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H01L2924/186

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/186Material

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,266,627
- Issue date Apr 1, 2025
- Mitsubishi Electric Corporation
- Shinji Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having an encapulant comprising conductive fi...
- Patent number 12,261,095
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Xinyu Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 12,261,156
- Issue date Mar 25, 2025
- Denso Corporation
- Hiroyoshi Kunieda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having package on package structure and method...
- Patent number 12,261,157
- Issue date Mar 25, 2025
- Samsung Electronics Co., Ltd.
- Jeonghyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing apparatus and method of manufacturing s...
- Patent number 12,255,080
- Issue date Mar 18, 2025
- Mitsubishi Electric Corporation
- Takamasa Iwai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and power conversion apparatus
- Patent number 12,224,220
- Issue date Feb 11, 2025
- Mitsubishi Electric Corporation
- Ken Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,176,269
- Issue date Dec 24, 2024
- Rohm Co., Ltd.
- Katsutoki Shirai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,165,998
- Issue date Dec 10, 2024
- Fuji Electric Co., Ltd.
- Tohru Shirakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,131,983
- Issue date Oct 29, 2024
- Rohm Co., Ltd.
- Katsutoki Shirai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method to minimize stress on stack via
- Patent number 12,080,600
- Issue date Sep 3, 2024
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,068,235
- Issue date Aug 20, 2024
- Rohm Co., Ltd.
- Masaaki Matsuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and corresponding method of manufacture
- Patent number 12,068,276
- Issue date Aug 20, 2024
- STMicroelectronics S.R.L.
- Giovanni Graziosi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 12,057,362
- Issue date Aug 6, 2024
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure with multiple gap-filling layers and fabrica...
- Patent number 12,057,363
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible circuits on soft substrates
- Patent number 11,996,380
- Issue date May 28, 2024
- 3M Innovative Properties Company
- Ankit Mahajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures and method of manufacturing the same
- Patent number 11,961,811
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and method for manufacturing semiconductor module
- Patent number 11,948,850
- Issue date Apr 2, 2024
- Mitsubishi Electric Corporation
- Akitoshi Shirao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging method for fan-out wafer-level packaging structure
- Patent number 11,862,595
- Issue date Jan 2, 2024
- SJ SEMICONDUCTOR(JIANGYIN) CORPORATION
- Hailin Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having an encapsulant comprising conductive f...
- Patent number 11,842,946
- Issue date Dec 12, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Xinyu Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,810,840
- Issue date Nov 7, 2023
- Shinko Electric Industries Co., Ltd.
- Toshiyuki Okabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having package on package structure and method...
- Patent number 11,804,477
- Issue date Oct 31, 2023
- Samsung Electronics Co., Ltd.
- Jeonghyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures
- Patent number 11,646,281
- Issue date May 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 11,640,954
- Issue date May 2, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jeng-Nan Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,605,613
- Issue date Mar 14, 2023
- Kabushiki Kaisha Toshiba
- Tomohiro Iguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,587,897
- Issue date Feb 21, 2023
- Samsung Electronics Co., Ltd.
- Joongwon Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip to chip interconnect in encapsulant of molded semiconductor pa...
- Patent number 11,569,196
- Issue date Jan 31, 2023
- Infineon Technologies AG
- Khay Chwan Saw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,545,469
- Issue date Jan 3, 2023
- Powerchip Semiconductor Manufacturing Corporation
- Yi-Chung Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,348,853
- Issue date May 31, 2022
- Kabushiki Kaisha Toshiba
- Yuuichi Fujita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-integrated vertical capacitors and methods of assembling same
- Patent number 11,296,186
- Issue date Apr 5, 2022
- Intel Corporation
- Brandon C Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC package comprising perforated foil sheet
- Patent number 11,257,690
- Issue date Feb 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT DEVICE
- Publication number 20250096060
- Publication date Mar 20, 2025
- MICROCHIP TECHNOLOGY INCORPORATED
- Mankit Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250096169
- Publication date Mar 20, 2025
- Fuji Electric Co., Ltd.
- Tohru SHIRAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250062138
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Hsuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE BRIDGE AND ITS MANUFACTURING PROCESS
- Publication number 20250054918
- Publication date Feb 13, 2025
- ROBERT BOSCH GmbH
- Irfan AYDOGMUS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD
- Publication number 20250046753
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250029898
- Publication date Jan 23, 2025
- Rohm Co., Ltd.
- Katsutoki SHIRAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED INDUCTOR INCLUDING MAGNETIC LAYER
- Publication number 20250006631
- Publication date Jan 2, 2025
- QUALCOMM Incorporated
- Jui-Yi CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250006621
- Publication date Jan 2, 2025
- ROHM CO., LTD.
- Ryohei UMENO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD OF MANUFACTURE
- Publication number 20240413120
- Publication date Dec 12, 2024
- STMicroelectronics S.r.l
- Giovanni GRAZIOSI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20240404878
- Publication date Dec 5, 2024
- Amkor Technology Portugal, S.A.
- Eoin O'Toole
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FILLING GAPS BETWEEN DIES USING SILICON DIOXIDE
- Publication number 20240355696
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hang CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE, AND METHOD FOR MANUFACT...
- Publication number 20240355693
- Publication date Oct 24, 2024
- Kabushiki Kaisha Toshiba
- Shogo MINAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
- Publication number 20240347436
- Publication date Oct 17, 2024
- Resonac Corporation
- Tomoaki SHIBATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING CHIP PACKAGE STRUCTURE WITH MULTIPLE GAP-FILLING...
- Publication number 20240347407
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Chen LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Partial Shielding with Embedded...
- Publication number 20240321768
- Publication date Sep 26, 2024
- STATS ChipPAC Pte Ltd.
- YongMoo Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240282713
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hsuan Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN COMPOSITION FOR ENCAPSULATION AND SEMICONDUCTOR DEVICE
- Publication number 20240263004
- Publication date Aug 8, 2024
- Shin-Etsu Chemical Co., Ltd.
- Shoichi OSADA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SEMICONDUCTOR DEVICES WITH EMBEDDED FILLER PARTICLES AND ASSOCIATED...
- Publication number 20240234227
- Publication date Jul 11, 2024
- INFINEON TECHNOLOGIES AG
- Martin MAYER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNED SHEET MUF FOR COMPLEX PACKAGES AND METHODS OF PRODUCING
- Publication number 20240222216
- Publication date Jul 4, 2024
- Intel Corporation
- Zhixin XIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR OPTICAL THERMAL TREATMENT IN SEMICONDUCTO...
- Publication number 20240222301
- Publication date Jul 4, 2024
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240203812
- Publication date Jun 20, 2024
- RENESAS ELECTRONICS CORPORATION
- Takamichi HOSOKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH MOLDING CONTACT ENABLED EMI SHIELDING
- Publication number 20240203895
- Publication date Jun 20, 2024
- QUALCOMM Incorporated
- Je-Hsiung LAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20240194554
- Publication date Jun 13, 2024
- Delta Electronics, Inc.
- Jen-Hsien Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Insert
- Publication number 20240178109
- Publication date May 30, 2024
- Stefan Schwab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE PACKAGE WITH MOLDED VIA AND DUAL SIDE PRESS-FIT PIN
- Publication number 20240170378
- Publication date May 23, 2024
- Semiconductor Components Industries, LLC
- Heejo CHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH A HEAT DISSIPATION MEMBER
- Publication number 20240170366
- Publication date May 23, 2024
- Samsung Electronics Co., Ltd.
- Jonggyu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH EMBEDDED FILLER PARTICLES AND ASSOCIATED...
- Publication number 20240136240
- Publication date Apr 25, 2024
- INFINEON TECHNOLOGIES AG
- Martin MAYER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE RECONSTITUTION AND HIGH-DENSITY INTERCONNECTS FOR EMBEDDED CHIPS
- Publication number 20240128222
- Publication date Apr 18, 2024
- Neuralink Corp.
- Supin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE PACKAGE WITH SEALED DIE ENCLOSURES
- Publication number 20240088081
- Publication date Mar 14, 2024
- QUALCOMM Incorporated
- Bart KASSTEEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL PACKAGE ARCHITECTURE WITH FACE DOWN BRIDGE DIES
- Publication number 20240071933
- Publication date Feb 29, 2024
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and method for manufacturing the same

Semiconductor package having an encapulant comprising conductive fi...

Electronic device

Semiconductor device having package on package structure and method...

Semiconductor manufacturing apparatus and method of manufacturing s...

Semiconductor module and power conversion apparatus

Semiconductor device

Semiconductor device

Semiconductor device

Semiconductor device and method to minimize stress on stack via

Semiconductor device

Semiconductor device and corresponding method of manufacture

Semiconductor device and method for manufacturing semiconductor device

Chip package structure with multiple gap-filling layers and fabrica...

Flexible circuits on soft substrates

Semiconductor structures and method of manufacturing the same

Semiconductor module and method for manufacturing semiconductor module

Packaging method for fan-out wafer-level packaging structure

Semiconductor package having an encapsulant comprising conductive f...

Semiconductor device

Semiconductor device having package on package structure and method...

Semiconductor structures

Semiconductor package structure

Semiconductor device

Semiconductor device

Chip to chip interconnect in encapsulant of molded semiconductor pa...

Semiconductor package and manufacturing method thereof

Semiconductor device

Package-integrated vertical capacitors and methods of assembling same

3DIC package comprising perforated foil sheet

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT DEVICE

SEMICONDUCTOR DEVICE

PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

POWER MODULE BRIDGE AND ITS MANUFACTURING PROCESS

INTEGRATED CIRCUIT PACKAGE AND METHOD

SEMICONDUCTOR DEVICE

INTEGRATED INDUCTOR INCLUDING MAGNETIC LAYER

ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD OF MANUFACTURE

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

METHOD OF FILLING GAPS BETWEEN DIES USING SILICON DIOXIDE

SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE, AND METHOD FOR MANUFACT...

METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE

METHOD FOR FORMING CHIP PACKAGE STRUCTURE WITH MULTIPLE GAP-FILLING...

Semiconductor Device and Method of Partial Shielding with Embedded...

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

RESIN COMPOSITION FOR ENCAPSULATION AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICES WITH EMBEDDED FILLER PARTICLES AND ASSOCIATED...

PATTERNED SHEET MUF FOR COMPLEX PACKAGES AND METHODS OF PRODUCING

METHODS AND APPARATUS FOR OPTICAL THERMAL TREATMENT IN SEMICONDUCTO...

SEMICONDUCTOR DEVICE

THROUGH MOLDING CONTACT ENABLED EMI SHIELDING

POWER MODULE

Semiconductor Package with Insert

POWER MODULE PACKAGE WITH MOLDED VIA AND DUAL SIDE PRESS-FIT PIN

SEMICONDUCTOR PACKAGE WITH A HEAT DISSIPATION MEMBER

SEMICONDUCTOR DEVICES WITH EMBEDDED FILLER PARTICLES AND ASSOCIATED...

DIE RECONSTITUTION AND HIGH-DENSITY INTERCONNECTS FOR EMBEDDED CHIPS

DIE PACKAGE WITH SEALED DIE ENCLOSURES

THREE-DIMENSIONAL PACKAGE ARCHITECTURE WITH FACE DOWN BRIDGE DIES