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H01L2224/75985

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/75985Material

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 12,159,856
- Issue date Dec 3, 2024
- Kioxia Corporation
- Satoshi Tsukiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier for microelectronic assemblies having direct bonding
- Patent number 12,142,510
- Issue date Nov 12, 2024
- Intel Corporation
- Shawna M. Liff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low warpage curing methodology by inducing curvature
- Patent number 11,929,260
- Issue date Mar 12, 2024
- Applied Materials, Inc.
- Fang Jie Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding wafers and bonding tool
- Patent number 10,872,873
- Issue date Dec 22, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sintering tool for the lower die of a sintering device
- Patent number 10,818,633
- Issue date Oct 27, 2020
- Danfoss Silicon Power GmbH
- Frank Osterwald
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Mounted substrate, mounted-substrate production method, and mounted...
- Patent number 10,136,570
- Issue date Nov 20, 2018
- Sharp Kabushiki Kaisha
- Katsuhiro Yamaguchi
- G02 - OPTICS
Information Patent Grant
Two-step direct bonding processes and tools for performing the same
- Patent number 9,521,795
- Issue date Dec 13, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Li Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of joining a chip on a substrate
- Patent number 9,393,633
- Issue date Jul 19, 2016
- GLOBALFOUNDRIES Inc.
- Pascal P Blais
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Buffer film for multi-chip packaging
- Patent number 8,758,546
- Issue date Jun 24, 2014
- Dexerials Corporation
- Akira Ishigami
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method of manufacturing electronic device and electronic device
- Patent number 8,389,328
- Issue date Mar 5, 2013
- Sumitomo Bakelite Co., Ltd.
- Toru Meura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding apparatus and bonding method
- Patent number 8,286,853
- Issue date Oct 16, 2012
- Tokyo Electron Limited
- Naoki Akiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus
- Patent number 8,210,417
- Issue date Jul 3, 2012
- Tokyo Electron Limited
- Naoki Akiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding method, bonding stage and electronic component packaging ap...
- Patent number 6,991,703
- Issue date Jan 31, 2006
- Sumitomo Osaka Cement Co., Ltd.
- Takeshi Ootsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3713575
- Patent number 3,713,575
- Issue date Jan 30, 1973
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
BONDING TOOL OF FLIP CHIP LASER BONDING APPARATUS
- Publication number 20240258265
- Publication date Aug 1, 2024
- Mi Equipment Korea Co., Ltd
- Hyun Gu Kang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMOCOMPRESSION BONDING TOOL FOR PANEL-LEVEL THERMO-COMPRESSION B...
- Publication number 20240186280
- Publication date Jun 6, 2024
- Intel Corporation
- Minglu LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND HEAD DESIGN FOR THERMAL COMPRESSION BONDING
- Publication number 20230317676
- Publication date Oct 5, 2023
- Intel Corporation
- Michael Baker
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING DEVICE AND ADJUSTMENT METHOD FOR BONDING HEAD
- Publication number 20230197670
- Publication date Jun 22, 2023
- SHINKAWA LTD.
- ALEXANDER Dzhangirov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230076668
- Publication date Mar 9, 2023
- KIOXIA Corporation
- Satoshi TSUKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER FOR MICROELECTRONIC ASSEMBLIES HAVING DIRECT BONDING
- Publication number 20220199450
- Publication date Jun 23, 2022
- Intel Corporation
- Shawna M. Liff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING WAFERS AND BONDING TOOL
- Publication number 20190148333
- Publication date May 16, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Chih CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Two-Step Direct Bonding Processes and Tools for Performing the Same
- Publication number 20140263583
- Publication date Sep 18, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Li Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUFFER FILM FOR MULTI-CHIP PACKAGING
- Publication number 20140248477
- Publication date Sep 4, 2014
- DEXERIALS CORPORATION
- Akira Ishigami
- B32 - LAYERED PRODUCTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20130234298
- Publication date Sep 12, 2013
- Kabushiki Kaisha Toshiba
- Satoshi MITSUGI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BUFFER FILM FOR MULTI-CHIP PACKAGING
- Publication number 20130092310
- Publication date Apr 18, 2013
- DEXERIALS CORPORATION
- Akira Ishigami
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD OF JOINING A CHIP ON A SUBSTRATE
- Publication number 20120292375
- Publication date Nov 22, 2012
- International Business Machines Corporation
- Pascal P. Blais
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING APPARATUS
- Publication number 20120091186
- Publication date Apr 19, 2012
- TOKYO ELECTRON LIMITED
- Naoki AKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20120091187
- Publication date Apr 19, 2012
- TOKYO ELECTRON LIMITED
- Naoki AKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER HEATING APPARATUS FOR METAL EUTECTIC BONDING
- Publication number 20110309057
- Publication date Dec 22, 2011
- TOUCH MICRO-SYSTEM TECHNOLOGY CORP.
- Hung Yi LIN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC DEVICE AND ELECTRONIC DEVICE
- Publication number 20110221075
- Publication date Sep 15, 2011
- SUMITOMO BAKELITE CO., LTD.
- Toru Meura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF JOINING A CHIP ON A SUBSTRATE
- Publication number 20110049221
- Publication date Mar 3, 2011
- International Business Machines Corporation
- Pascal P. Blais
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bonding method, bonding stage and electronic component packaging ap...
- Publication number 20040063251
- Publication date Apr 1, 2004
- Sumitomo Osaka Cement Co., Ltd.
- Takeshi Ootsuka
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for manufacturing semiconductor device

Carrier for microelectronic assemblies having direct bonding

Low warpage curing methodology by inducing curvature

Method for bonding wafers and bonding tool

Sintering tool for the lower die of a sintering device

Mounted substrate, mounted-substrate production method, and mounted...

Two-step direct bonding processes and tools for performing the same

Method of joining a chip on a substrate

Buffer film for multi-chip packaging

Method of manufacturing electronic device and electronic device

Bonding apparatus and bonding method

Bonding apparatus

Bonding method, bonding stage and electronic component packaging ap...

3713575

Patents Applicationslast 30 patents

BONDING TOOL OF FLIP CHIP LASER BONDING APPARATUS

THERMOCOMPRESSION BONDING TOOL FOR PANEL-LEVEL THERMO-COMPRESSION B...

BOND HEAD DESIGN FOR THERMAL COMPRESSION BONDING

BONDING DEVICE AND ADJUSTMENT METHOD FOR BONDING HEAD

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

CARRIER FOR MICROELECTRONIC ASSEMBLIES HAVING DIRECT BONDING

METHOD FOR BONDING WAFERS AND BONDING TOOL

Two-Step Direct Bonding Processes and Tools for Performing the Same

BUFFER FILM FOR MULTI-CHIP PACKAGING

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

BUFFER FILM FOR MULTI-CHIP PACKAGING

METHOD OF JOINING A CHIP ON A SUBSTRATE

BONDING APPARATUS

BONDING APPARATUS AND BONDING METHOD

LASER HEATING APPARATUS FOR METAL EUTECTIC BONDING

METHOD OF MANUFACTURING ELECTRONIC DEVICE AND ELECTRONIC DEVICE

METHOD OF JOINING A CHIP ON A SUBSTRATE

Bonding method, bonding stage and electronic component packaging ap...