Stress relieving structure for semiconductor device

Semiconductor device and method

Final passivation for wafer level warpage and ULK stress reduction

Solderless interconnection structure and method of forming same

Wafer level package and method

Integrated circuit chip and integrated circuit wafer with guard ring

Structures having a tapering curved profile and methods of making same

Bump structure and method of forming same

Conductive contacts having varying widths and method of manufacturi...

Semiconductor device and method of manufacturing semiconductor device

Underbump metallization structure

Concentric bump design for the alignment in die stacking

Stress buffer structures in a mounting structure of a semiconductor...

Semiconductor structure with low-melting-temperature conductive reg...

Method for producing a structure for microelectronic device assembly

Methods of manufacturing stress buffer structures in a mounting str...

Semiconductor device and method of forming multi-layered UBM with i...

Semiconductor device and fabricating method thereof

Protection film having a plurality of openings above an electrode pad

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT (IC) CHIP WITH BUMP INTERCONNECTS EACH HAVING MU...

INTERPOSER, METHOD FOR FABRICATING THE SAME, AND SEMICONDUCTOR PACK...

SEMICONDUCTOR DEVICE WITH AIR GAP AND METHOD FOR PREPARING THE SAME

SEMICONDUCTOR DEVICE WITH AIR GAP

SEMICONDUCTOR DEVICE STRUCTURE INCLUDING A BONDING STRUCTURE

SEMICONDUCTOR DEVICE STRUCTURE INCLUDING A BONDING STRUCTURE

STRUCTURE FOR HYBRID BOND CRACKSTOP WITH AIRGAPS

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME

SEMICONDUCTOR PACKAGES

POLYIMIDE PROFILE CONTROL

REDUCED PARASITIC CAPACITANCE IN BONDED STRUCTURES

DISPLAY PANEL, DISPLAY DEVICE INCLUDING THE SAME, AND METHOD OF MAN...

POLYIMIDE PROFILE CONTROL

DEVICES AND METHODS RELATED TO STACK STRUCTURES INCLUDING PASSIVATI...

SEMICONDUCTOR PACKAGES

BONDING PAD STRUCTURE, SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR PACKA...

REDISTRIBUTION LAYER (RDL) STRUCTURE, SEMICONDUCTOR DEVICE AND MANU...

Stress Relieving Structure for Semiconductor Device

LARGE SCALE INTEGRATED CIRCUIT CHIP AND LARGE SCALE INTEGRATED CIRC...

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

CONDUCTIVE CONTACTS HAVING VARYING WIDTHS AND METHOD OF MANUFACTURI...

Concentric Bump Design for the Alignment in Die Stacking

SEMICONDUCTOR COMPOSITE LAYER STRUCTURE AND SEMICONDUCTOR PACKAGING...

METHOD FOR PRODUCING A STRUCTURE FOR MICROELECTRONIC DEVICE ASSEMBLY

Semiconductor Device and Method of Forming Multi-Layered UBM with I...

SEMICONDUCTOR STRUCTURE WITH LOW-MELTING-TEMPERATURE CONDUCTIVE REG...

SEMICONDUCTOR INTEGRATED DEVICE

METHODS OF MANUFACTURING STRESS BUFFER STRUCTURES IN A MOUNTING STR...

Semiconductor Device and Method of Forming Multi-Layered UBM with I...

CONDUCTIVE STRUCTURE FOR A SEMICONDUCTOR INTEGRATED CIRCUIT