Means for optical alignment

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CPC
H01L2224/75753

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/75753Means for optical alignment

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Mounting device and mounting method
- Patent number 12,154,811
- Issue date Nov 26, 2024
- Toray Engineering Co., Ltd.
- Yasushi Tamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and bonding method
- Patent number 12,136,604
- Issue date Nov 5, 2024
- Shinkawa Ltd.
- Hideharu Nihei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding apparatus
- Patent number 12,027,486
- Issue date Jul 2, 2024
- L TRIN.CO., LTD
- Yong Won Cha
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Apparatus and method for semiconductor device bonding
- Patent number 11,990,445
- Issue date May 21, 2024
- PYXIS CF PTE. LTD.
- Amlan Sen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die bonding for chip conveying apparatus
- Patent number 11,929,344
- Issue date Mar 12, 2024
- Disco Corporation
- Hiromitsu Yoshimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting device
- Patent number 11,835,207
- Issue date Dec 5, 2023
- FUJI CORPORATION
- Kohei Sugihara
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Mounting device and mounting method
- Patent number 11,823,938
- Issue date Nov 21, 2023
- Toray Engineering Co., Ltd.
- Yasushi Tamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and method of fabricating display device using th...
- Patent number 11,798,912
- Issue date Oct 24, 2023
- Samsung Display Co., Ltd.
- Taeyoung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding apparatus, manufacturing system, and semiconducto...
- Patent number 11,776,931
- Issue date Oct 3, 2023
- Kioxia Corporation
- Sho Kawadahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing apparatus
- Patent number 11,749,667
- Issue date Sep 5, 2023
- Kioxia Corporation
- Toshihiko Ohda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer bonding method and wafer bonding apparatus
- Patent number 11,721,662
- Issue date Aug 8, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yun-Tai Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing apparatus
- Patent number 11,658,147
- Issue date May 23, 2023
- Samsung Electronics Co., Ltd.
- Ilhyoung Koo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for bonding semiconductor substrate
- Patent number 11,631,652
- Issue date Apr 18, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ying-Jui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package (POP) type semiconductor packages
- Patent number 11,610,871
- Issue date Mar 21, 2023
- Samsung Electronics Co., Ltd.
- Minho Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Component mounting system
- Patent number 11,587,804
- Issue date Feb 21, 2023
- BONDTECH CO., LTD.
- Akira Yamauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die attach systems including a verification substrate
- Patent number 11,574,832
- Issue date Feb 7, 2023
- Assembleon B.V.
- Alain De Bock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems for direct transfer of semiconductor device die
- Patent number 11,562,990
- Issue date Jan 24, 2023
- Rohinni, Inc.
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for embedding semiconductor devices
- Patent number 11,538,699
- Issue date Dec 27, 2022
- Rohinni, LLC
- Cody Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct transfer of semiconductor devices from a substrate
- Patent number 11,515,293
- Issue date Nov 29, 2022
- Rohinni, LLC
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembly
- Patent number 11,508,694
- Issue date Nov 22, 2022
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transfer of semiconductor devices onto glass substrates
- Patent number 11,488,940
- Issue date Nov 1, 2022
- Rohinni, Inc.
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for bonding semiconductor elements
- Patent number 11,295,996
- Issue date Apr 5, 2022
- Kulicke and Soffa Industries, Inc.
- James E. Eder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting device
- Patent number 11,262,056
- Issue date Mar 1, 2022
- FUJI CORPORATION
- Kohei Sugihara
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Component handling device for removing components from a structured...
- Patent number 11,232,961
- Issue date Jan 25, 2022
- Muehlbauer GmbH & Co. KG
- Henri Junker
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
High speed handling of ultra-small chips by selective laser bonding...
- Patent number 11,222,862
- Issue date Jan 11, 2022
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding apparatus, substrate pairing apparatus, and semic...
- Patent number 11,148,938
- Issue date Oct 19, 2021
- TOSHIBA MEMORY CORPORATION
- Sho Kawadahara
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for improved transfer of semiconductor die
- Patent number 11,152,339
- Issue date Oct 19, 2021
- Rohinni, LLC
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for positioning first object in relation to secon...
- Patent number 11,139,193
- Issue date Oct 5, 2021
- Shinkawa Ltd.
- Tetsuya Utano
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Alignment method, method for connecting electronic component, metho...
- Patent number 11,049,842
- Issue date Jun 29, 2021
- Dexerials Corporation
- Yasushi Akutsu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Bond head assemblies including reflective optical elements, related...
- Patent number 11,031,367
- Issue date Jun 8, 2021
- Kulicke and Soffa Industries, In.
- Matthew B. Wasserman
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
System and Method for Bonding Semiconductor Devices
- Publication number 20240395766
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kai-Tai Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND BONDING METHOD USING THE SAME
- Publication number 20240332249
- Publication date Oct 3, 2024
- SAMSUNG DISPLAY CO., LTD.
- JEONGMIN BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD, BONDING APPARATUS, ARTICLE MANUFACTURING METHOD, DE...
- Publication number 20240243094
- Publication date Jul 18, 2024
- Canon Kabushiki Kaisha
- MASAHIRO KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS, BONDING METHOD, AND ARTICLE MANUFACTURING METHOD
- Publication number 20240194636
- Publication date Jun 13, 2024
- Canon Kabushiki Kaisha
- KENICHIRO MORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS
- Publication number 20240021570
- Publication date Jan 18, 2024
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Jiho JOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20230378121
- Publication date Nov 23, 2023
- TOKYO ELECTRON LIMITED
- Yuhei Matsuo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
BUMP TO PACKAGE SUBSTRATE SOLDER JOINT
- Publication number 20230352441
- Publication date Nov 2, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Dolores Milo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CURVED WAFER STAGE
- Publication number 20230260954
- Publication date Aug 17, 2023
- NEXPERIA B.V.
- Joep Stokkermans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A METHOD OF FORMING A BONDED SEMICONDUCTOR STRUCTURE
- Publication number 20230238353
- Publication date Jul 27, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- JEN-YUAN CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC CHIP MOUNTING DEVICE AND IC CHIP MOUNTING METHOD
- Publication number 20230223376
- Publication date Jul 13, 2023
- SATO HOLDINGS KABUSHIKI KAISHA
- Yoshimitsu MAEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE (POP) TYPE SEMICONDUCTOR PACKAGES
- Publication number 20230223387
- Publication date Jul 13, 2023
- Samsung Electronics Co., Ltd.
- Minho Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MOUNTING DEVICE AND MOUNTING METHOD
- Publication number 20230163096
- Publication date May 25, 2023
- TORAY ENGINEERING CO., LTD.
- Katsumi TERADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ATTACH SYSTEMS, AND METHODS FOR INTEGRATED ACCURACY VERIFICATIO...
- Publication number 20230148420
- Publication date May 11, 2023
- Assembleon B.V.
- Alain De Bock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP CONVEYING APPARATUS AND DIE BONDER
- Publication number 20230031977
- Publication date Feb 2, 2023
- Disco Corporation
- Hiromitsu YOSHIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20220406747
- Publication date Dec 22, 2022
- SHINKAWA LTD.
- Hideharu NIHEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT BONDING MACHINES, AND METHODS OF MEASURING A D...
- Publication number 20220384384
- Publication date Dec 1, 2022
- KULICKE AND SOFFA INDUSTRIES, INC.
- Matthew B. Wasserman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20220375799
- Publication date Nov 24, 2022
- TOKYO ELECTRON LIMITED
- Tetsuya Maki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS
- Publication number 20220310551
- Publication date Sep 29, 2022
- Samsung Electronics Co., Ltd.
- ILHYOUNG KOO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING APPARATUS, BONDING SYSTEM, AND BONDING METHOD
- Publication number 20220302077
- Publication date Sep 22, 2022
- TOKYO ELECTRON LIMITED
- Takashi Terada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING APPARATUS AND SUBSTRATE BONDING METHOD
- Publication number 20220208720
- Publication date Jun 30, 2022
- TES CO., LTD.
- Joo-Il HA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING DEVICE
- Publication number 20220120419
- Publication date Apr 21, 2022
- FUJI CORPORATION
- Kohei SUGIHARA
- F21 - LIGHTING
Information Patent Application
SUBSTRATE BONDING APPARATUS
- Publication number 20220052018
- Publication date Feb 17, 2022
- L TRIN.CO.,LTD
- Yong Won CHA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
BONDING APPARATUS AND METHOD OF FABRICATING DISPLAY DEVICE USING TH...
- Publication number 20210305201
- Publication date Sep 30, 2021
- SAMSUNG DISPLAY CO., LTD.
- Taeyoung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS
- Publication number 20210242191
- Publication date Aug 5, 2021
- Toshiba Memory Corporation
- Toshihiko Ohda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING APPARATUS, MANUFACTURING SYSTEM, AND SEMICONDUCTO...
- Publication number 20210074670
- Publication date Mar 11, 2021
- Kioxia Corporation
- Sho KAWADAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BONDING METHOD AND WAFER BONDING APPARATUS
- Publication number 20210050324
- Publication date Feb 18, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yun-Tai SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS
- Publication number 20200273759
- Publication date Aug 27, 2020
- KULICKE AND SOFFA INDUSTRIES, INC.
- James E. Eder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR DIRECT TRANSFER OF SEMICONDUCTOR DEVICES F...
- Publication number 20200251453
- Publication date Aug 6, 2020
- Rohinni, LLC
- Andrew Huska
- G02 - OPTICS
Information Patent Application
APPARATUS FOR DIRECT TRANSFER OF SEMICONDUCTOR DEVICE DIE
- Publication number 20200243491
- Publication date Jul 30, 2020
- Rohinni, LLC
- Cody Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ON GLASS SUBSTRATE
- Publication number 20200235081
- Publication date Jul 23, 2020
- Rohinni, LLC
- Andrew Huska
- G02 - OPTICS

Means for optical alignment

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Mounting device and mounting method

Bonding apparatus and bonding method

Substrate bonding apparatus

Apparatus and method for semiconductor device bonding

Die bonding for chip conveying apparatus

Mounting device

Mounting device and mounting method

Bonding apparatus and method of fabricating display device using th...

Substrate bonding apparatus, manufacturing system, and semiconducto...

Semiconductor manufacturing apparatus

Wafer bonding method and wafer bonding apparatus

Semiconductor manufacturing apparatus

Method and apparatus for bonding semiconductor substrate

Package-on-package (POP) type semiconductor packages

Component mounting system

Die attach systems including a verification substrate

Systems for direct transfer of semiconductor device die

Method and apparatus for embedding semiconductor devices

Direct transfer of semiconductor devices from a substrate

Chip assembly

Method for transfer of semiconductor devices onto glass substrates

Systems and methods for bonding semiconductor elements

Mounting device

Component handling device for removing components from a structured...

High speed handling of ultra-small chips by selective laser bonding...

Substrate bonding apparatus, substrate pairing apparatus, and semic...

Method for improved transfer of semiconductor die

Device and method for positioning first object in relation to secon...

Alignment method, method for connecting electronic component, metho...

Bond head assemblies including reflective optical elements, related...

Patents Applicationslast 30 patents

System and Method for Bonding Semiconductor Devices

BONDING APPARATUS AND BONDING METHOD USING THE SAME

BONDING METHOD, BONDING APPARATUS, ARTICLE MANUFACTURING METHOD, DE...

BONDING APPARATUS, BONDING METHOD, AND ARTICLE MANUFACTURING METHOD

BONDING APPARATUS

BONDING APPARATUS AND BONDING METHOD

BUMP TO PACKAGE SUBSTRATE SOLDER JOINT

CURVED WAFER STAGE

A METHOD OF FORMING A BONDED SEMICONDUCTOR STRUCTURE

IC CHIP MOUNTING DEVICE AND IC CHIP MOUNTING METHOD

PACKAGE-ON-PACKAGE (POP) TYPE SEMICONDUCTOR PACKAGES

MOUNTING DEVICE AND MOUNTING METHOD

DIE ATTACH SYSTEMS, AND METHODS FOR INTEGRATED ACCURACY VERIFICATIO...

CHIP CONVEYING APPARATUS AND DIE BONDER

BONDING APPARATUS AND BONDING METHOD

ELECTRONIC COMPONENT BONDING MACHINES, AND METHODS OF MEASURING A D...

BONDING APPARATUS AND BONDING METHOD

SEMICONDUCTOR MANUFACTURING APPARATUS

BONDING APPARATUS, BONDING SYSTEM, AND BONDING METHOD

SUBSTRATE BONDING APPARATUS AND SUBSTRATE BONDING METHOD

MOUNTING DEVICE

SUBSTRATE BONDING APPARATUS

BONDING APPARATUS AND METHOD OF FABRICATING DISPLAY DEVICE USING TH...

SEMICONDUCTOR MANUFACTURING APPARATUS

SUBSTRATE BONDING APPARATUS, MANUFACTURING SYSTEM, AND SEMICONDUCTO...

WAFER BONDING METHOD AND WAFER BONDING APPARATUS

SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS

APPARATUS AND METHOD FOR DIRECT TRANSFER OF SEMICONDUCTOR DEVICES F...

APPARATUS FOR DIRECT TRANSFER OF SEMICONDUCTOR DEVICE DIE

SEMICONDUCTOR DEVICE ON GLASS SUBSTRATE