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CPC
H05K2201/032

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/032Materials

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Wiring structure, method for manufacturing same, and semiconductor...
- Patent number 12,114,437
- Issue date Oct 8, 2024
- Resonac Corporation
- Masaya Toba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulated circuit board
- Patent number 12,089,342
- Issue date Sep 10, 2024
- Mitsubishi Materials Corporation
- Akira Sakurai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal circuit structure based on FPC and method of making the same
- Patent number 12,089,331
- Issue date Sep 10, 2024
- APLUS SEMICONDUCTOR TECHNOLOGIES CO., LTD.
- Cheng-Neng Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Micro assembled LED displays and lighting elements
- Patent number 12,080,690
- Issue date Sep 3, 2024
- X Display Company Technology Limited
- Christopher Bower
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Devices and methods to improve thermal conduction from SMT and chip...
- Patent number 12,082,334
- Issue date Sep 3, 2024
- Hamilton Sundstrand Corporation
- John Dickey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component on flexible substrate
- Patent number 12,069,808
- Issue date Aug 20, 2024
- Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Margaretha Maria De Kok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing microelectrode film
- Patent number 12,063,749
- Issue date Aug 13, 2024
- BOE Technology Group Co., Ltd.
- Fan Li
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Resin multilayer substrate
- Patent number 12,052,818
- Issue date Jul 30, 2024
- Murata Manufacturing Co., Ltd.
- Atsushi Kasuya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Transparent conductive film
- Patent number 12,046,392
- Issue date Jul 23, 2024
- Chasm Advanced Materials Inc.
- Robert F. Praino
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Base material for printed circuit board and method of manufacturing...
- Patent number 12,016,132
- Issue date Jun 18, 2024
- Sumitomo Electric Industries, Ltd.
- Kayo Hashizume
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and system of surface wave mitigation for multiple-input-...
- Patent number 12,013,481
- Issue date Jun 18, 2024
- Intel Corporation
- Arnaud Lucres Amadjikpe
- G01 - MEASURING TESTING
Information Patent Grant
Substrate for mounting electronic element, electronic device, and e...
- Patent number 12,004,293
- Issue date Jun 4, 2024
- Kyocera Corporation
- Yukio Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing transparent circuit board
- Patent number 11,950,371
- Issue date Apr 2, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Cheng-Jia Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure for embedding and packaging multiple devices by layer and...
- Patent number 11,903,133
- Issue date Feb 13, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical interconnect with conductive polymer contacts having tip...
- Patent number 11,894,629
- Issue date Feb 6, 2024
- Tyco Electronics Japan G.K.
- John Joseph Consoli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer wiring substrate
- Patent number 11,864,313
- Issue date Jan 2, 2024
- Murata Manufacturing Co., Ltd.
- Atsushi Kishimoto
- B32 - LAYERED PRODUCTS
Information Patent Grant
Micro assembled LED displays and lighting elements
- Patent number 11,854,788
- Issue date Dec 26, 2023
- X Display Company Technology Limited
- Christopher Bower
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Circuit board
- Patent number 11,832,385
- Issue date Nov 28, 2023
- Dongwoo Fine-Chem Co., Ltd.
- Ki Joon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder composition for use in solder joints of printed circuit boards
- Patent number 11,832,386
- Issue date Nov 28, 2023
- Dell Products L.P.
- Deeder M. Aurongzeb
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and a driving power supply with the circuit board the...
- Patent number 11,778,723
- Issue date Oct 3, 2023
- Self Electronics Co., Ltd.
- Zai Le
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting substrate to which image sensor is mounted, sensor package...
- Patent number 11,778,293
- Issue date Oct 3, 2023
- Canon Kabushiki Kaisha
- Dai Naito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive laminated structure and foldable electronic device
- Patent number 11,733,731
- Issue date Aug 22, 2023
- Cambrios Film Solutions Corporation
- Yi-Chen Tsai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Molded interconnect device
- Patent number 11,728,065
- Issue date Aug 15, 2023
- Ticona LLC
- Young Shin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 11,715,579
- Issue date Aug 1, 2023
- Ticona LLC
- Young Shin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Providing one or more carbon layers to a copper conductive material...
- Patent number 11,706,870
- Issue date Jul 18, 2023
- Cisco Technology, Inc.
- Joel Goergen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure
- Patent number 11,690,173
- Issue date Jun 27, 2023
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure and manufacturing method thereof
- Patent number 11,641,713
- Issue date May 2, 2023
- Unimicron Technology Corp.
- Chun-Hung Kuo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin flux solder paste and mount structure
- Patent number 11,623,307
- Issue date Apr 11, 2023
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hirohisa Hino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate for mounting electronic element, electronic device, and e...
- Patent number 11,612,056
- Issue date Mar 21, 2023
- Kyocera Corporation
- Yukio Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and system of surface wave mitigation for multiple-input-...
- Patent number 11,598,842
- Issue date Mar 7, 2023
- Intel Corporation
- Arnaud Lucres Amadjikpe
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240431031
- Publication date Dec 26, 2024
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME
- Publication number 20240407095
- Publication date Dec 5, 2024
- LG Innotek Co., Ltd.
- Han Sang KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240407086
- Publication date Dec 5, 2024
- Sumitomo Electric Industries, Ltd.
- Yukie TSUDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING STRUCTURE, METHOD FOR MANUFACTURING SAME, AND SEMICONDUCTOR...
- Publication number 20240397635
- Publication date Nov 28, 2024
- Resonac Corporation
- Masaya TOBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL INTERCONNECT BOARD FOR A BATTERY MODULE WITH INTEGRATED...
- Publication number 20240356168
- Publication date Oct 24, 2024
- Airbus SAS
- Alois FRIEDBERGER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CURABLE ADHESIVE COMPOSITION, FILMY ADHESIVE, METHOD FOR PRODUCING...
- Publication number 20240352287
- Publication date Oct 24, 2024
- Resonac Corporation
- Masashi OHKOSHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Transparent Conductive Film
- Publication number 20240355501
- Publication date Oct 24, 2024
- Chasm Advanced Materials, Inc.
- Robert F. Praino
- B82 - NANO-TECHNOLOGY
Information Patent Application
ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240349426
- Publication date Oct 17, 2024
- Murata Manufacturing Co., Ltd.
- Atsushi SAKURAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL FOIL, CIRCUIT BOARD, AND METHOD FOR MANUFACTURING CIRCUIT BOARD
- Publication number 20240349423
- Publication date Oct 17, 2024
- GUANGZHOU FANGBANG ELECTRONICS CO., LTD.
- Meijuan Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SILICON CARBIDE THERMAL BRIDGE INTEGRATED ON A LOW THERMAL CONDUCTI...
- Publication number 20240341026
- Publication date Oct 10, 2024
- Haedong JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240324103
- Publication date Sep 26, 2024
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240306299
- Publication date Sep 12, 2024
- IBIDEN CO., LTD.
- Toshiki FURUTANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240306296
- Publication date Sep 12, 2024
- IBIDEN CO., LTD.
- Toshiki FURUTANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240268038
- Publication date Aug 8, 2024
- IBIDEN CO., LTD.
- Susumu KAGOHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD MODULE AND ELECTRONIC DEVICE
- Publication number 20240260184
- Publication date Aug 1, 2024
- LG Innotek Co., Ltd.
- Seung Hyeong LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER CONVERSION DEVICE
- Publication number 20240251532
- Publication date Jul 25, 2024
- Hitachi Astemo, Ltd.
- Takeshi TOKUYAMA
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
DEVICES, SYSTEMS, AND METHODS FOR MAKING AND USING CIRCUIT ASSEMBLI...
- Publication number 20240237205
- Publication date Jul 11, 2024
- Liquid Wire, LLC
- Mark S. Kruskopf
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240215202
- Publication date Jun 27, 2024
- TMY Technology Inc.
- Pei-Hung Kuo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TRANSPARENT CIRCUIT BOARD
- Publication number 20240196541
- Publication date Jun 13, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- CHENG-JIA LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT SUBSTRATE HAVING IMPROVED BONDING STRUCTURE
- Publication number 20240188215
- Publication date Jun 6, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- LI-CHUN HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES, SYSTEMS, AND METHODS FOR MAKING AND USING HIGHLY SUSTAINAB...
- Publication number 20240147631
- Publication date May 2, 2024
- Liquid Wire, LLC
- Jorge E. Carbo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICES, SYSTEMS, AND METHODS FOR MAKING AND USING CIRCUIT ASSEMBLI...
- Publication number 20240138062
- Publication date Apr 25, 2024
- Liquid Wire, LLC
- Mark S. Kruskopf
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Depositing a Bronze Alloy on a Printed Circuit and Print...
- Publication number 20240117518
- Publication date Apr 11, 2024
- LINXENS HOLDING
- Jerome SANSON
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MODULE BOARD AND SEMICONDUCTOR MODULE HAVING THE SAME
- Publication number 20240074058
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- JAEKWANG LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INDUCED CIRCUITRY WITHIN A HARD DIAMOND-LIKE AND CARBON-RICH LAYER...
- Publication number 20240049385
- Publication date Feb 8, 2024
- SCHLUMBERGER TECHNOLOGY CORPORATION
- Alireza Zolfaghari
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD ARRANGEMENT COMPRISING A CIRCUIT BOARD PROVIDED WITH...
- Publication number 20230389176
- Publication date Nov 30, 2023
- Telefonaktiebolaget LM Ericsson (publ)
- Lackis ELEFTHERIADIS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE SUBSTRATE STRUCTURE
- Publication number 20230371187
- Publication date Nov 16, 2023
- AMAZING COOL TECHNOLOGY CORPORATION
- Shiann-Tsong TSAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICES AND METHODS TO IMPROVE THERMAL CONDUCTION FROM SMT AND CHIP...
- Publication number 20230337353
- Publication date Oct 19, 2023
- HAMILTON SUNDSTRAND CORPORATION
- John Dickey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Scalable, Printable, Patterned Sheet Of High Mobility Graphene On F...
- Publication number 20230337358
- Publication date Oct 19, 2023
- The Trustees of the University of Pennsylvania
- Alan T. Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR MOUNTING ELECTRONIC ELEMENT, ELECTRONIC DEVICE, AND E...
- Publication number 20230328885
- Publication date Oct 12, 2023
- Kyocera Corporation
- Yukio MORITA
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wiring structure, method for manufacturing same, and semiconductor...

Insulated circuit board

Metal circuit structure based on FPC and method of making the same

Micro assembled LED displays and lighting elements

Devices and methods to improve thermal conduction from SMT and chip...

Electronic component on flexible substrate

Method for manufacturing microelectrode film

Resin multilayer substrate

Transparent conductive film

Base material for printed circuit board and method of manufacturing...

Apparatus and system of surface wave mitigation for multiple-input-...

Substrate for mounting electronic element, electronic device, and e...

Method for manufacturing transparent circuit board

Structure for embedding and packaging multiple devices by layer and...

Electrical interconnect with conductive polymer contacts having tip...

Multilayer wiring substrate

Micro assembled LED displays and lighting elements

Circuit board

Solder composition for use in solder joints of printed circuit boards

Circuit board and a driving power supply with the circuit board the...

Mounting substrate to which image sensor is mounted, sensor package...

Conductive laminated structure and foldable electronic device

Molded interconnect device

Electronic device

Providing one or more carbon layers to a copper conductive material...

Circuit board structure

Circuit board structure and manufacturing method thereof

Resin flux solder paste and mount structure

Substrate for mounting electronic element, electronic device, and e...

Apparatus and system of surface wave mitigation for multiple-input-...

Patents Applicationslast 30 patents

PRINTED WIRING BOARD

CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME

PRINTED CIRCUIT BOARD

WIRING STRUCTURE, METHOD FOR MANUFACTURING SAME, AND SEMICONDUCTOR...

ELECTRICAL INTERCONNECT BOARD FOR A BATTERY MODULE WITH INTEGRATED...

CURABLE ADHESIVE COMPOSITION, FILMY ADHESIVE, METHOD FOR PRODUCING...

Transparent Conductive Film

ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME

METAL FOIL, CIRCUIT BOARD, AND METHOD FOR MANUFACTURING CIRCUIT BOARD

SILICON CARBIDE THERMAL BRIDGE INTEGRATED ON A LOW THERMAL CONDUCTI...

WIRING SUBSTRATE

WIRING SUBSTRATE

WIRING SUBSTRATE

PRINTED WIRING BOARD

PRINTED CIRCUIT BOARD MODULE AND ELECTRONIC DEVICE

POWER CONVERSION DEVICE

DEVICES, SYSTEMS, AND METHODS FOR MAKING AND USING CIRCUIT ASSEMBLI...

PACKAGE STRUCTURE

TRANSPARENT CIRCUIT BOARD

CIRCUIT SUBSTRATE HAVING IMPROVED BONDING STRUCTURE

DEVICES, SYSTEMS, AND METHODS FOR MAKING AND USING HIGHLY SUSTAINAB...

DEVICES, SYSTEMS, AND METHODS FOR MAKING AND USING CIRCUIT ASSEMBLI...

Method for Depositing a Bronze Alloy on a Printed Circuit and Print...

MODULE BOARD AND SEMICONDUCTOR MODULE HAVING THE SAME

INDUCED CIRCUITRY WITHIN A HARD DIAMOND-LIKE AND CARBON-RICH LAYER...

CIRCUIT BOARD ARRANGEMENT COMPRISING A CIRCUIT BOARD PROVIDED WITH...

PACKAGE SUBSTRATE STRUCTURE

DEVICES AND METHODS TO IMPROVE THERMAL CONDUCTION FROM SMT AND CHIP...

Scalable, Printable, Patterned Sheet Of High Mobility Graphene On F...

SUBSTRATE FOR MOUNTING ELECTRONIC ELEMENT, ELECTRONIC DEVICE, AND E...