Means for aligning

Industry

CPC
H01L2224/757

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/757Means for aligning

Industries

Patents Grantslast 30 patents

Information Patent Grant
Bonding of bridge to multiple semiconductor chips
- Patent number 12,142,603
- Issue date Nov 12, 2024
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Warpage control in the packaging of integrated circuits
- Patent number 12,144,065
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Da Cheng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tools and systems for processing semiconductor devices, and methods...
- Patent number 12,142,594
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and bonding method
- Patent number 12,136,604
- Issue date Nov 5, 2024
- Shinkawa Ltd.
- Hideharu Nihei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for stacking substrates and method for the same
- Patent number 12,100,667
- Issue date Sep 24, 2024
- Nikon Corporation
- Isao Sugaya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Die bonding apparatus and manufacturing method for semiconductor de...
- Patent number 12,068,275
- Issue date Aug 20, 2024
- FASFORD TECHNOLOGY CO., LTD.
- Ryo Saegusa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding head for mounting components and die bonder with such a bon...
- Patent number 12,046,490
- Issue date Jul 23, 2024
- Besi Switzerland AG
- Rene Kroehnert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding apparatus
- Patent number 12,027,486
- Issue date Jul 2, 2024
- L TRIN.CO., LTD
- Yong Won Cha
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor substrate alignment device and a semiconductor substr...
- Patent number 12,027,401
- Issue date Jul 2, 2024
- Samsung Electronics Co., Ltd.
- Gwanghee Jo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for connecting electronic assemblies
- Patent number 12,021,058
- Issue date Jun 25, 2024
- PINK GMBH THERMOSYSTEME
- Christoph Oetzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding apparatus and method of manufacturing a semicondu...
- Patent number 12,002,700
- Issue date Jun 4, 2024
- Kioxia Corporation
- Sho Kawadahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for semiconductor device bonding
- Patent number 11,990,445
- Issue date May 21, 2024
- PYXIS CF PTE. LTD.
- Amlan Sen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing apparatus
- Patent number 11,978,717
- Issue date May 7, 2024
- Kioxia Corporation
- Yuuki Kuro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED with internally confined current injection area
- Patent number 11,978,825
- Issue date May 7, 2024
- Apple Inc.
- Kelly McGroddy
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Method for transferring electronic device
- Patent number 11,973,054
- Issue date Apr 30, 2024
- Stroke Precision Advanced Engineering Co., Ltd.
- Yu-Min Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for forming a package structure
- Patent number 11,961,817
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai Jun Zhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low warpage curing methodology by inducing curvature
- Patent number 11,929,260
- Issue date Mar 12, 2024
- Applied Materials, Inc.
- Fang Jie Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die bonding for chip conveying apparatus
- Patent number 11,929,344
- Issue date Mar 12, 2024
- Disco Corporation
- Hiromitsu Yoshimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor package
- Patent number 11,848,301
- Issue date Dec 19, 2023
- Samsung Electronics Co., Ltd.
- Jonggu Lee
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Mounting device
- Patent number 11,835,207
- Issue date Dec 5, 2023
- FUJI CORPORATION
- Kohei Sugihara
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Mounting device and mounting method
- Patent number 11,823,938
- Issue date Nov 21, 2023
- Toray Engineering Co., Ltd.
- Yasushi Tamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding head with large and small spray apertures
- Patent number 11,817,419
- Issue date Nov 14, 2023
- SHIBUYA CORPORATION
- Masato Kitagawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate processing apparatus, substrate processing method and bon...
- Patent number 11,804,466
- Issue date Oct 31, 2023
- Tokyo Electron Limited
- Toshifumi Inamasu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and method of fabricating display device using th...
- Patent number 11,798,912
- Issue date Oct 24, 2023
- Samsung Display Co., Ltd.
- Taeyoung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding apparatus and substrate bonding method
- Patent number 11,791,223
- Issue date Oct 17, 2023
- Nikon Corporation
- Isao Sugaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mass transfer device and mass transfer method
- Patent number 11,784,159
- Issue date Oct 10, 2023
- CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD.
- Jan-hsiang Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Producing apparatus
- Patent number 11,784,158
- Issue date Oct 10, 2023
- GALLANT MICRO. MACHINING CO., LTD.
- Tun-Chih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode display with redundancy scheme
- Patent number 11,778,842
- Issue date Oct 3, 2023
- Apple Inc.
- Andreas Bibl
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Die bond head apparatus with die holder motion table
- Patent number 11,776,930
- Issue date Oct 3, 2023
- ASMPT SINGAPORE PTE. LTD.
- Chung Sheung Yung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding apparatus, manufacturing system, and semiconducto...
- Patent number 11,776,931
- Issue date Oct 3, 2023
- Kioxia Corporation
- Sho Kawadahara
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BONDING APPARATUS AND BONDING METHOD USING THE SAME
- Publication number 20240332249
- Publication date Oct 3, 2024
- SAMSUNG DISPLAY CO., LTD.
- JEONGMIN BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR POSITIONING SEMICONDUCTOR DEVICES AND CORRESPONDING POSI...
- Publication number 20240329125
- Publication date Oct 3, 2024
- STMicroelectronics International N.V.
- Moise AVOCI UGWIRI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING TOOL OF FLIP CHIP LASER BONDING APPARATUS
- Publication number 20240258265
- Publication date Aug 1, 2024
- Mi Equipment Korea Co., Ltd
- Hyun Gu Kang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING METHOD, BONDING APPARATUS, ARTICLE MANUFACTURING METHOD, DE...
- Publication number 20240243094
- Publication date Jul 18, 2024
- Canon Kabushiki Kaisha
- MASAHIRO KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A PACKAGE STRUCTURE
- Publication number 20240222312
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai Jun ZHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR TRANSFERRING ELECTRONIC DEVICE
- Publication number 20240213209
- Publication date Jun 27, 2024
- Stroke Precision Advanced Engineering Co., Ltd.
- Yu-Min Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING APPARATUS, BONDING METHOD, AND ARTICLE MANUFACTURING METHOD
- Publication number 20240194636
- Publication date Jun 13, 2024
- Canon Kabushiki Kaisha
- KENICHIRO MORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING APPARATUS
- Publication number 20240186282
- Publication date Jun 6, 2024
- Samsung Electronics Co., Ltd.
- Sumin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER REFLOW APPARATUS
- Publication number 20240128229
- Publication date Apr 18, 2024
- Samsung Electronics Co., LTD
- Byungkeun Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR CONNECTING ELECTRONIC ASSEMBLIES
- Publication number 20240047413
- Publication date Feb 8, 2024
- PINK GMBH THERMOSYSTEME
- Christoph Oetzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS
- Publication number 20240021570
- Publication date Jan 18, 2024
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Jiho JOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING APPARATUS AND SUBSTRATE BONDING METHOD
- Publication number 20240014079
- Publication date Jan 11, 2024
- Nikon Corporation
- Isao SUGAYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE HOLDER AND BONDING SYSTEM
- Publication number 20240014167
- Publication date Jan 11, 2024
- SHINKAWA LTD.
- Kohei SEYAMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME
- Publication number 20240008298
- Publication date Jan 4, 2024
- Apple Inc.
- Andreas Bibl
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
PIN ARRAYING DEVICE, ARRAY FOR PIN ARRAYING, AND PIN ARRAYING METHOD
- Publication number 20230420407
- Publication date Dec 28, 2023
- TOYAMA PREFECTURAL UNIVERSITY
- Isao SHIMOYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR AND METHOD FOR ALIGNING DIPOLES AND METHOD OF FABRICA...
- Publication number 20230386878
- Publication date Nov 30, 2023
- SAMSUNG DISPLAY CO., LTD.
- Won Ho LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20230378121
- Publication date Nov 23, 2023
- TOKYO ELECTRON LIMITED
- Yuhei Matsuo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
BUMP TO PACKAGE SUBSTRATE SOLDER JOINT
- Publication number 20230352441
- Publication date Nov 2, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Dolores Milo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING OF BRIDGE TO MULTIPLE SEMICONDUCTOR CHIPS
- Publication number 20230299067
- Publication date Sep 21, 2023
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING DEVICE AND MANUFACTURING METHOD
- Publication number 20230268313
- Publication date Aug 24, 2023
- SHINKAWA LTD.
- Kohei SEYAMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CURVED WAFER STAGE
- Publication number 20230260954
- Publication date Aug 17, 2023
- NEXPERIA B.V.
- Joep Stokkermans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE
- Publication number 20230238351
- Publication date Jul 27, 2023
- Samsung Electronics Co., Ltd.
- Jonggu LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A METHOD OF FORMING A BONDED SEMICONDUCTOR STRUCTURE
- Publication number 20230238353
- Publication date Jul 27, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- JEN-YUAN CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSES AND APPLICATIONS FOR CATALYST INFLUENCED CHEMICAL ETCHING
- Publication number 20230230954
- Publication date Jul 20, 2023
- Board of Regents, The University of Texas System
- Sidlgata V. Sreenivasan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC CHIP MOUNTING DEVICE AND IC CHIP MOUNTING METHOD
- Publication number 20230223376
- Publication date Jul 13, 2023
- SATO HOLDINGS KABUSHIKI KAISHA
- Yoshimitsu MAEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE (POP) TYPE SEMICONDUCTOR PACKAGES
- Publication number 20230223387
- Publication date Jul 13, 2023
- Samsung Electronics Co., Ltd.
- Minho Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BONDING DEVICE AND ADJUSTMENT METHOD FOR BONDING HEAD
- Publication number 20230197670
- Publication date Jun 22, 2023
- SHINKAWA LTD.
- ALEXANDER Dzhangirov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING DEVICE AND MOUNTING METHOD
- Publication number 20230163096
- Publication date May 25, 2023
- TORAY ENGINEERING CO., LTD.
- Katsumi TERADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR BONDING CHIP BAND AND METHOD FOR BONDING CHIP USING T...
- Publication number 20230163094
- Publication date May 25, 2023
- Samsung Electronics Co., Ltd.
- Euisun Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ATTACH SYSTEMS, AND METHODS FOR INTEGRATED ACCURACY VERIFICATIO...
- Publication number 20230148420
- Publication date May 11, 2023
- Assembleon B.V.
- Alain De Bock
- H01 - BASIC ELECTRIC ELEMENTS

Means for aligning

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonding of bridge to multiple semiconductor chips

Warpage control in the packaging of integrated circuits

Tools and systems for processing semiconductor devices, and methods...

Bonding apparatus and bonding method

Apparatus for stacking substrates and method for the same

Die bonding apparatus and manufacturing method for semiconductor de...

Bonding head for mounting components and die bonder with such a bon...

Substrate bonding apparatus

Semiconductor substrate alignment device and a semiconductor substr...

System and method for connecting electronic assemblies

Substrate bonding apparatus and method of manufacturing a semicondu...

Apparatus and method for semiconductor device bonding

Semiconductor manufacturing apparatus

LED with internally confined current injection area

Method for transferring electronic device

Apparatus and method for forming a package structure

Low warpage curing methodology by inducing curvature

Die bonding for chip conveying apparatus

Method of manufacturing a semiconductor package

Mounting device

Mounting device and mounting method

Bonding head with large and small spray apertures

Substrate processing apparatus, substrate processing method and bon...

Bonding apparatus and method of fabricating display device using th...

Substrate bonding apparatus and substrate bonding method

Mass transfer device and mass transfer method

Producing apparatus

Light emitting diode display with redundancy scheme

Die bond head apparatus with die holder motion table

Substrate bonding apparatus, manufacturing system, and semiconducto...

Patents Applicationslast 30 patents

BONDING APPARATUS AND BONDING METHOD USING THE SAME

METHOD FOR POSITIONING SEMICONDUCTOR DEVICES AND CORRESPONDING POSI...

BONDING TOOL OF FLIP CHIP LASER BONDING APPARATUS

BONDING METHOD, BONDING APPARATUS, ARTICLE MANUFACTURING METHOD, DE...

METHOD FOR FORMING A PACKAGE STRUCTURE

METHOD FOR TRANSFERRING ELECTRONIC DEVICE

BONDING APPARATUS, BONDING METHOD, AND ARTICLE MANUFACTURING METHOD

DIE BONDING APPARATUS

SOLDER REFLOW APPARATUS

SYSTEM AND METHOD FOR CONNECTING ELECTRONIC ASSEMBLIES

BONDING APPARATUS

SUBSTRATE BONDING APPARATUS AND SUBSTRATE BONDING METHOD

SUBSTRATE HOLDER AND BONDING SYSTEM

LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME

PIN ARRAYING DEVICE, ARRAY FOR PIN ARRAYING, AND PIN ARRAYING METHOD

APPARATUS FOR AND METHOD FOR ALIGNING DIPOLES AND METHOD OF FABRICA...

BONDING APPARATUS AND BONDING METHOD

BUMP TO PACKAGE SUBSTRATE SOLDER JOINT

BONDING OF BRIDGE TO MULTIPLE SEMICONDUCTOR CHIPS

SEMICONDUCTOR DEVICE MANUFACTURING DEVICE AND MANUFACTURING METHOD

CURVED WAFER STAGE

METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE

A METHOD OF FORMING A BONDED SEMICONDUCTOR STRUCTURE

PROCESSES AND APPLICATIONS FOR CATALYST INFLUENCED CHEMICAL ETCHING

IC CHIP MOUNTING DEVICE AND IC CHIP MOUNTING METHOD

PACKAGE-ON-PACKAGE (POP) TYPE SEMICONDUCTOR PACKAGES

BONDING DEVICE AND ADJUSTMENT METHOD FOR BONDING HEAD

MOUNTING DEVICE AND MOUNTING METHOD

APPARATUS FOR BONDING CHIP BAND AND METHOD FOR BONDING CHIP USING T...

DIE ATTACH SYSTEMS, AND METHODS FOR INTEGRATED ACCURACY VERIFICATIO...