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H01L2224/05099

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/05099Material

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 12,136,652
- Issue date Nov 5, 2024
- Sumitomo Electric Industries, Ltd.
- Taku Horii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure having at least one die with a plurality of taper...
- Patent number 11,990,383
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and forming method therefor
- Patent number 11,967,571
- Issue date Apr 23, 2024
- Fujian Jinhua Integrated Circuit Co., Ltd.
- Yi-Wang Jhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having an anti-arcing pattern disposed on a...
- Patent number 11,769,704
- Issue date Sep 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-An Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with metal-insulator-metal capacitor and method of manufact...
- Patent number 11,581,250
- Issue date Feb 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shuo-Mao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure having taper-shaped conductive pillar and method...
- Patent number 11,508,633
- Issue date Nov 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having an anti-arcing pattern disposed on a...
- Patent number 11,251,100
- Issue date Feb 15, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-An Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with metal-insulator-metal capacitor and method of manufact...
- Patent number 10,971,441
- Issue date Apr 6, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shuo-Mao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High bandwidth memory (HBM) bandwidth aggregation switch
- Patent number 10,916,516
- Issue date Feb 9, 2021
- Xilinx, Inc.
- Martin Newman
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Pad structure and integrated circuit die using the same
- Patent number 10,910,330
- Issue date Feb 2, 2021
- Mediatek Inc.
- Chun-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages and methods for forming the same
- Patent number 10,770,366
- Issue date Sep 8, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-destructive testing of integrated circuit chips
- Patent number 10,651,099
- Issue date May 12, 2020
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Corrosion resistant aluminum bond pad structure
- Patent number 10,615,137
- Issue date Apr 7, 2020
- International Business Machines Corporation
- Charles L. Arvin
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Integrated circuit packages and methods for forming the same
- Patent number 10,510,635
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with metal-insulator-metal capacitor and method of manufact...
- Patent number 10,475,731
- Issue date Nov 12, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shuo-Mao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with metal-insulator-metal capacitor and method of manufact...
- Patent number 10,276,484
- Issue date Apr 30, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shuo-Mao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Corrosion resistant aluminum bond pad structure
- Patent number 10,204,877
- Issue date Feb 12, 2019
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages and methods for forming the same
- Patent number 10,056,312
- Issue date Aug 21, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure with confinement layer
- Patent number 10,032,698
- Issue date Jul 24, 2018
- Taiwan Semiconductor Manufacturing Company
- Hsiao Yun Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with metal-insulator-metal capacitor and method of manufact...
- Patent number 9,960,106
- Issue date May 1, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shuo-Mao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Corrosion resistant aluminum bond pad structure
- Patent number 9,953,940
- Issue date Apr 24, 2018
- International Business Machines Corporation
- Charles L. Arvin
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Semiconductor packaging structure and manufacturing method for the...
- Patent number 9,892,988
- Issue date Feb 13, 2018
- Dawning Leading Technology Inc.
- Yu-Shan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages and methods for forming the same
- Patent number 9,780,009
- Issue date Oct 3, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure with confinement layer
- Patent number 9,673,132
- Issue date Jun 6, 2017
- Taiwan Semiconductor Manufacting Company, Ltd.
- Hsiao Yun Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photosensitive resin composition, method for producing patterned cu...
- Patent number 9,633,848
- Issue date Apr 25, 2017
- Hitachi Chemical Company, Ltd.
- Yu Aoki
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Mounting structure of semiconductor device and method of manufactur...
- Patent number 9,583,416
- Issue date Feb 28, 2017
- Olympus Corporation
- Takanori Sekido
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting structure of semiconductor device and method of manufactur...
- Patent number 9,490,191
- Issue date Nov 8, 2016
- Olympus Corporation
- Takanori Sekido
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip and fabrication method
- Patent number 9,455,239
- Issue date Sep 27, 2016
- STMicroelectronics (Crolles 2) SAS
- Laurent-Luc Chapelon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 9,263,406
- Issue date Feb 16, 2016
- Rohm Co., Ltd.
- Hiroshi Okumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages and methods for forming the same
- Patent number 9,196,532
- Issue date Nov 24, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei Tu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240282653
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20240222297
- Publication date Jul 4, 2024
- FUJIAN JINHUA INTEGRATED CIRCUIT CO., LTD.
- Yi-Wang JHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING AN ANTI-ARCING PATTERN DISPOSED ON A...
- Publication number 20230360986
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-An Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THEREOF
- Publication number 20230054148
- Publication date Feb 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220199778
- Publication date Jun 23, 2022
- Sumitomo Electric Industries, Ltd.
- Taku HORII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE...
- Publication number 20220199476
- Publication date Jun 23, 2022
- MITSUBISHI ELECTRIC CORPORATION
- Ryuichiro HANADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING AN ANTI-ARCING PATTERN DISPOSED ON A...
- Publication number 20220165633
- Publication date May 26, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-An Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREFOR
- Publication number 20210407936
- Publication date Dec 30, 2021
- Yi-Wang JHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE HAVING TAPER-SHAPED CONDUCTIVE PILLAR AND METHOD...
- Publication number 20210375708
- Publication date Dec 2, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH METAL-INSULATOR-METAL CAPACITOR AND METHOD OF MANUFACT...
- Publication number 20210217691
- Publication date Jul 15, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Shuo-Mao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20210090966
- Publication date Mar 25, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sheng-An Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Packages and Methods for Forming the Same
- Publication number 20200091027
- Publication date Mar 19, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH METAL-INSULATOR-METAL CAPACITOR AND METHOD OF MANUFACT...
- Publication number 20200020623
- Publication date Jan 16, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Shuo-Mao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH METAL-INSULATOR-METAL CAPACITOR AND METHOD OF MANUFACT...
- Publication number 20190229048
- Publication date Jul 25, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Shuo-Mao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORROSION RESISTANT ALUMINUM BOND PAD STRUCTURE
- Publication number 20190139919
- Publication date May 9, 2019
- International Business Machines Corporation
- Charles L. ARVIN
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
NON-DESTRUCTIVE TESTING OF INTEGRATED CIRCUIT CHIPS
- Publication number 20190013252
- Publication date Jan 10, 2019
- International Business Machines Corporation
- David W. Abraham
- G01 - MEASURING TESTING
Information Patent Application
NON-DESTRUCTIVE TESTING OF INTEGRATED CIRCUIT CHIPS
- Publication number 20190013251
- Publication date Jan 10, 2019
- International Business Machines Corporation
- David W. Abraham
- G01 - MEASURING TESTING
Information Patent Application
HIGH BANDWIDTH MEMORY (HBM) BANDWIDTH AGGREGATION SWITCH
- Publication number 20180358313
- Publication date Dec 13, 2018
- Xilinx, Inc.
- Martin Newman
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Integrated Circuit Packages and Methods for Forming the Same
- Publication number 20180308778
- Publication date Oct 25, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND BALL BONDER
- Publication number 20180294243
- Publication date Oct 11, 2018
- SII Semiconductor Corporation
- Tomomitsu RISAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORROSION RESISTANT ALUMINUM BOND PAD STRUCTURE
- Publication number 20180174988
- Publication date Jun 21, 2018
- International Business Machines Corporation
- Charles L. ARVIN
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Integrated Circuit Packages and Methods for Forming the Same
- Publication number 20180025959
- Publication date Jan 25, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnection Structure with Confinement Layer
- Publication number 20170271242
- Publication date Sep 21, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao Yun Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORROSION RESISTANT ALUMINUM BOND PAD STRUCTURE
- Publication number 20160379948
- Publication date Dec 29, 2016
- International Business Machines Corporation
- Charles L. ARVIN
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
SEMICONDUCTOR LIGHT-EMITTING DEVICE AND SEMICONDUCTOR LIGHT-EMITTIN...
- Publication number 20160163663
- Publication date Jun 9, 2016
- Samsung Electronics Co., Ltd.
- Gi-bum KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metallized electric component
- Publication number 20160056121
- Publication date Feb 25, 2016
- INFINEON TECHNOLOGIES AG
- Joachim MAHLER
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Through Silicon Via with Embedded Barrier Pad
- Publication number 20140287581
- Publication date Sep 25, 2014
- Yung-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING CONDUCTIVE PADS AND A METHOD OF MANUFAC...
- Publication number 20140131862
- Publication date May 15, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Cheng KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS, DEVICES, AND MATERIALS FOR METALLIZATION
- Publication number 20140054776
- Publication date Feb 27, 2014
- LAM RESEARCH CORPORATION
- Artur KOLICS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING STRUCTURE OF SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTUR...
- Publication number 20140021624
- Publication date Jan 23, 2014
- Takanori SEKIDO
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Package structure having at least one die with a plurality of taper...

Semiconductor structure and forming method therefor

Semiconductor structure having an anti-arcing pattern disposed on a...

Package with metal-insulator-metal capacitor and method of manufact...

Package structure having taper-shaped conductive pillar and method...

Semiconductor structure having an anti-arcing pattern disposed on a...

Package with metal-insulator-metal capacitor and method of manufact...

High bandwidth memory (HBM) bandwidth aggregation switch

Pad structure and integrated circuit die using the same

Integrated circuit packages and methods for forming the same

Non-destructive testing of integrated circuit chips

Corrosion resistant aluminum bond pad structure

Integrated circuit packages and methods for forming the same

Package with metal-insulator-metal capacitor and method of manufact...

Package with metal-insulator-metal capacitor and method of manufact...

Corrosion resistant aluminum bond pad structure

Integrated circuit packages and methods for forming the same

Interconnection structure with confinement layer

Package with metal-insulator-metal capacitor and method of manufact...

Corrosion resistant aluminum bond pad structure

Semiconductor packaging structure and manufacturing method for the...

Integrated circuit packages and methods for forming the same

Interconnection structure with confinement layer

Photosensitive resin composition, method for producing patterned cu...

Mounting structure of semiconductor device and method of manufactur...

Mounting structure of semiconductor device and method of manufactur...

Integrated circuit chip and fabrication method

Semiconductor device and method for manufacturing semiconductor device

Integrated circuit packages and methods for forming the same

Patents Applicationslast 30 patents

PACKAGE STRUCTURE

SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR STRUCTURE HAVING AN ANTI-ARCING PATTERN DISPOSED ON A...

PACKAGE STRUCTURE AND METHOD OF FORMING THEREOF

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE...

SEMICONDUCTOR STRUCTURE HAVING AN ANTI-ARCING PATTERN DISPOSED ON A...

SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREFOR

PACKAGE STRUCTURE HAVING TAPER-SHAPED CONDUCTIVE PILLAR AND METHOD...

PACKAGE WITH METAL-INSULATOR-METAL CAPACITOR AND METHOD OF MANUFACT...

SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING THE SAME

Integrated Circuit Packages and Methods for Forming the Same

PACKAGE WITH METAL-INSULATOR-METAL CAPACITOR AND METHOD OF MANUFACT...

PACKAGE WITH METAL-INSULATOR-METAL CAPACITOR AND METHOD OF MANUFACT...

CORROSION RESISTANT ALUMINUM BOND PAD STRUCTURE

NON-DESTRUCTIVE TESTING OF INTEGRATED CIRCUIT CHIPS

NON-DESTRUCTIVE TESTING OF INTEGRATED CIRCUIT CHIPS

HIGH BANDWIDTH MEMORY (HBM) BANDWIDTH AGGREGATION SWITCH

Integrated Circuit Packages and Methods for Forming the Same

SEMICONDUCTOR DEVICE AND BALL BONDER

CORROSION RESISTANT ALUMINUM BOND PAD STRUCTURE

Integrated Circuit Packages and Methods for Forming the Same

Interconnection Structure with Confinement Layer

CORROSION RESISTANT ALUMINUM BOND PAD STRUCTURE

SEMICONDUCTOR LIGHT-EMITTING DEVICE AND SEMICONDUCTOR LIGHT-EMITTIN...

Metallized electric component

Through Silicon Via with Embedded Barrier Pad

SEMICONDUCTOR DEVICE HAVING CONDUCTIVE PADS AND A METHOD OF MANUFAC...

METHODS, DEVICES, AND MATERIALS FOR METALLIZATION

MOUNTING STRUCTURE OF SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTUR...