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H01L2224/75753
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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/75753
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Patents Grants
last 30 patents
Information
Patent Grant
Mounting device and mounting method
Patent number
12,154,811
Issue date
Nov 26, 2024
Toray Engineering Co., Ltd.
Yasushi Tamura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding apparatus and bonding method
Patent number
12,136,604
Issue date
Nov 5, 2024
Shinkawa Ltd.
Hideharu Nihei
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate bonding apparatus
Patent number
12,027,486
Issue date
Jul 2, 2024
L TRIN.CO., LTD
Yong Won Cha
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Apparatus and method for semiconductor device bonding
Patent number
11,990,445
Issue date
May 21, 2024
PYXIS CF PTE. LTD.
Amlan Sen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Die bonding for chip conveying apparatus
Patent number
11,929,344
Issue date
Mar 12, 2024
Disco Corporation
Hiromitsu Yoshimoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Mounting device
Patent number
11,835,207
Issue date
Dec 5, 2023
FUJI CORPORATION
Kohei Sugihara
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Mounting device and mounting method
Patent number
11,823,938
Issue date
Nov 21, 2023
Toray Engineering Co., Ltd.
Yasushi Tamura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding apparatus and method of fabricating display device using th...
Patent number
11,798,912
Issue date
Oct 24, 2023
Samsung Display Co., Ltd.
Taeyoung Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate bonding apparatus, manufacturing system, and semiconducto...
Patent number
11,776,931
Issue date
Oct 3, 2023
Kioxia Corporation
Sho Kawadahara
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor manufacturing apparatus
Patent number
11,749,667
Issue date
Sep 5, 2023
Kioxia Corporation
Toshihiko Ohda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer bonding method and wafer bonding apparatus
Patent number
11,721,662
Issue date
Aug 8, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Yun-Tai Shih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor manufacturing apparatus
Patent number
11,658,147
Issue date
May 23, 2023
Samsung Electronics Co., Ltd.
Ilhyoung Koo
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method and apparatus for bonding semiconductor substrate
Patent number
11,631,652
Issue date
Apr 18, 2023
Taiwan Semiconductor Manufacturing Company Ltd.
Ying-Jui Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package-on-package (POP) type semiconductor packages
Patent number
11,610,871
Issue date
Mar 21, 2023
Samsung Electronics Co., Ltd.
Minho Lee
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Component mounting system
Patent number
11,587,804
Issue date
Feb 21, 2023
BONDTECH CO., LTD.
Akira Yamauchi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Die attach systems including a verification substrate
Patent number
11,574,832
Issue date
Feb 7, 2023
Assembleon B.V.
Alain De Bock
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Systems for direct transfer of semiconductor device die
Patent number
11,562,990
Issue date
Jan 24, 2023
Rohinni, Inc.
Andrew Huska
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and apparatus for embedding semiconductor devices
Patent number
11,538,699
Issue date
Dec 27, 2022
Rohinni, LLC
Cody Peterson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Direct transfer of semiconductor devices from a substrate
Patent number
11,515,293
Issue date
Nov 29, 2022
Rohinni, LLC
Andrew Huska
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip assembly
Patent number
11,508,694
Issue date
Nov 22, 2022
Infineon Technologies AG
Alexander Heinrich
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for transfer of semiconductor devices onto glass substrates
Patent number
11,488,940
Issue date
Nov 1, 2022
Rohinni, Inc.
Andrew Huska
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Systems and methods for bonding semiconductor elements
Patent number
11,295,996
Issue date
Apr 5, 2022
Kulicke and Soffa Industries, Inc.
James E. Eder
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Mounting device
Patent number
11,262,056
Issue date
Mar 1, 2022
FUJI CORPORATION
Kohei Sugihara
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Component handling device for removing components from a structured...
Patent number
11,232,961
Issue date
Jan 25, 2022
Muehlbauer GmbH & Co. KG
Henri Junker
B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information
Patent Grant
High speed handling of ultra-small chips by selective laser bonding...
Patent number
11,222,862
Issue date
Jan 11, 2022
International Business Machines Corporation
Qianwen Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for improved transfer of semiconductor die
Patent number
11,152,339
Issue date
Oct 19, 2021
Rohinni, LLC
Andrew Huska
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate bonding apparatus, substrate pairing apparatus, and semic...
Patent number
11,148,938
Issue date
Oct 19, 2021
TOSHIBA MEMORY CORPORATION
Sho Kawadahara
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Device and method for positioning first object in relation to secon...
Patent number
11,139,193
Issue date
Oct 5, 2021
Shinkawa Ltd.
Tetsuya Utano
B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information
Patent Grant
Alignment method, method for connecting electronic component, metho...
Patent number
11,049,842
Issue date
Jun 29, 2021
Dexerials Corporation
Yasushi Akutsu
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Grant
Bond head assemblies including reflective optical elements, related...
Patent number
11,031,367
Issue date
Jun 8, 2021
Kulicke and Soffa Industries, In.
Matthew B. Wasserman
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
System and Method for Bonding Semiconductor Devices
Publication number
20240395766
Publication date
Nov 28, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Kai-Tai Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING APPARATUS AND BONDING METHOD USING THE SAME
Publication number
20240332249
Publication date
Oct 3, 2024
SAMSUNG DISPLAY CO., LTD.
JEONGMIN BAE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING METHOD, BONDING APPARATUS, ARTICLE MANUFACTURING METHOD, DE...
Publication number
20240243094
Publication date
Jul 18, 2024
Canon Kabushiki Kaisha
MASAHIRO KIMURA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING APPARATUS, BONDING METHOD, AND ARTICLE MANUFACTURING METHOD
Publication number
20240194636
Publication date
Jun 13, 2024
Canon Kabushiki Kaisha
KENICHIRO MORI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING APPARATUS
Publication number
20240021570
Publication date
Jan 18, 2024
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
Jiho JOO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING APPARATUS AND BONDING METHOD
Publication number
20230378121
Publication date
Nov 23, 2023
TOKYO ELECTRON LIMITED
Yuhei Matsuo
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
BUMP TO PACKAGE SUBSTRATE SOLDER JOINT
Publication number
20230352441
Publication date
Nov 2, 2023
TEXAS INSTRUMENTS INCORPORATED
Dolores Milo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CURVED WAFER STAGE
Publication number
20230260954
Publication date
Aug 17, 2023
NEXPERIA B.V.
Joep Stokkermans
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
A METHOD OF FORMING A BONDED SEMICONDUCTOR STRUCTURE
Publication number
20230238353
Publication date
Jul 27, 2023
Taiwan Semiconductor Manufacturing company Ltd.
JEN-YUAN CHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
IC CHIP MOUNTING DEVICE AND IC CHIP MOUNTING METHOD
Publication number
20230223376
Publication date
Jul 13, 2023
SATO HOLDINGS KABUSHIKI KAISHA
Yoshimitsu MAEDA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE-ON-PACKAGE (POP) TYPE SEMICONDUCTOR PACKAGES
Publication number
20230223387
Publication date
Jul 13, 2023
Samsung Electronics Co., Ltd.
Minho Lee
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
MOUNTING DEVICE AND MOUNTING METHOD
Publication number
20230163096
Publication date
May 25, 2023
TORAY ENGINEERING CO., LTD.
Katsumi TERADA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIE ATTACH SYSTEMS, AND METHODS FOR INTEGRATED ACCURACY VERIFICATIO...
Publication number
20230148420
Publication date
May 11, 2023
Assembleon B.V.
Alain De Bock
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP CONVEYING APPARATUS AND DIE BONDER
Publication number
20230031977
Publication date
Feb 2, 2023
Disco Corporation
Hiromitsu YOSHIMOTO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING APPARATUS AND BONDING METHOD
Publication number
20220406747
Publication date
Dec 22, 2022
SHINKAWA LTD.
Hideharu NIHEI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC COMPONENT BONDING MACHINES, AND METHODS OF MEASURING A D...
Publication number
20220384384
Publication date
Dec 1, 2022
KULICKE AND SOFFA INDUSTRIES, INC.
Matthew B. Wasserman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING APPARATUS AND BONDING METHOD
Publication number
20220375799
Publication date
Nov 24, 2022
TOKYO ELECTRON LIMITED
Tetsuya Maki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS
Publication number
20220310551
Publication date
Sep 29, 2022
Samsung Electronics Co., Ltd.
ILHYOUNG KOO
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
BONDING APPARATUS, BONDING SYSTEM, AND BONDING METHOD
Publication number
20220302077
Publication date
Sep 22, 2022
TOKYO ELECTRON LIMITED
Takashi Terada
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE BONDING APPARATUS AND SUBSTRATE BONDING METHOD
Publication number
20220208720
Publication date
Jun 30, 2022
TES CO., LTD.
Joo-Il HA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MOUNTING DEVICE
Publication number
20220120419
Publication date
Apr 21, 2022
FUJI CORPORATION
Kohei SUGIHARA
F21 - LIGHTING
Information
Patent Application
SUBSTRATE BONDING APPARATUS
Publication number
20220052018
Publication date
Feb 17, 2022
L TRIN.CO.,LTD
Yong Won CHA
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
BONDING APPARATUS AND METHOD OF FABRICATING DISPLAY DEVICE USING TH...
Publication number
20210305201
Publication date
Sep 30, 2021
SAMSUNG DISPLAY CO., LTD.
Taeyoung Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS
Publication number
20210242191
Publication date
Aug 5, 2021
Toshiba Memory Corporation
Toshihiko Ohda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE BONDING APPARATUS, MANUFACTURING SYSTEM, AND SEMICONDUCTO...
Publication number
20210074670
Publication date
Mar 11, 2021
Kioxia Corporation
Sho KAWADAHARA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER BONDING METHOD AND WAFER BONDING APPARATUS
Publication number
20210050324
Publication date
Feb 18, 2021
Taiwan Semiconductor Manufacturing Company, Ltd.
Yun-Tai SHIH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS
Publication number
20200273759
Publication date
Aug 27, 2020
KULICKE AND SOFFA INDUSTRIES, INC.
James E. Eder
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
APPARATUS AND METHOD FOR DIRECT TRANSFER OF SEMICONDUCTOR DEVICES F...
Publication number
20200251453
Publication date
Aug 6, 2020
Rohinni, LLC
Andrew Huska
G02 - OPTICS
Information
Patent Application
APPARATUS FOR DIRECT TRANSFER OF SEMICONDUCTOR DEVICE DIE
Publication number
20200243491
Publication date
Jul 30, 2020
Rohinni, LLC
Cody Peterson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE ON GLASS SUBSTRATE
Publication number
20200235081
Publication date
Jul 23, 2020
Rohinni, LLC
Andrew Huska
G02 - OPTICS