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PACKAGE SUBSTRATE STRUCTURE
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Publication number 20230371187
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Publication date Nov 16, 2023
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AMAZING COOL TECHNOLOGY CORPORATION
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Shiann-Tsong TSAI
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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CIRCUIT BOARD
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Publication number 20230171891
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Publication date Jun 1, 2023
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BIZLINK INTERNATIONAL CORP.
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Shi-Jung CHEN
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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INSULATED CIRCUIT BOARD
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Publication number 20230091454
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Publication date Mar 23, 2023
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MITSUBISHI MATERIALS CORPORATION
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Akira Sakurai
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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RESIN MULTILAYER SUBSTRATE
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Publication number 20220418103
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Publication date Dec 29, 2022
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Murata Manufacturing Co., Ltd.
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Atsushi KASUYA
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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ELECTRONIC COMPONENT ON FLEXIBLE SUBSTRATE
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Publication number 20220330433
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Publication date Oct 13, 2022
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Nederlandse Organisatie voor toegepast-natuurwetenschapplijk onderzoek TNO
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Margaretha Maria DE KOK
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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Transparent Conductive Film
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Publication number 20220319734
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Publication date Oct 6, 2022
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Chasm Advanced Materials, Inc.
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Robert F. Praino
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B32 - LAYERED PRODUCTS
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PRINTED CIRCUIT BOARD
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Publication number 20220217843
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Publication date Jul 7, 2022
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Samsung Electro-Mechanics Co., Ltd.
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Jin Uk Lee
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR