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H01L2224/495

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/495Material

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with metal film on surface between passivation...
- Patent number 12,057,416
- Issue date Aug 6, 2024
- Sumitomo Electric Industries, Ltd.
- Mitsuhiko Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi wire bonding with current sensing method
- Patent number 11,519,943
- Issue date Dec 6, 2022
- Semiconductor Components Industries, LLC
- Hiroshi Inoguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging
- Patent number 11,227,852
- Issue date Jan 18, 2022
- Texas Instruments Incorporated
- Honglin Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor module and semiconductor module
- Patent number 11,037,847
- Issue date Jun 15, 2021
- Renesas Electronics Corporation
- Kuniharu Muto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,825,758
- Issue date Nov 3, 2020
- Rohm Co., Ltd.
- Shoji Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 10,629,520
- Issue date Apr 21, 2020
- Rohm Co., Ltd.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging
- Patent number 10,629,562
- Issue date Apr 21, 2020
- Texas Instruments Incorporated
- Honglin Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, and method for manufacturing semiconductor de...
- Patent number 10,586,755
- Issue date Mar 10, 2020
- Rohm Co., Ltd.
- Yuto Nishiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of packaging power semiconductor module including power tran...
- Patent number 10,566,258
- Issue date Feb 18, 2020
- Renesas Electronics Corporation
- Kuniharu Muto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,504,822
- Issue date Dec 10, 2019
- Rohm Co., Ltd.
- Shoji Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,431,529
- Issue date Oct 1, 2019
- Rohm Co., Ltd.
- Shoji Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer chipset structure
- Patent number 10,062,676
- Issue date Aug 28, 2018
- Hsiu Hui Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device and method of manufacturing the same
- Patent number 9,716,072
- Issue date Jul 25, 2017
- Mitsubishi Electric Corporation
- Hiroshi Kawashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,653,377
- Issue date May 16, 2017
- Rohm Co., Ltd.
- Shoji Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer arrangement, a method for testing a wafer, and a method for p...
- Patent number 9,627,341
- Issue date Apr 18, 2017
- Infineon Technologies Dresden GmbH
- Peter Brockhaus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,613,883
- Issue date Apr 4, 2017
- Rohm Co., Ltd.
- Shoji Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packaging having plurality of wires bonding to...
- Patent number 9,536,859
- Issue date Jan 3, 2017
- Rohm Co., Ltd.
- Hiroyuki Kaneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,397,037
- Issue date Jul 19, 2016
- Rohm Co., Ltd.
- Shoji Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid semiconductor package
- Patent number 9,373,577
- Issue date Jun 21, 2016
- Infineon Technologies AG
- Alexander Komposch
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,177,833
- Issue date Nov 3, 2015
- Renesas Electronics Corporation
- Takuya Nakajo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,147,647
- Issue date Sep 29, 2015
- Renesas Electronics Corporation
- Yoshiharu Kaneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 8,922,028
- Issue date Dec 30, 2014
- Advanced Semiconductor Engineering, Inc.
- Sung-Ching Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component employing a layered frame
- Patent number 8,703,544
- Issue date Apr 22, 2014
- Infineon Technologies AG
- Wu Hu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High temperature interconnect assemblies for high temperature elect...
- Patent number 8,704,356
- Issue date Apr 22, 2014
- Kulite Semiconductor Products, Inc.
- Alex A. Ned
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Brace for bond wire
- Patent number 8,680,660
- Issue date Mar 25, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Lai Cheng Law
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method therefor
- Patent number 8,395,248
- Issue date Mar 12, 2013
- Sharp Kabushiki Kaisha
- Yoshiaki Nozaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component with layered frame
- Patent number 8,125,060
- Issue date Feb 28, 2012
- Infineon Technologies AG
- Wu Hu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method for designing the same and recording m...
- Patent number 7,250,686
- Issue date Jul 31, 2007
- Matsushita Electric Industrial Co., Ltd.
- Yasuhiro Ishiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component and production method suitable therefor
- Patent number 7,161,234
- Issue date Jan 9, 2007
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component incorporating solder fuse wire
- Patent number 5,644,281
- Issue date Jul 1, 1997
- Rohm Co., Ltd.
- Chojiro Kuriyama
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240421022
- Publication date Dec 19, 2024
- ROHM CO., LTD.
- Hirokatsu UMEGAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE FOR AUDIO
- Publication number 20240304591
- Publication date Sep 12, 2024
- ROHM CO., LTD.
- YOSUKE SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER ELECTRONICS ARRANGEMENT WITH PARALLEL CONNECTED SEMICONDUCTOR...
- Publication number 20230387099
- Publication date Nov 30, 2023
- Audi AG
- Roman Strasser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI WIRE BONDING WITH CURRENT SENSING METHOD
- Publication number 20220137102
- Publication date May 5, 2022
- Semiconductor Components Industries, LLC
- Hiroshi INOGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING
- Publication number 20200251440
- Publication date Aug 6, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Honglin GUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190378787
- Publication date Dec 12, 2019
- ROHM CO., LTD.
- Shoji YASUNAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING
- Publication number 20190206828
- Publication date Jul 4, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Honglin GUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR MODULE AND SEMICONDUCTOR MODULE
- Publication number 20190006258
- Publication date Jan 3, 2019
- RENESAS ELECTRONICS CORPORATION
- Kuniharu MUTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME-LESS SURFACE MOUNT SEMICONDUCTOR DEVICE
- Publication number 20180102287
- Publication date Apr 12, 2018
- Nexperia B.V.
- EUGENE PUMANES SANTOS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20150255369
- Publication date Sep 10, 2015
- ROHM CO., LTD.
- Shoji YASUNAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20150255425
- Publication date Sep 10, 2015
- ROHM CO., LTD.
- Hiroyuki KANEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER ARRANGEMENT, A METHOD FOR TESTING A WAFER, AND A METHOD FOR P...
- Publication number 20150115444
- Publication date Apr 30, 2015
- INFINEON TECHNOLOGIES DRESDEN GMBH
- Peter Brockhaus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hybrid Semiconductor Package
- Publication number 20140346637
- Publication date Nov 27, 2014
- Alexander Komposch
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140312514
- Publication date Oct 23, 2014
- Shoji Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140284784
- Publication date Sep 25, 2014
- ROHM CO., LTD.
- Shoji YASUNAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140124912
- Publication date May 8, 2014
- RENESAS ELECTRONICS CORPORATION
- Yoshiharu Kaneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH TEMPERATURE INTERCONNECT ASSEMBLIES FOR HIGH TEMPERATURE ELECT...
- Publication number 20140048936
- Publication date Feb 20, 2014
- Kulite Semiconductor Products, Inc.
- Alex Ned
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20130334687
- Publication date Dec 19, 2013
- Hiroyuki KANEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130228907
- Publication date Sep 5, 2013
- RENESAS ELECTRONICS CORPORATION
- Takuya NAKAJO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Small-Outline Package for a Power Transistor
- Publication number 20130049079
- Publication date Feb 28, 2013
- INTERNATIONAL RECTIFIER CORPORATION
- Jorge Munoz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE
- Publication number 20130001805
- Publication date Jan 3, 2013
- Katsunori AZUMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20120156832
- Publication date Jun 21, 2012
- INFINEON TECHNOLOGIES AG
- Wu Hu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20110193209
- Publication date Aug 11, 2011
- Advanced Semiconductor Engineering, Inc.
- Sung-Ching Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20100244213
- Publication date Sep 30, 2010
- Yoshiaki NOZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic component
- Publication number 20080135995
- Publication date Jun 12, 2008
- Wu Hu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20080073786
- Publication date Mar 27, 2008
- Matsushita Electric Industrial Co., Ltd.
- Manabu Tanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device, method for designing the same and recording m...
- Publication number 20060197212
- Publication date Sep 7, 2006
- Matsushita Electric Industrial Co., Ltd.
- Yasuhiro Ishiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor component and production method suitable therefor
- Publication number 20050082679
- Publication date Apr 21, 2005
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device, method for designing the same and recording m...
- Publication number 20030155635
- Publication date Aug 21, 2003
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Yasuhiro Ishiyama
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device with metal film on surface between passivation...

Multi wire bonding with current sensing method

Integrated circuit packaging

Method of manufacturing semiconductor module and semiconductor module

Semiconductor device

Semiconductor device and method for manufacturing the same

Integrated circuit packaging

Semiconductor device, and method for manufacturing semiconductor de...

Method of packaging power semiconductor module including power tran...

Semiconductor device

Semiconductor device

Multilayer chipset structure

Power semiconductor device and method of manufacturing the same

Semiconductor device

Wafer arrangement, a method for testing a wafer, and a method for p...

Semiconductor device

Semiconductor device packaging having plurality of wires bonding to...

Semiconductor device

Hybrid semiconductor package

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing the same

Semiconductor package

Electronic component employing a layered frame

High temperature interconnect assemblies for high temperature elect...

Brace for bond wire

Semiconductor device and manufacturing method therefor

Electronic component with layered frame

Semiconductor device, method for designing the same and recording m...

Semiconductor component and production method suitable therefor

Electronic component incorporating solder fuse wire

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE FOR AUDIO

POWER ELECTRONICS ARRANGEMENT WITH PARALLEL CONNECTED SEMICONDUCTOR...

MULTI WIRE BONDING WITH CURRENT SENSING METHOD

INTEGRATED CIRCUIT PACKAGING

SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT PACKAGING

METHOD OF MANUFACTURING SEMICONDUCTOR MODULE AND SEMICONDUCTOR MODULE

LEADFRAME-LESS SURFACE MOUNT SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

WAFER ARRANGEMENT, A METHOD FOR TESTING A WAFER, AND A METHOD FOR P...

Hybrid Semiconductor Package

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

HIGH TEMPERATURE INTERCONNECT ASSEMBLIES FOR HIGH TEMPERATURE ELECT...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Small-Outline Package for a Power Transistor

POWER SEMICONDUCTOR MODULE

ELECTRONIC COMPONENT

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

Electronic component

Semiconductor device and method of manufacturing the same

Semiconductor device, method for designing the same and recording m...

Semiconductor component and production method suitable therefor

Semiconductor device, method for designing the same and recording m...