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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/05099
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor structure and forming method therefor
Patent number
11,967,571
Issue date
Apr 23, 2024
Fujian Jinhua Integrated Circuit Co., Ltd.
Yi-Wang Jhan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure having an anti-arcing pattern disposed on a...
Patent number
11,769,704
Issue date
Sep 26, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Sheng-An Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package with metal-insulator-metal capacitor and method of manufact...
Patent number
11,581,250
Issue date
Feb 14, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Shuo-Mao Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure having taper-shaped conductive pillar and method...
Patent number
11,508,633
Issue date
Nov 22, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Hung-Jui Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure having an anti-arcing pattern disposed on a...
Patent number
11,251,100
Issue date
Feb 15, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Sheng-An Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package with metal-insulator-metal capacitor and method of manufact...
Patent number
10,971,441
Issue date
Apr 6, 2021
Taiwan Semiconductor Manufacturing Co., Ltd
Shuo-Mao Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High bandwidth memory (HBM) bandwidth aggregation switch
Patent number
10,916,516
Issue date
Feb 9, 2021
Xilinx, Inc.
Martin Newman
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Pad structure and integrated circuit die using the same
Patent number
10,910,330
Issue date
Feb 2, 2021
Mediatek Inc.
Chun-Liang Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit packages and methods for forming the same
Patent number
10,770,366
Issue date
Sep 8, 2020
Taiwan Semiconductor Manufacturing Company, Ltd.
Chia-Wei Tu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Non-destructive testing of integrated circuit chips
Patent number
10,651,099
Issue date
May 12, 2020
International Business Machines Corporation
David W. Abraham
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Corrosion resistant aluminum bond pad structure
Patent number
10,615,137
Issue date
Apr 7, 2020
International Business Machines Corporation
Charles L. Arvin
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information
Patent Grant
Integrated circuit packages and methods for forming the same
Patent number
10,510,635
Issue date
Dec 17, 2019
Taiwan Semiconductor Manufacturing Company, Ltd.
Chia-Wei Tu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package with metal-insulator-metal capacitor and method of manufact...
Patent number
10,475,731
Issue date
Nov 12, 2019
Taiwan Semiconductor Manufacturing Co., Ltd.
Shuo-Mao Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package with metal-insulator-metal capacitor and method of manufact...
Patent number
10,276,484
Issue date
Apr 30, 2019
Taiwan Semiconductor Manufacturing Co., Ltd.
Shuo-Mao Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Corrosion resistant aluminum bond pad structure
Patent number
10,204,877
Issue date
Feb 12, 2019
International Business Machines Corporation
Charles L. Arvin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit packages and methods for forming the same
Patent number
10,056,312
Issue date
Aug 21, 2018
Taiwan Semiconductor Manufacturing Company, Ltd.
Chia-Wei Tu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interconnection structure with confinement layer
Patent number
10,032,698
Issue date
Jul 24, 2018
Taiwan Semiconductor Manufacturing Company
Hsiao Yun Lo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package with metal-insulator-metal capacitor and method of manufact...
Patent number
9,960,106
Issue date
May 1, 2018
Taiwan Semiconductor Manufacturing Co., Ltd.
Shuo-Mao Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Corrosion resistant aluminum bond pad structure
Patent number
9,953,940
Issue date
Apr 24, 2018
International Business Machines Corporation
Charles L. Arvin
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information
Patent Grant
Semiconductor packaging structure and manufacturing method for the...
Patent number
9,892,988
Issue date
Feb 13, 2018
Dawning Leading Technology Inc.
Yu-Shan Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit packages and methods for forming the same
Patent number
9,780,009
Issue date
Oct 3, 2017
Taiwan Semiconductor Manufacturing Company, Ltd.
Chia-Wei Tu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interconnection structure with confinement layer
Patent number
9,673,132
Issue date
Jun 6, 2017
Taiwan Semiconductor Manufacting Company, Ltd.
Hsiao Yun Lo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Photosensitive resin composition, method for producing patterned cu...
Patent number
9,633,848
Issue date
Apr 25, 2017
Hitachi Chemical Company, Ltd.
Yu Aoki
G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information
Patent Grant
Mounting structure of semiconductor device and method of manufactur...
Patent number
9,583,416
Issue date
Feb 28, 2017
Olympus Corporation
Takanori Sekido
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Mounting structure of semiconductor device and method of manufactur...
Patent number
9,490,191
Issue date
Nov 8, 2016
Olympus Corporation
Takanori Sekido
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit chip and fabrication method
Patent number
9,455,239
Issue date
Sep 27, 2016
STMicroelectronics (Crolles 2) SAS
Laurent-Luc Chapelon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method for manufacturing semiconductor device
Patent number
9,263,406
Issue date
Feb 16, 2016
Rohm Co., Ltd.
Hiroshi Okumura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit packages and methods for forming the same
Patent number
9,196,532
Issue date
Nov 24, 2015
Taiwan Semiconductor Manufacturing Company, Ltd.
Chia-Wei Tu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of manufacturing semiconductor device
Patent number
9,159,607
Issue date
Oct 13, 2015
Renesas Electronics Corporation
Satoshi Uno
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having conductive pads and a method of manufac...
Patent number
9,129,818
Issue date
Sep 8, 2015
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Cheng Kuo
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR STRUCTURE HAVING AN ANTI-ARCING PATTERN DISPOSED ON A...
Publication number
20230360986
Publication date
Nov 9, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Sheng-An Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THEREOF
Publication number
20230054148
Publication date
Feb 23, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Hung-Jui Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20220199778
Publication date
Jun 23, 2022
Sumitomo Electric Industries, Ltd.
Taku HORII
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE...
Publication number
20220199476
Publication date
Jun 23, 2022
MITSUBISHI ELECTRIC CORPORATION
Ryuichiro HANADA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE HAVING AN ANTI-ARCING PATTERN DISPOSED ON A...
Publication number
20220165633
Publication date
May 26, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Sheng-An Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREFOR
Publication number
20210407936
Publication date
Dec 30, 2021
Yi-Wang JHAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE HAVING TAPER-SHAPED CONDUCTIVE PILLAR AND METHOD...
Publication number
20210375708
Publication date
Dec 2, 2021
Taiwan Semiconductor Manufacturing Co., Ltd.
Hung-Jui Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE WITH METAL-INSULATOR-METAL CAPACITOR AND METHOD OF MANUFACT...
Publication number
20210217691
Publication date
Jul 15, 2021
Taiwan Semiconductor Manufacturing Co., LTD
Shuo-Mao Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING THE SAME
Publication number
20210090966
Publication date
Mar 25, 2021
Taiwan Semiconductor Manufacturing Co., Ltd.
Sheng-An Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated Circuit Packages and Methods for Forming the Same
Publication number
20200091027
Publication date
Mar 19, 2020
Taiwan Semiconductor Manufacturing Company, Ltd.
Chia-Wei Tu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE WITH METAL-INSULATOR-METAL CAPACITOR AND METHOD OF MANUFACT...
Publication number
20200020623
Publication date
Jan 16, 2020
Taiwan Semiconductor Manufacturing Co., LTD
Shuo-Mao Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE WITH METAL-INSULATOR-METAL CAPACITOR AND METHOD OF MANUFACT...
Publication number
20190229048
Publication date
Jul 25, 2019
Taiwan Semiconductor Manufacturing Co., LTD
Shuo-Mao Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CORROSION RESISTANT ALUMINUM BOND PAD STRUCTURE
Publication number
20190139919
Publication date
May 9, 2019
International Business Machines Corporation
Charles L. ARVIN
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information
Patent Application
NON-DESTRUCTIVE TESTING OF INTEGRATED CIRCUIT CHIPS
Publication number
20190013252
Publication date
Jan 10, 2019
International Business Machines Corporation
David W. Abraham
G01 - MEASURING TESTING
Information
Patent Application
NON-DESTRUCTIVE TESTING OF INTEGRATED CIRCUIT CHIPS
Publication number
20190013251
Publication date
Jan 10, 2019
International Business Machines Corporation
David W. Abraham
G01 - MEASURING TESTING
Information
Patent Application
HIGH BANDWIDTH MEMORY (HBM) BANDWIDTH AGGREGATION SWITCH
Publication number
20180358313
Publication date
Dec 13, 2018
Xilinx, Inc.
Martin Newman
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
Integrated Circuit Packages and Methods for Forming the Same
Publication number
20180308778
Publication date
Oct 25, 2018
Taiwan Semiconductor Manufacturing Company, Ltd.
Chia-Wei Tu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND BALL BONDER
Publication number
20180294243
Publication date
Oct 11, 2018
SII Semiconductor Corporation
Tomomitsu RISAKI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CORROSION RESISTANT ALUMINUM BOND PAD STRUCTURE
Publication number
20180174988
Publication date
Jun 21, 2018
International Business Machines Corporation
Charles L. ARVIN
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information
Patent Application
Integrated Circuit Packages and Methods for Forming the Same
Publication number
20180025959
Publication date
Jan 25, 2018
Taiwan Semiconductor Manufacturing Company, Ltd.
Chia-Wei Tu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Interconnection Structure with Confinement Layer
Publication number
20170271242
Publication date
Sep 21, 2017
Taiwan Semiconductor Manufacturing Company, Ltd.
Hsiao Yun Lo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CORROSION RESISTANT ALUMINUM BOND PAD STRUCTURE
Publication number
20160379948
Publication date
Dec 29, 2016
International Business Machines Corporation
Charles L. ARVIN
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information
Patent Application
SEMICONDUCTOR LIGHT-EMITTING DEVICE AND SEMICONDUCTOR LIGHT-EMITTIN...
Publication number
20160163663
Publication date
Jun 9, 2016
Samsung Electronics Co., Ltd.
Gi-bum KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Metallized electric component
Publication number
20160056121
Publication date
Feb 25, 2016
INFINEON TECHNOLOGIES AG
Joachim MAHLER
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information
Patent Application
Through Silicon Via with Embedded Barrier Pad
Publication number
20140287581
Publication date
Sep 25, 2014
Yung-Chi Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE HAVING CONDUCTIVE PADS AND A METHOD OF MANUFAC...
Publication number
20140131862
Publication date
May 15, 2014
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Cheng KUO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS, DEVICES, AND MATERIALS FOR METALLIZATION
Publication number
20140054776
Publication date
Feb 27, 2014
LAM RESEARCH CORPORATION
Artur KOLICS
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MOUNTING STRUCTURE OF SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTUR...
Publication number
20140021624
Publication date
Jan 23, 2014
Takanori SEKIDO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Backside Processing of Semiconductor Devices
Publication number
20140015141
Publication date
Jan 16, 2014
Infineon Technoloiges AG
Mark Harrison
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated Circuit Packages and Methods for Forming the Same
Publication number
20130341800
Publication date
Dec 26, 2013
Taiwan Semiconductor Manufacturing Company, Ltd.
Chia-Wei Tu
H01 - BASIC ELECTRIC ELEMENTS