Means for aligning

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CPC
H01L2224/757

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/757Means for aligning

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Bonding apparatus and bonding method
- Patent number 12,362,314
- Issue date Jul 15, 2025
- Tokyo Electron Limited
- Yuhei Matsuo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Mounting device and mounting method
- Patent number 12,347,803
- Issue date Jul 1, 2025
- Toray Engineering Co., Ltd.
- Katsumi Terada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump to package substrate solder joint
- Patent number 12,341,126
- Issue date Jun 24, 2025
- Texas Instruments Incorporated
- Dolores Milo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin shaping device
- Patent number 12,341,036
- Issue date Jun 24, 2025
- BONDTECH CO., LTD.
- Akira Yamauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder reflow apparatus
- Patent number 12,341,124
- Issue date Jun 24, 2025
- Samsung Electronics Co., Ltd.
- Byungkeun Kang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding apparatus and bonding method
- Patent number 12,308,294
- Issue date May 20, 2025
- Tokyo Electron Limited
- Tetsuya Maki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing display device and apparatus for manufactu...
- Patent number 12,308,259
- Issue date May 20, 2025
- Samsung Display Co., Ltd.
- Dong Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a bonded semiconductor structure
- Patent number 12,300,660
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of operating die attach systems
- Patent number 12,288,711
- Issue date Apr 29, 2025
- Assembleon B.V.
- Alain De Bock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding system and bonding method
- Patent number 12,261,147
- Issue date Mar 25, 2025
- BONDTECH CO., LTD.
- Akira Yamauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component mounting system and component mounting method
- Patent number 12,261,070
- Issue date Mar 25, 2025
- BONDTECH CO., LTD.
- Akira Yamauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for laser bonding of flip chip
- Patent number 12,237,296
- Issue date Feb 25, 2025
- PROTEC CO., LTD.
- Youn Sung Ko
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device having through parts of different shapes
- Patent number 12,230,600
- Issue date Feb 18, 2025
- Fuji Electric Co., Ltd.
- Narumi Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for actuating a bonding head
- Patent number 12,230,599
- Issue date Feb 18, 2025
- BESI Switzerland AG
- Markus Aebischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transferring electronic device
- Patent number 12,224,263
- Issue date Feb 11, 2025
- MICRAFT SYSTEM PLUS CO., LTD.
- Yu-Min Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device manufacturing device and manufacturing method
- Patent number 12,176,317
- Issue date Dec 24, 2024
- Shinkawa Ltd.
- Kohei Seyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting device and mounting method
- Patent number 12,154,811
- Issue date Nov 26, 2024
- Toray Engineering Co., Ltd.
- Yasushi Tamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding of bridge to multiple semiconductor chips
- Patent number 12,142,603
- Issue date Nov 12, 2024
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Warpage control in the packaging of integrated circuits
- Patent number 12,144,065
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Da Cheng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tools and systems for processing semiconductor devices, and methods...
- Patent number 12,142,594
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and bonding method
- Patent number 12,136,604
- Issue date Nov 5, 2024
- Shinkawa Ltd.
- Hideharu Nihei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for stacking substrates and method for the same
- Patent number 12,100,667
- Issue date Sep 24, 2024
- Nikon Corporation
- Isao Sugaya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Die bonding apparatus and manufacturing method for semiconductor de...
- Patent number 12,068,275
- Issue date Aug 20, 2024
- FASFORD TECHNOLOGY CO., LTD.
- Ryo Saegusa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding head for mounting components and die bonder with such a bon...
- Patent number 12,046,490
- Issue date Jul 23, 2024
- Besi Switzerland AG
- Rene Kroehnert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding apparatus
- Patent number 12,027,486
- Issue date Jul 2, 2024
- L TRIN.CO., LTD
- Yong Won Cha
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor substrate alignment device and a semiconductor substr...
- Patent number 12,027,401
- Issue date Jul 2, 2024
- Samsung Electronics Co., Ltd.
- Gwanghee Jo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for connecting electronic assemblies
- Patent number 12,021,058
- Issue date Jun 25, 2024
- PINK GMBH THERMOSYSTEME
- Christoph Oetzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding apparatus and method of manufacturing a semicondu...
- Patent number 12,002,700
- Issue date Jun 4, 2024
- Kioxia Corporation
- Sho Kawadahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for semiconductor device bonding
- Patent number 11,990,445
- Issue date May 21, 2024
- PYXIS CF PTE. LTD.
- Amlan Sen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing apparatus
- Patent number 11,978,717
- Issue date May 7, 2024
- Kioxia Corporation
- Yuuki Kuro
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DIE ATTACH SYSTEMS, AND METHODS FOR INTEGRATED ACCURACY VERIFICATIO...
- Publication number 20250233000
- Publication date Jul 17, 2025
- Assembleon B.V.
- Alain De Bock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING DISPLAY DEVICE AND APPARATUS FOR MANUFACTU...
- Publication number 20250226243
- Publication date Jul 10, 2025
- SAMSUNG DISPLAY CO., LTD.
- Dong Woo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS, CHUCK EXCHANGE APPARATUS, AND ARTICLE MANUFACTUR...
- Publication number 20250219013
- Publication date Jul 3, 2025
- Canon Kabushiki Kaisha
- KAI TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ATTACHING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR P...
- Publication number 20250210582
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Jaewoo Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP BONDING APPARATUS
- Publication number 20250201757
- Publication date Jun 19, 2025
- Samsung Electronics Co., Ltd.
- Taejae PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING DEVICE
- Publication number 20250201758
- Publication date Jun 19, 2025
- TORAY ENGINEERING CO., LTD.
- Shimpei AOKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
IC CHIP MOUNTING APPARATUS AND IC CHIP MOUNTING METHOD
- Publication number 20250183223
- Publication date Jun 5, 2025
- Sato Holdings Kabushiki Kaisha
- Yoshimitsu MAEDA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE AND APPARATUS FOR MAN...
- Publication number 20250174596
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- Sunchul KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POSITION ALIGNMENT DEVICE, POSITION ALIGNMENT METHOD, BONDING DEVIC...
- Publication number 20250149498
- Publication date May 8, 2025
- CANON MACHINERY INC.
- Shinya KAWAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR DIE BONDING
- Publication number 20250140592
- Publication date May 1, 2025
- Canon Kabushiki Kaisha
- Nilabh K ROY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING SYSTEMS, AND METHODS OF BONDING A SEMICONDUCTOR ELEMENT TO...
- Publication number 20250112201
- Publication date Apr 3, 2025
- KULICKE AND SOFFA INDUSTRIES, INC.
- Andreas Marte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINTERING PRESS AND PRESSURE SINTERING METHOD FOR PRODUCING A SINTE...
- Publication number 20250065400
- Publication date Feb 27, 2025
- SEMIKRON ELEKTRONIK GMBH & CO. KG
- DOMINIC BIRKICHT
- B22 - CASTING POWDER METALLURGY
Information Patent Application
APPARATUS FOR STACKING SUBSTRATES AND METHOD FOR THE SAME
- Publication number 20240413093
- Publication date Dec 12, 2024
- Nikon Corporation
- Isao Sugaya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
System and Method for Bonding Semiconductor Devices
- Publication number 20240395766
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kai-Tai Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOOLS AND SYSTEMS FOR PROCESSING SEMICONDUCTOR DEVICES, AND METHODS...
- Publication number 20240395767
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND BONDING METHOD USING THE SAME
- Publication number 20240332249
- Publication date Oct 3, 2024
- SAMSUNG DISPLAY CO., LTD.
- JEONGMIN BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR POSITIONING SEMICONDUCTOR DEVICES AND CORRESPONDING POSI...
- Publication number 20240329125
- Publication date Oct 3, 2024
- STMicroelectronics International N.V.
- Moise AVOCI UGWIRI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING TOOL OF FLIP CHIP LASER BONDING APPARATUS
- Publication number 20240258265
- Publication date Aug 1, 2024
- Mi Equipment Korea Co., Ltd
- Hyun Gu Kang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING METHOD, BONDING APPARATUS, ARTICLE MANUFACTURING METHOD, DE...
- Publication number 20240243094
- Publication date Jul 18, 2024
- Canon Kabushiki Kaisha
- MASAHIRO KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A PACKAGE STRUCTURE
- Publication number 20240222312
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai Jun ZHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR TRANSFERRING ELECTRONIC DEVICE
- Publication number 20240213209
- Publication date Jun 27, 2024
- Stroke Precision Advanced Engineering Co., Ltd.
- Yu-Min Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING APPARATUS, BONDING METHOD, AND ARTICLE MANUFACTURING METHOD
- Publication number 20240194636
- Publication date Jun 13, 2024
- Canon Kabushiki Kaisha
- KENICHIRO MORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING APPARATUS
- Publication number 20240186282
- Publication date Jun 6, 2024
- Samsung Electronics Co., Ltd.
- Sumin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER REFLOW APPARATUS
- Publication number 20240128229
- Publication date Apr 18, 2024
- Samsung Electronics Co., LTD
- Byungkeun Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR CONNECTING ELECTRONIC ASSEMBLIES
- Publication number 20240047413
- Publication date Feb 8, 2024
- PINK GMBH THERMOSYSTEME
- Christoph Oetzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS
- Publication number 20240021570
- Publication date Jan 18, 2024
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Jiho JOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING APPARATUS AND SUBSTRATE BONDING METHOD
- Publication number 20240014079
- Publication date Jan 11, 2024
- Nikon Corporation
- Isao SUGAYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE HOLDER AND BONDING SYSTEM
- Publication number 20240014167
- Publication date Jan 11, 2024
- SHINKAWA LTD.
- Kohei SEYAMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME
- Publication number 20240008298
- Publication date Jan 4, 2024
- Apple Inc.
- Andreas Bibl
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
PIN ARRAYING DEVICE, ARRAY FOR PIN ARRAYING, AND PIN ARRAYING METHOD
- Publication number 20230420407
- Publication date Dec 28, 2023
- TOYAMA PREFECTURAL UNIVERSITY
- Isao SHIMOYAMA
- H01 - BASIC ELECTRIC ELEMENTS

Means for aligning

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonding apparatus and bonding method

Mounting device and mounting method

Bump to package substrate solder joint

Resin shaping device

Solder reflow apparatus

Bonding apparatus and bonding method

Method for manufacturing display device and apparatus for manufactu...

Method of forming a bonded semiconductor structure

Methods of operating die attach systems

Bonding system and bonding method

Component mounting system and component mounting method

System for laser bonding of flip chip

Semiconductor device having through parts of different shapes

Method for actuating a bonding head

Method for transferring electronic device

Semiconductor device manufacturing device and manufacturing method

Mounting device and mounting method

Bonding of bridge to multiple semiconductor chips

Warpage control in the packaging of integrated circuits

Tools and systems for processing semiconductor devices, and methods...

Bonding apparatus and bonding method

Apparatus for stacking substrates and method for the same

Die bonding apparatus and manufacturing method for semiconductor de...

Bonding head for mounting components and die bonder with such a bon...

Substrate bonding apparatus

Semiconductor substrate alignment device and a semiconductor substr...

System and method for connecting electronic assemblies

Substrate bonding apparatus and method of manufacturing a semicondu...

Apparatus and method for semiconductor device bonding

Semiconductor manufacturing apparatus

Patents Applicationslast 30 patents

DIE ATTACH SYSTEMS, AND METHODS FOR INTEGRATED ACCURACY VERIFICATIO...

METHOD FOR MANUFACTURING DISPLAY DEVICE AND APPARATUS FOR MANUFACTU...

BONDING APPARATUS, CHUCK EXCHANGE APPARATUS, AND ARTICLE MANUFACTUR...

DIE ATTACHING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR P...

CHIP BONDING APPARATUS

MOUNTING DEVICE

IC CHIP MOUNTING APPARATUS AND IC CHIP MOUNTING METHOD

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE AND APPARATUS FOR MAN...

POSITION ALIGNMENT DEVICE, POSITION ALIGNMENT METHOD, BONDING DEVIC...

METHOD AND SYSTEM FOR DIE BONDING

BONDING SYSTEMS, AND METHODS OF BONDING A SEMICONDUCTOR ELEMENT TO...

SINTERING PRESS AND PRESSURE SINTERING METHOD FOR PRODUCING A SINTE...

APPARATUS FOR STACKING SUBSTRATES AND METHOD FOR THE SAME

System and Method for Bonding Semiconductor Devices

TOOLS AND SYSTEMS FOR PROCESSING SEMICONDUCTOR DEVICES, AND METHODS...

BONDING APPARATUS AND BONDING METHOD USING THE SAME

METHOD FOR POSITIONING SEMICONDUCTOR DEVICES AND CORRESPONDING POSI...

BONDING TOOL OF FLIP CHIP LASER BONDING APPARATUS

BONDING METHOD, BONDING APPARATUS, ARTICLE MANUFACTURING METHOD, DE...

METHOD FOR FORMING A PACKAGE STRUCTURE

METHOD FOR TRANSFERRING ELECTRONIC DEVICE

BONDING APPARATUS, BONDING METHOD, AND ARTICLE MANUFACTURING METHOD

DIE BONDING APPARATUS

SOLDER REFLOW APPARATUS

SYSTEM AND METHOD FOR CONNECTING ELECTRONIC ASSEMBLIES

BONDING APPARATUS

SUBSTRATE BONDING APPARATUS AND SUBSTRATE BONDING METHOD

SUBSTRATE HOLDER AND BONDING SYSTEM

LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME

PIN ARRAYING DEVICE, ARRAY FOR PIN ARRAYING, AND PIN ARRAYING METHOD