Means for monitoring the connection process

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CPC
H01L2224/789

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/789Means for monitoring the connection process

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Wire bonding apparatus
- Patent number 12,261,148
- Issue date Mar 25, 2025
- Shinkawa Ltd.
- Shigeru Hayata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of detecting bonding between a bonding wire and a bonding l...
- Patent number 12,255,109
- Issue date Mar 18, 2025
- Kulicke and Soffa Industries, Inc.
- Gary S. Gillotti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooperative bonding method for a bonding head of a wire bonding mac...
- Patent number 12,237,298
- Issue date Feb 25, 2025
- GUANGDONG UNIVERSITY OF TECHNOLOGY
- Jian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In-process wire bond testing using wire bonding apparatus
- Patent number 12,148,730
- Issue date Nov 19, 2024
- Atieva, Inc.
- Ben Carlson-Sypek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of calibrating an ultrasonic characteristic on a wire bondi...
- Patent number 12,113,043
- Issue date Oct 8, 2024
- Kulicke and Soffa Industries, Inc.
- Jon W. Brunner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding device, wire cutting method and non-transitory compute...
- Patent number 12,107,067
- Issue date Oct 1, 2024
- Shinkawa Ltd.
- Hiroaki Yoshino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding apparatus
- Patent number 11,961,819
- Issue date Apr 16, 2024
- Shinkawa Ltd.
- Naoki Sekine
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of optimizing clamping of a semiconductor element against a...
- Patent number 11,935,864
- Issue date Mar 19, 2024
- Kulicke and Soffa Industries, Inc.
- Hui Xu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding apparatus
- Patent number 11,908,827
- Issue date Feb 20, 2024
- Shinkawa Ltd.
- Naoki Sekine
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding for semiconductor devices
- Patent number 11,901,327
- Issue date Feb 13, 2024
- Western Digital Technologies, Inc.
- Yang Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding apparatus
- Patent number 11,824,038
- Issue date Nov 21, 2023
- Shinkawa Ltd.
- Nobuyuki Aoyagi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Force sensor in an ultrasonic wire bonding device
- Patent number 11,798,911
- Issue date Oct 24, 2023
- ASMPT SINGAPORE PTE. LTD.
- Hing Leung Li
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for bonding insulated coating wire, connection structure, me...
- Patent number 11,791,304
- Issue date Oct 17, 2023
- Kaijo Corporation
- Akio Sugito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capillary guide device and wire bonding apparatus
- Patent number 11,717,912
- Issue date Aug 8, 2023
- Shinkawa Ltd.
- Yohei Uchida
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of optimizing clamping of a semiconductor element against a...
- Patent number 11,515,285
- Issue date Nov 29, 2022
- Kulicke and Soffa Industries, Inc.
- Hui Xu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultrasonic transducer systems including tuned resonators, equipment...
- Patent number 11,462,506
- Issue date Oct 4, 2022
- Kulicke and Soffa Industries, Inc.
- Dominick A. DeAngelis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding apparatus and manufacturing method for semiconductor a...
- Patent number 11,450,640
- Issue date Sep 20, 2022
- Shinkawa Ltd.
- Shinsuke Tei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Full-automatic deep access ball bonding head device
- Patent number 11,437,343
- Issue date Sep 6, 2022
- ZHEJIANG RUIQUN TECHNOLOGY CO., LTD.
- Wen Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor element and method for identifying semiconductor element
- Patent number 11,408,925
- Issue date Aug 9, 2022
- FUJI ELECTRIC CO., LTD.
- Taichi Karino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of detecting bonding between a bonding wire and a bonding l...
- Patent number 11,404,330
- Issue date Aug 2, 2022
- Kulicke and Soffa Industries, Inc.
- Gary S. Gillotti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus
- Patent number 11,367,703
- Issue date Jun 21, 2022
- Shinkawa Ltd.
- Hiroya Yuzawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of vertically vibrating a bonding arm
- Patent number 11,302,667
- Issue date Apr 12, 2022
- Kaijo Corporation
- Riki Jindo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding process with rotating bonding stage
- Patent number 11,273,515
- Issue date Mar 15, 2022
- KAIJO CORPORATION
- Yuji Komagino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for calibrating wire clamp device
- Patent number 11,257,781
- Issue date Feb 22, 2022
- Shinkawa Ltd.
- Noboru Fujino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding apparatus with rotating bonding stage
- Patent number 11,173,567
- Issue date Nov 16, 2021
- KAIJO CORPORATION
- Yuji Komagino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultrasonic transducer systems including tuned resonators, equipment...
- Patent number 11,011,492
- Issue date May 18, 2021
- Kulicke and Soffa Industries, Inc.
- Dominick A. DeAngelis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultrasonic vibration bonding apparatus
- Patent number 10,953,487
- Issue date Mar 23, 2021
- Toshiba Mitsubishi-Electric Industrial Systems Corporation
- Akihiro Ichinose
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding apparatus
- Patent number 10,896,892
- Issue date Jan 19, 2021
- Fuji Electric Co., Ltd.
- Fumihiko Momose
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods of operating wire bonding machines including cl...
- Patent number 10,763,236
- Issue date Sep 1, 2020
- Kulicke and Soffa Industries, Inc.
- Peter J. Klaerner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of detecting bonding between a bonding wire and a bonding l...
- Patent number 10,755,988
- Issue date Aug 25, 2020
- KULICKE AND SOFFA, INDUSTRIES, INC.
- Gary S. Gillotti
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS OF OPERATING WIRE BONDING SYSTEMS, INCLUDING METHODS OF DET...
- Publication number 20250201765
- Publication date Jun 19, 2025
- KULICKE AND SOFFA INDUSTRIES, INC.
- Gary Gillotti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING SYSTEMS, WIRE BONDING TOOL REPLACEMENT SYSTEMS, AND RE...
- Publication number 20250162093
- Publication date May 22, 2025
- KULICKE AND SOFFA INDUSTRIES, INC.
- Kumar Manoj Venna
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF DETECTING A CRACK IN A SEMICONDUCTOR ELEMENT, AND RELATE...
- Publication number 20250022122
- Publication date Jan 16, 2025
- KULICKE AND SOFFA INDUSTRIES, INC.
- Aashish Shah
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHODS OF CALIBRATING AN ULTRASONIC CHARACTERISTIC ON A WIRE BONDI...
- Publication number 20240404986
- Publication date Dec 5, 2024
- KULICKE AND SOFFA INDUSTRIES, INC.
- Jon W. Brunner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING APPARATUS, BONDING METHOD, AND COMPUTER READABLE STORAGE ME...
- Publication number 20240304592
- Publication date Sep 12, 2024
- SHINKAWA LTD.
- Kohei SEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HANDLING A FRAGILE SUBSTRATE FOR INTERCONNECT BONDING
- Publication number 20240194634
- Publication date Jun 13, 2024
- ASMPT SINGAPORE PTE. LTD
- Keng Yew SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING DEVICE, MAINTENANCE METHOD AND NON-TRANSITORY COMPUTER...
- Publication number 20240088089
- Publication date Mar 14, 2024
- SHINKAWA LTD.
- Tsutomu KIYONO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP-FORMING DEVICE, BUMP-FORMING METHOD, AND NON-TRANSITORY COMPUT...
- Publication number 20240055388
- Publication date Feb 15, 2024
- SHINKAWA LTD.
- Kiyotaka TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-PROCESS WIRE BOND TESTING
- Publication number 20230215835
- Publication date Jul 6, 2023
- Atieva, Inc.
- Ben Carlson-Sypek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING APPARATUS
- Publication number 20230178510
- Publication date Jun 8, 2023
- SHINKAWA LTD.
- Shigeru HAYATA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING DEVICE, WIRE CUTTING METHOD AND NON-TRANSITORY COMPUTE...
- Publication number 20230163097
- Publication date May 25, 2023
- SHINKAWA LTD.
- Hiroaki YOSHINO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF CALIBRATING AN ULTRASONIC CHARACTERISTIC ON A WIRE BONDI...
- Publication number 20230154888
- Publication date May 18, 2023
- KULICKE AND SOFFA INDUSTRIES, INC.
- Jon W. Brunner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF OPTIMIZING CLAMPING OF A SEMICONDUCTOR ELEMENT AGAINST A...
- Publication number 20230039460
- Publication date Feb 9, 2023
- KULICKE AND SOFFA INDUSTRIES, INC.
- Hui Xu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF DETECTING BONDING BETWEEN A BONDING WIRE AND A BONDING L...
- Publication number 20220328367
- Publication date Oct 13, 2022
- KULICKE AND SOFFA INDUSTRIES, INC.
- Gary S. Gillotti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING STATE DETERMINATION METHOD AND WIRE BONDING STATE DETE...
- Publication number 20220320040
- Publication date Oct 6, 2022
- Yamaha Robotics Holdings Co., Ltd.
- Hiroshi MUNAKATA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wire Bonding For Semiconductor Devices
- Publication number 20220052014
- Publication date Feb 17, 2022
- Western Digital Technologies, Inc.
- Yang Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING INSULATED COATING WIRE, CONNECTION STRUCTURE, ME...
- Publication number 20210358881
- Publication date Nov 18, 2021
- KAIJO CORPORATION
- Akio SUGITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF OPTIMIZING CLAMPING OF A SEMICONDUCTOR ELEMENT AGAINST A...
- Publication number 20210305199
- Publication date Sep 30, 2021
- KULICKE AND SOFFA INDUSTRIES, INC.
- Hui Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING APPARATUS
- Publication number 20210272927
- Publication date Sep 2, 2021
- SHINKAWA LTD.
- Nobuyuki AOYAGI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING APPARATUS
- Publication number 20210202432
- Publication date Jul 1, 2021
- SHINKAWA LTD.
- Hiroya YUZAWA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FULL-AUTOMATIC DEEP ACCESS BALL BONDING HEAD DEVICE
- Publication number 20210057374
- Publication date Feb 25, 2021
- NINGBO SHANGJIN AUTOMATION TECHNOLOGY CO., LTD.
- Wen CHEN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF DETECTING BONDING BETWEEN A BONDING WIRE AND A BONDING L...
- Publication number 20200350216
- Publication date Nov 5, 2020
- KULICKE AND SOFFA INDUSTRIES, INC.
- Gary S. Gillotti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS, BONDING METHOD AND BONDING CONTROL PROGRAM
- Publication number 20200238433
- Publication date Jul 30, 2020
- KAIJO CORPORATION
- Yuji KOMAGINO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF DETECTING BONDING BETWEEN A BONDING WIRE AND A BONDING L...
- Publication number 20200006161
- Publication date Jan 2, 2020
- KULICKE AND SOFFA INDUSTRIES, INC.
- Gary S. Gillotti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRASONIC TRANSDUCER SYSTEMS INCLUDING TUNED RESONATORS, EQUIPMENT...
- Publication number 20190319005
- Publication date Oct 17, 2019
- KULICKE AND SOFFA INDUSTRIES, INC.
- Dominick A. DeAngelis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS OF OPERATING WIRE BONDING MACHINES INCLUDING CL...
- Publication number 20190214363
- Publication date Jul 11, 2019
- KULICKE AND SOFFA INDUSTRIES, INC.
- Peter J. Klaerner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DETECTION OF FOREIGN PARTICLES DURING WIRE BONDING
- Publication number 20190139929
- Publication date May 9, 2019
- ASM Technology Singapore Pte Ltd
- Tact LEE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ON-BONDER AUTOMATIC OVERHANG DIE OPTIMIZATION TOOL FOR WIRE BONDING...
- Publication number 20190027463
- Publication date Jan 24, 2019
- KULICKE AND SOFFA INDUSTRIES, INC.
- Aashish Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF OPERATING A WIRE BONDING MACHINE TO IMPROVE CLAMPING OF...
- Publication number 20180323167
- Publication date Nov 8, 2018
- KULICKE AND SOFFA INDUSTRIES, INC.
- Wong Hing Kuong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ULTRASONIC VIBRATION BONDING APPARATUS
- Publication number 20180272463
- Publication date Sep 27, 2018
- TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION
- Akihiro ICHINOSE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Means for monitoring the connection process

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wire bonding apparatus

Methods of detecting bonding between a bonding wire and a bonding l...

Cooperative bonding method for a bonding head of a wire bonding mac...

In-process wire bond testing using wire bonding apparatus

Methods of calibrating an ultrasonic characteristic on a wire bondi...

Wire bonding device, wire cutting method and non-transitory compute...

Wire bonding apparatus

Methods of optimizing clamping of a semiconductor element against a...

Wire bonding apparatus

Wire bonding for semiconductor devices

Wire bonding apparatus

Force sensor in an ultrasonic wire bonding device

Method for bonding insulated coating wire, connection structure, me...

Capillary guide device and wire bonding apparatus

Methods of optimizing clamping of a semiconductor element against a...

Ultrasonic transducer systems including tuned resonators, equipment...

Wire bonding apparatus and manufacturing method for semiconductor a...

Full-automatic deep access ball bonding head device

Semiconductor element and method for identifying semiconductor element

Methods of detecting bonding between a bonding wire and a bonding l...

Bonding apparatus

Method of vertically vibrating a bonding arm

Bonding process with rotating bonding stage

Method for calibrating wire clamp device

Bonding apparatus with rotating bonding stage

Ultrasonic transducer systems including tuned resonators, equipment...

Ultrasonic vibration bonding apparatus

Wire bonding apparatus

Systems and methods of operating wire bonding machines including cl...

Methods of detecting bonding between a bonding wire and a bonding l...

Patents Applicationslast 30 patents

METHODS OF OPERATING WIRE BONDING SYSTEMS, INCLUDING METHODS OF DET...

WIRE BONDING SYSTEMS, WIRE BONDING TOOL REPLACEMENT SYSTEMS, AND RE...

METHODS OF DETECTING A CRACK IN A SEMICONDUCTOR ELEMENT, AND RELATE...

METHODS OF CALIBRATING AN ULTRASONIC CHARACTERISTIC ON A WIRE BONDI...

BONDING APPARATUS, BONDING METHOD, AND COMPUTER READABLE STORAGE ME...

HANDLING A FRAGILE SUBSTRATE FOR INTERCONNECT BONDING

WIRE BONDING DEVICE, MAINTENANCE METHOD AND NON-TRANSITORY COMPUTER...

BUMP-FORMING DEVICE, BUMP-FORMING METHOD, AND NON-TRANSITORY COMPUT...

IN-PROCESS WIRE BOND TESTING

WIRE BONDING APPARATUS

WIRE BONDING DEVICE, WIRE CUTTING METHOD AND NON-TRANSITORY COMPUTE...

METHODS OF CALIBRATING AN ULTRASONIC CHARACTERISTIC ON A WIRE BONDI...

METHODS OF OPTIMIZING CLAMPING OF A SEMICONDUCTOR ELEMENT AGAINST A...

METHODS OF DETECTING BONDING BETWEEN A BONDING WIRE AND A BONDING L...

WIRE BONDING STATE DETERMINATION METHOD AND WIRE BONDING STATE DETE...

Wire Bonding For Semiconductor Devices

METHOD FOR BONDING INSULATED COATING WIRE, CONNECTION STRUCTURE, ME...

METHODS OF OPTIMIZING CLAMPING OF A SEMICONDUCTOR ELEMENT AGAINST A...

WIRE BONDING APPARATUS

BONDING APPARATUS

FULL-AUTOMATIC DEEP ACCESS BALL BONDING HEAD DEVICE

METHODS OF DETECTING BONDING BETWEEN A BONDING WIRE AND A BONDING L...

BONDING APPARATUS, BONDING METHOD AND BONDING CONTROL PROGRAM

METHODS OF DETECTING BONDING BETWEEN A BONDING WIRE AND A BONDING L...

ULTRASONIC TRANSDUCER SYSTEMS INCLUDING TUNED RESONATORS, EQUIPMENT...

SYSTEMS AND METHODS OF OPERATING WIRE BONDING MACHINES INCLUDING CL...

DETECTION OF FOREIGN PARTICLES DURING WIRE BONDING

ON-BONDER AUTOMATIC OVERHANG DIE OPTIMIZATION TOOL FOR WIRE BONDING...

METHODS OF OPERATING A WIRE BONDING MACHINE TO IMPROVE CLAMPING OF...

ULTRASONIC VIBRATION BONDING APPARATUS