Means for moving parts

Industry

CPC
H01L2224/758

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/758Means for moving parts

Industries

Patents Grantslast 30 patents

Information Patent Grant
Bonding apparatus and bonding method
- Patent number 12,136,604
- Issue date Nov 5, 2024
- Shinkawa Ltd.
- Hideharu Nihei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for forming a package structure
- Patent number 11,961,817
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai Jun Zhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die bonding for chip conveying apparatus
- Patent number 11,929,344
- Issue date Mar 12, 2024
- Disco Corporation
- Hiromitsu Yoshimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 11,843,085
- Issue date Dec 12, 2023
- Innolux Corporation
- Shun-Yuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing apparatus, and method of manufacturing...
- Patent number 11,823,924
- Issue date Nov 21, 2023
- Kioxia Corporation
- Aoi Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and method of fabricating display device using th...
- Patent number 11,798,912
- Issue date Oct 24, 2023
- Samsung Display Co., Ltd.
- Taeyoung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die bond head apparatus with die holder motion table
- Patent number 11,776,930
- Issue date Oct 3, 2023
- ASMPT SINGAPORE PTE. LTD.
- Chung Sheung Yung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding apparatus, manufacturing system, and semiconducto...
- Patent number 11,776,931
- Issue date Oct 3, 2023
- Kioxia Corporation
- Sho Kawadahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus, control method and control device of semiconductor packa...
- Patent number 11,774,935
- Issue date Oct 3, 2023
- CAPCON LIMITED
- Hong Gang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus to control transfer parameters during transfer of semicon...
- Patent number 11,728,189
- Issue date Aug 15, 2023
- Rohinni, Inc.
- Justin Wendt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Arrangement and method for joining at least two joining partners
- Patent number 11,676,933
- Issue date Jun 13, 2023
- Infineon Technologies AG
- Steffen Hartmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus, bonding system, bonding method, and recording me...
- Patent number 11,658,146
- Issue date May 23, 2023
- Tokyo Electron Limited
- Takashi Nakamitsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a semiconductor package and apparatus for p...
- Patent number 11,646,294
- Issue date May 9, 2023
- Samsung Electronics Co., Ltd.
- Ungkeol Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component mounting system
- Patent number 11,587,804
- Issue date Feb 21, 2023
- BONDTECH CO., LTD.
- Akira Yamauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems for direct transfer of semiconductor device die
- Patent number 11,562,990
- Issue date Jan 24, 2023
- Rohinni, Inc.
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method for manufacturing the same
- Patent number 11,545,606
- Issue date Jan 3, 2023
- Innolux Corporation
- Shun-Yuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible circuit film bonding apparatus and method of bonding flexi...
- Patent number 11,515,283
- Issue date Nov 29, 2022
- Samsung Display Co., Ltd.
- Chung-Seok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct transfer of semiconductor devices from a substrate
- Patent number 11,515,293
- Issue date Nov 29, 2022
- Rohinni, LLC
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transfer of semiconductor devices onto glass substrates
- Patent number 11,488,940
- Issue date Nov 1, 2022
- Rohinni, Inc.
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip bonding apparatus
- Patent number 11,482,505
- Issue date Oct 25, 2022
- Samsung Electronics Co., Ltd.
- Jae-Cheol Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment mechanism, chuck device, and bonder
- Patent number 11,462,428
- Issue date Oct 4, 2022
- Tazmo Co., Ltd.
- Masaaki Tanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of using a processing oven
- Patent number 11,456,274
- Issue date Sep 27, 2022
- YIELD ENGINEERING SYSTEMS, INC.
- M Ziaul Karim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sintering tool and method for sintering an electronic subassembly
- Patent number 11,400,514
- Issue date Aug 2, 2022
- Danfoss Silicon Power GmbH
- Frank Osterwald
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Bonder
- Patent number 11,367,702
- Issue date Jun 21, 2022
- Tazmo Co., Ltd.
- Masaaki Tanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing oven
- Patent number 11,296,049
- Issue date Apr 5, 2022
- YIELD ENGINEERING SYSTEMS, INC.
- Christopher Lane
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Die bonder incorporating rotatable adhesive dispenser head
- Patent number 11,289,445
- Issue date Mar 29, 2022
- ASM Technology Singapore Pte. Ltd.
- Wan Yin Yau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component handling device for removing components from a structured...
- Patent number 11,232,961
- Issue date Jan 25, 2022
- Muehlbauer GmbH & Co. KG
- Henri Junker
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
High speed handling of ultra-small chips by selective laser bonding...
- Patent number 11,222,862
- Issue date Jan 11, 2022
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for improved transfer of semiconductor die
- Patent number 11,152,339
- Issue date Oct 19, 2021
- Rohinni, LLC
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus incorporating variable force distribution
- Patent number 11,121,113
- Issue date Sep 14, 2021
- ASM Technology Singapore Pte. Ltd.
- Ming Yeung Wan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BONDING APPARATUS AND BONDING METHOD USING THE SAME
- Publication number 20240332249
- Publication date Oct 3, 2024
- SAMSUNG DISPLAY CO., LTD.
- JEONGMIN BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A PACKAGE STRUCTURE
- Publication number 20240222312
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai Jun ZHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HANDLING A FRAGILE SUBSTRATE FOR INTERCONNECT BONDING
- Publication number 20240194634
- Publication date Jun 13, 2024
- ASMPT SINGAPORE PTE. LTD
- Keng Yew SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING APPARATUS
- Publication number 20240186282
- Publication date Jun 6, 2024
- Samsung Electronics Co., Ltd.
- Sumin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER REFLOW APPARATUS
- Publication number 20240128229
- Publication date Apr 18, 2024
- Samsung Electronics Co., LTD
- Byungkeun Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BALL ATTACHING APPARATUS
- Publication number 20240071983
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- Bongken YU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240072230
- Publication date Feb 29, 2024
- InnoLux Corporation
- Shun-Yuan HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC D...
- Publication number 20240047410
- Publication date Feb 8, 2024
- Samsung Electronics Co., Ltd.
- Youngja KIM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING DEVICE AND ADJUSTMENT METHOD FOR BONDING HEAD
- Publication number 20230197670
- Publication date Jun 22, 2023
- SHINKAWA LTD.
- ALEXANDER Dzhangirov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING DEVICE AND MOUNTING METHOD
- Publication number 20230163096
- Publication date May 25, 2023
- TORAY ENGINEERING CO., LTD.
- Katsumi TERADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR BONDING CHIP BAND AND METHOD FOR BONDING CHIP USING T...
- Publication number 20230163094
- Publication date May 25, 2023
- Samsung Electronics Co., Ltd.
- Euisun Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP CONVEYING APPARATUS AND DIE BONDER
- Publication number 20230031977
- Publication date Feb 2, 2023
- Disco Corporation
- Hiromitsu YOSHIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC CHIP MOUNTING DEVICE AND IC CHIP MOUNTING METHOD
- Publication number 20230011327
- Publication date Jan 12, 2023
- SATO HOLDINGS KABUSHIKI KAISHA
- Yoshimitsu MAEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING APPARATUS
- Publication number 20220415845
- Publication date Dec 29, 2022
- SHINKAWA LTD.
- Alexander DZHANGIROV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20220406747
- Publication date Dec 22, 2022
- SHINKAWA LTD.
- Hideharu NIHEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS, AND METHOD OF MANUFACTURING...
- Publication number 20220285181
- Publication date Sep 8, 2022
- KIOXIA Corporation
- Aoi SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR FORMING A PACKAGE STRUCTURE
- Publication number 20220278071
- Publication date Sep 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai Jun ZHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE AND APPARATUS FOR P...
- Publication number 20220068874
- Publication date Mar 3, 2022
- Samsung Electronics Co., Ltd.
- Ungkeol KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS TO CONTROL TRANSFER PARAMETERS DURING TRANSFER...
- Publication number 20210343558
- Publication date Nov 4, 2021
- Rohinni, LLC
- Justin Wendt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS, BONDING SYSTEM, BONDING METHOD, AND RECORDING ME...
- Publication number 20210343678
- Publication date Nov 4, 2021
- TOKYO ELECTRON LIMITED
- Takashi Nakamitsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20210313501
- Publication date Oct 7, 2021
- InnoLux Corporation
- Shun-Yuan HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND METHOD OF FABRICATING DISPLAY DEVICE USING TH...
- Publication number 20210305201
- Publication date Sep 30, 2021
- SAMSUNG DISPLAY CO., LTD.
- Taeyoung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210296551
- Publication date Sep 23, 2021
- InnoLux Corporation
- Shun-Yuan HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Actuator for a Bonding Head
- Publication number 20210272925
- Publication date Sep 2, 2021
- BESI Switzerland AG
- Markus Aebischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS INCORPORATING VARIABLE FORCE DISTRIBUTION
- Publication number 20210225800
- Publication date Jul 22, 2021
- ASM Technology Singapore Pte Ltd
- Ming Yeung WAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BOND HEAD APPARATUS WITH DIE HOLDER MOTION TABLE
- Publication number 20210183809
- Publication date Jun 17, 2021
- ASM Technology Singapore Pte Ltd
- Chung Sheung YUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING APPARATUS, MANUFACTURING SYSTEM, AND SEMICONDUCTO...
- Publication number 20210074670
- Publication date Mar 11, 2021
- Kioxia Corporation
- Sho KAWADAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINTERING TOOL AND METHOD FOR SINTERING AN ELECTRONIC SUBASSEMBLY
- Publication number 20210016353
- Publication date Jan 21, 2021
- DANFOSS SILICON POWER GMBH
- Frank Osterwald
- B22 - CASTING POWDER METALLURGY
Information Patent Application
FLEXIBLE CIRCUIT FILM BONDING APPARATUS AND METHOD OF BONDING FLEXI...
- Publication number 20200373276
- Publication date Nov 26, 2020
- SAMSUNG DISPLAY CO., LTD.
- Chung-Seok LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP BONDING APPARATUS, A SYSTEM FOR REPLACING BONDING TOOL ASSEMBL...
- Publication number 20200312811
- Publication date Oct 1, 2020
- Samsung Electronics Co., Ltd.
- Jae-Cheol KIM
- H01 - BASIC ELECTRIC ELEMENTS

Means for moving parts

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonding apparatus and bonding method

Apparatus and method for forming a package structure

Die bonding for chip conveying apparatus

Electronic device

Semiconductor manufacturing apparatus, and method of manufacturing...

Bonding apparatus and method of fabricating display device using th...

Die bond head apparatus with die holder motion table

Substrate bonding apparatus, manufacturing system, and semiconducto...

Apparatus, control method and control device of semiconductor packa...

Apparatus to control transfer parameters during transfer of semicon...

Arrangement and method for joining at least two joining partners

Bonding apparatus, bonding system, bonding method, and recording me...

Method of manufacturing a semiconductor package and apparatus for p...

Component mounting system

Systems for direct transfer of semiconductor device die

Electronic device and method for manufacturing the same

Flexible circuit film bonding apparatus and method of bonding flexi...

Direct transfer of semiconductor devices from a substrate

Method for transfer of semiconductor devices onto glass substrates

Chip bonding apparatus

Alignment mechanism, chuck device, and bonder

Method of using a processing oven

Sintering tool and method for sintering an electronic subassembly

Bonder

Processing oven

Die bonder incorporating rotatable adhesive dispenser head

Component handling device for removing components from a structured...

High speed handling of ultra-small chips by selective laser bonding...

Method for improved transfer of semiconductor die

Bonding apparatus incorporating variable force distribution

Patents Applicationslast 30 patents

BONDING APPARATUS AND BONDING METHOD USING THE SAME

METHOD FOR FORMING A PACKAGE STRUCTURE

HANDLING A FRAGILE SUBSTRATE FOR INTERCONNECT BONDING

DIE BONDING APPARATUS

SOLDER REFLOW APPARATUS

SOLDER BALL ATTACHING APPARATUS

ELECTRONIC DEVICE

SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC D...

BONDING DEVICE AND ADJUSTMENT METHOD FOR BONDING HEAD

MOUNTING DEVICE AND MOUNTING METHOD

APPARATUS FOR BONDING CHIP BAND AND METHOD FOR BONDING CHIP USING T...

CHIP CONVEYING APPARATUS AND DIE BONDER

IC CHIP MOUNTING DEVICE AND IC CHIP MOUNTING METHOD

MOUNTING APPARATUS

BONDING APPARATUS AND BONDING METHOD

SEMICONDUCTOR MANUFACTURING APPARATUS, AND METHOD OF MANUFACTURING...

APPARATUS AND METHOD FOR FORMING A PACKAGE STRUCTURE

METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE AND APPARATUS FOR P...

METHOD AND APPARATUS TO CONTROL TRANSFER PARAMETERS DURING TRANSFER...

BONDING APPARATUS, BONDING SYSTEM, BONDING METHOD, AND RECORDING ME...

ELECTRONIC DEVICE

BONDING APPARATUS AND METHOD OF FABRICATING DISPLAY DEVICE USING TH...

ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME

Actuator for a Bonding Head

BONDING APPARATUS INCORPORATING VARIABLE FORCE DISTRIBUTION

DIE BOND HEAD APPARATUS WITH DIE HOLDER MOTION TABLE

SUBSTRATE BONDING APPARATUS, MANUFACTURING SYSTEM, AND SEMICONDUCTO...

SINTERING TOOL AND METHOD FOR SINTERING AN ELECTRONIC SUBASSEMBLY

FLEXIBLE CIRCUIT FILM BONDING APPARATUS AND METHOD OF BONDING FLEXI...

CHIP BONDING APPARATUS, A SYSTEM FOR REPLACING BONDING TOOL ASSEMBL...