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CPC
H05K2201/032

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

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H05K2201/032Materials

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electric circuit board and power module
- Patent number 12,349,299
- Issue date Jul 1, 2025
- Kyocera Corporation
- Yoshitada Konishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrochemical three-dimensional printing and soldering
- Patent number 12,320,028
- Issue date Jun 3, 2025
- University of South Florida
- Arash Takshi
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Providing one or more carbon layers to a copper conductive material...
- Patent number 12,289,831
- Issue date Apr 29, 2025
- Cisco Technology, Inc.
- Joel Goergen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adhesive sheet
- Patent number 12,286,573
- Issue date Apr 29, 2025
- MEKTEC CORPORATION
- Masayuki Iwase
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Printed circuit board and electronic device including same
- Patent number 12,245,373
- Issue date Mar 4, 2025
- ASUSTeK COMPUTER Inc.
- Ping-Han Tsou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method for manufacturing the same
- Patent number 12,238,852
- Issue date Feb 25, 2025
- Avary Holding (Shenzhen) Co., Limited.
- Ying Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive paste and electronic device
- Patent number 12,224,081
- Issue date Feb 11, 2025
- BEIJING DREAM INK TECHNOLOGIES CO., LTD.
- Zhongwei Ren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board with polymer conductive members
- Patent number 12,200,865
- Issue date Jan 14, 2025
- BizLink International Corp.
- Shi-Jung Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate for mounting electronic element, electronic device, and e...
- Patent number 12,193,145
- Issue date Jan 7, 2025
- Kyocera Corporation
- Yukio Morita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring structure, method for manufacturing same, and semiconductor...
- Patent number 12,114,437
- Issue date Oct 8, 2024
- Resonac Corporation
- Masaya Toba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulated circuit board
- Patent number 12,089,342
- Issue date Sep 10, 2024
- Mitsubishi Materials Corporation
- Akira Sakurai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal circuit structure based on FPC and method of making the same
- Patent number 12,089,331
- Issue date Sep 10, 2024
- APLUS SEMICONDUCTOR TECHNOLOGIES CO., LTD.
- Cheng-Neng Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Micro assembled LED displays and lighting elements
- Patent number 12,080,690
- Issue date Sep 3, 2024
- X Display Company Technology Limited
- Christopher Bower
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Devices and methods to improve thermal conduction from SMT and chip...
- Patent number 12,082,334
- Issue date Sep 3, 2024
- Hamilton Sundstrand Corporation
- John Dickey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component on flexible substrate
- Patent number 12,069,808
- Issue date Aug 20, 2024
- Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Margaretha Maria De Kok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing microelectrode film
- Patent number 12,063,749
- Issue date Aug 13, 2024
- BOE Technology Group Co., Ltd.
- Fan Li
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Resin multilayer substrate
- Patent number 12,052,818
- Issue date Jul 30, 2024
- Murata Manufacturing Co., Ltd.
- Atsushi Kasuya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Transparent conductive film
- Patent number 12,046,392
- Issue date Jul 23, 2024
- Chasm Advanced Materials Inc.
- Robert F. Praino
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Base material for printed circuit board and method of manufacturing...
- Patent number 12,016,132
- Issue date Jun 18, 2024
- Sumitomo Electric Industries, Ltd.
- Kayo Hashizume
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and system of surface wave mitigation for multiple-input-...
- Patent number 12,013,481
- Issue date Jun 18, 2024
- Intel Corporation
- Arnaud Lucres Amadjikpe
- G01 - MEASURING TESTING
Information Patent Grant
Substrate for mounting electronic element, electronic device, and e...
- Patent number 12,004,293
- Issue date Jun 4, 2024
- Kyocera Corporation
- Yukio Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing transparent circuit board
- Patent number 11,950,371
- Issue date Apr 2, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Cheng-Jia Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure for embedding and packaging multiple devices by layer and...
- Patent number 11,903,133
- Issue date Feb 13, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical interconnect with conductive polymer contacts having tip...
- Patent number 11,894,629
- Issue date Feb 6, 2024
- Tyco Electronics Japan G.K.
- John Joseph Consoli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer wiring substrate
- Patent number 11,864,313
- Issue date Jan 2, 2024
- Murata Manufacturing Co., Ltd.
- Atsushi Kishimoto
- B32 - LAYERED PRODUCTS
Information Patent Grant
Micro assembled LED displays and lighting elements
- Patent number 11,854,788
- Issue date Dec 26, 2023
- X Display Company Technology Limited
- Christopher Bower
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Circuit board
- Patent number 11,832,385
- Issue date Nov 28, 2023
- Dongwoo Fine-Chem Co., Ltd.
- Ki Joon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder composition for use in solder joints of printed circuit boards
- Patent number 11,832,386
- Issue date Nov 28, 2023
- Dell Products L.P.
- Deeder M. Aurongzeb
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and a driving power supply with the circuit board the...
- Patent number 11,778,723
- Issue date Oct 3, 2023
- Self Electronics Co., Ltd.
- Zai Le
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting substrate to which image sensor is mounted, sensor package...
- Patent number 11,778,293
- Issue date Oct 3, 2023
- Canon Kabushiki Kaisha
- Dai Naito
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CONDUCTIVE ADHESIVE LAYER AND HEAT DISSIPATION STRUCTURE
- Publication number 20250223471
- Publication date Jul 10, 2025
- Tatsuta Electric Wire & Cable Co., Ltd.
- Tomohiro NAGATAKE
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Printed Circuit Board For Battery Pack Capable Of Measuring Tempera...
- Publication number 20250227847
- Publication date Jul 10, 2025
- LG ENERGY SOLUTION, LTD.
- Sang Ok Seon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC TEXTILES AND SYSTEMS AND PROCESSES ASSOCIATED THEREWITH
- Publication number 20250215639
- Publication date Jul 3, 2025
- Purdue Research Foundation
- Chi Hwan Lee
- D10 - INDEXING SCHEME ASSOCIATED WITH SUBLASSES OF SECTION D, RELATING TO TEX...
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250212327
- Publication date Jun 26, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Kyeong Yub Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Scalable, Printable, Patterned Sheet Of High Mobility Graphene On F...
- Publication number 20250168977
- Publication date May 22, 2025
- The Trustees of the University of Pennsylvania
- Alan T. Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALLIZED VIAS IN GLASS AND SILICON SUBSTRATES, INTERPOSERS, AND M...
- Publication number 20250159807
- Publication date May 15, 2025
- Kuprion Inc.
- Alfred A. Zinn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250126718
- Publication date Apr 17, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Jae Ho Shin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250126715
- Publication date Apr 17, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Byung Hak KANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRETCHABLE DEVICE
- Publication number 20250120012
- Publication date Apr 10, 2025
- Murata Manufacturing Co., Ltd.
- Takayoshi Obata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROLESS SEED LAYER DEPOSITION ON GLASS CORE SUBSTRATES
- Publication number 20250106997
- Publication date Mar 27, 2025
- Intel Corporation
- Ehsan ZAMANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW STRESS THROUGH GLASS VIAS (TGVS)
- Publication number 20250089156
- Publication date Mar 13, 2025
- Intel Corporation
- Mohamed R. SABER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250089165
- Publication date Mar 13, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Seong Hun NA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and Apparatus of Conductive Hybrid Material Layer Stacks wit...
- Publication number 20250081341
- Publication date Mar 6, 2025
- Atlas Magnetics
- John Othniel McDonald
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT SPREADING COATING FOR ELECTRONIC ASSEMBLIES
- Publication number 20250071883
- Publication date Feb 27, 2025
- Elbit Systems Ltd.
- Reut BEN ZAKEN (BITTON)
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MEMBRANE CIRCUIT BOARD
- Publication number 20250063655
- Publication date Feb 20, 2025
- Primax Electronics Ltd.
- Lei-Lung Tsai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SMART WEARABLE CLOTHING INCLUDING STRETCHABLE CIRCUIT ELECTRODE AND...
- Publication number 20250063656
- Publication date Feb 20, 2025
- MIDAS H&T INC.
- Se Yun CHANG
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20250056721
- Publication date Feb 13, 2025
- HongQiSheng Precision Electronics (QinHuangdao) Co., Ltd.
- Cheng-Jia LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20250048562
- Publication date Feb 6, 2025
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240431031
- Publication date Dec 26, 2024
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME
- Publication number 20240407095
- Publication date Dec 5, 2024
- LG Innotek Co., Ltd.
- Han Sang KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240407086
- Publication date Dec 5, 2024
- Sumitomo Electric Industries, Ltd.
- Yukie TSUDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING STRUCTURE, METHOD FOR MANUFACTURING SAME, AND SEMICONDUCTOR...
- Publication number 20240397635
- Publication date Nov 28, 2024
- Resonac Corporation
- Masaya TOBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL INTERCONNECT BOARD FOR A BATTERY MODULE WITH INTEGRATED...
- Publication number 20240356168
- Publication date Oct 24, 2024
- Airbus SAS
- Alois FRIEDBERGER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transparent Conductive Film
- Publication number 20240355501
- Publication date Oct 24, 2024
- Chasm Advanced Materials, Inc.
- Robert F. Praino
- B82 - NANO-TECHNOLOGY
Information Patent Application
CURABLE ADHESIVE COMPOSITION, FILMY ADHESIVE, METHOD FOR PRODUCING...
- Publication number 20240352287
- Publication date Oct 24, 2024
- Resonac Corporation
- Masashi OHKOSHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240349426
- Publication date Oct 17, 2024
- Murata Manufacturing Co., Ltd.
- Atsushi SAKURAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL FOIL, CIRCUIT BOARD, AND METHOD FOR MANUFACTURING CIRCUIT BOARD
- Publication number 20240349423
- Publication date Oct 17, 2024
- GUANGZHOU FANGBANG ELECTRONICS CO., LTD.
- Meijuan Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SILICON CARBIDE THERMAL BRIDGE INTEGRATED ON A LOW THERMAL CONDUCTI...
- Publication number 20240341026
- Publication date Oct 10, 2024
- Haedong JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240324103
- Publication date Sep 26, 2024
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240306299
- Publication date Sep 12, 2024
- IBIDEN CO., LTD.
- Toshiki FURUTANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electric circuit board and power module

Electrochemical three-dimensional printing and soldering

Providing one or more carbon layers to a copper conductive material...

Adhesive sheet

Printed circuit board and electronic device including same

Circuit board and method for manufacturing the same

Conductive paste and electronic device

Circuit board with polymer conductive members

Substrate for mounting electronic element, electronic device, and e...

Wiring structure, method for manufacturing same, and semiconductor...

Insulated circuit board

Metal circuit structure based on FPC and method of making the same

Micro assembled LED displays and lighting elements

Devices and methods to improve thermal conduction from SMT and chip...

Electronic component on flexible substrate

Method for manufacturing microelectrode film

Resin multilayer substrate

Transparent conductive film

Base material for printed circuit board and method of manufacturing...

Apparatus and system of surface wave mitigation for multiple-input-...

Substrate for mounting electronic element, electronic device, and e...

Method for manufacturing transparent circuit board

Structure for embedding and packaging multiple devices by layer and...

Electrical interconnect with conductive polymer contacts having tip...

Multilayer wiring substrate

Micro assembled LED displays and lighting elements

Circuit board

Solder composition for use in solder joints of printed circuit boards

Circuit board and a driving power supply with the circuit board the...

Mounting substrate to which image sensor is mounted, sensor package...

Patents Applicationslast 30 patents

CONDUCTIVE ADHESIVE LAYER AND HEAT DISSIPATION STRUCTURE

Printed Circuit Board For Battery Pack Capable Of Measuring Tempera...

ELECTRONIC TEXTILES AND SYSTEMS AND PROCESSES ASSOCIATED THEREWITH

PRINTED CIRCUIT BOARD

Scalable, Printable, Patterned Sheet Of High Mobility Graphene On F...

METALLIZED VIAS IN GLASS AND SILICON SUBSTRATES, INTERPOSERS, AND M...

PRINTED CIRCUIT BOARD

PRINTED CIRCUIT BOARD

STRETCHABLE DEVICE

ELECTROLESS SEED LAYER DEPOSITION ON GLASS CORE SUBSTRATES

LOW STRESS THROUGH GLASS VIAS (TGVS)

PRINTED CIRCUIT BOARD

Method and Apparatus of Conductive Hybrid Material Layer Stacks wit...

HEAT SPREADING COATING FOR ELECTRONIC ASSEMBLIES

MEMBRANE CIRCUIT BOARD

SMART WEARABLE CLOTHING INCLUDING STRETCHABLE CIRCUIT ELECTRODE AND...

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

WIRING SUBSTRATE

PRINTED WIRING BOARD

CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME

PRINTED CIRCUIT BOARD

WIRING STRUCTURE, METHOD FOR MANUFACTURING SAME, AND SEMICONDUCTOR...

ELECTRICAL INTERCONNECT BOARD FOR A BATTERY MODULE WITH INTEGRATED...

Transparent Conductive Film

CURABLE ADHESIVE COMPOSITION, FILMY ADHESIVE, METHOD FOR PRODUCING...

ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME

METAL FOIL, CIRCUIT BOARD, AND METHOD FOR MANUFACTURING CIRCUIT BOARD

SILICON CARBIDE THERMAL BRIDGE INTEGRATED ON A LOW THERMAL CONDUCTI...

WIRING SUBSTRATE

WIRING SUBSTRATE