Means for preventing a bipolar

Industry

CPC
H01L27/0921

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L27/00Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate

Current Industry

H01L27/0921Means for preventing a bipolar

Industries

Patents Grantslast 30 patents

Information Patent Grant
Latch-up test structure
- Patent number 12,119,274
- Issue date Oct 15, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Qian Xu
- G01 - MEASURING TESTING
Information Patent Grant
Logic circuit capable of preventing latch-up
- Patent number 12,087,773
- Issue date Sep 10, 2024
- Yung-Ju Wen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor structure and related inverter
- Patent number 12,074,205
- Issue date Aug 27, 2024
- Etron Technology, Inc.
- Chao-Chun Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Latch-up prevention
- Patent number 12,062,721
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with guard region and diode circuit
- Patent number 12,040,357
- Issue date Jul 16, 2024
- NXP B.V.
- Guido Wouter Willem Quax
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protection circuit
- Patent number 12,002,800
- Issue date Jun 4, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduce well dopant loss in FinFETs through co-implantation
- Patent number 11,978,634
- Issue date May 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sih-Jie Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded semiconductor region for latch-up susceptibility improvement
- Patent number 11,973,080
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including transistors sharing gates with struc...
- Patent number 11,908,859
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Feng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices and a semiconductor d...
- Patent number 11,908,864
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated chip with improved latch-up immunity
- Patent number 11,908,860
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Wen Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices and systems, and methods for making and using th...
- Patent number 11,887,895
- Issue date Jan 30, 2024
- United Semiconductor Japan Co., Ltd.
- Scott E. Thompson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including transistors sharing gates with struc...
- Patent number 11,855,088
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Feng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for FinFET devices
- Patent number 11,855,089
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yong-Yan Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulated trench gates with dopants implanted through gate oxide
- Patent number 11,824,092
- Issue date Nov 21, 2023
- Pakal Technologies, Inc.
- Paul M. Moore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method of integrated circuit having decouple capacitance
- Patent number 11,756,959
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ching-Wei Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor layout in FinFET technologies
- Patent number 11,720,734
- Issue date Aug 8, 2023
- Apple Inc.
- Farzan Farbiz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Guard ring capacitor method and structure
- Patent number 11,695,007
- Issue date Jul 4, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Hsiang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Logic circuit capable of preventing latch-up
- Patent number 11,688,739
- Issue date Jun 27, 2023
- PixArt Imaging Inc.
- Yung-Ju Wen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device, method, and system
- Patent number 11,646,317
- Issue date May 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien Yao Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Crown bulk for FinFET device
- Patent number 11,587,927
- Issue date Feb 21, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Chuan Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures for improving radiation hardness and eliminating latch-u...
- Patent number 11,587,822
- Issue date Feb 21, 2023
- Silicon Space Technology Corporation
- David R. Gifford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,581,403
- Issue date Feb 14, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tien-Lu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for FinFET devices
- Patent number 11,569,230
- Issue date Jan 31, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yong-Yan Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated capacitive element and corresponding production method
- Patent number 11,538,941
- Issue date Dec 27, 2022
- STMicroelectronics (Rousset) SAS
- Abderrezak Marzaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal gate modulation to improve kink effect
- Patent number 11,532,621
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Meng-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Layout construction for addressing electromigration
- Patent number 11,508,725
- Issue date Nov 22, 2022
- QUALCOMM Incorporated
- Seid Hadi Rasouli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Latch-up immunization techniques for integrated circuits
- Patent number 11,502,078
- Issue date Nov 15, 2022
- STMicroelectronics International N.V.
- Vishal Kumar Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Distributed electrical overstress protection for large density and...
- Patent number 11,462,535
- Issue date Oct 4, 2022
- Analog Devices, Inc.
- Javier A. Salcedo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Layout construction for addressing electromigration
- Patent number 11,437,375
- Issue date Sep 6, 2022
- QUALCOMM Incorporated
- Seid Hadi Rasouli
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT DEVICE MANUFACTURING METHOD
- Publication number 20240387554
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Yao HUANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR CIRCUIT
- Publication number 20240371950
- Publication date Nov 7, 2024
- ETRON TECHNOLOGY, INC.
- Chao-Chun Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LATCH-UP PREVENTION
- Publication number 20240363759
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih-Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTION CIRCUIT
- Publication number 20240274596
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Yao HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCE WELL DOPANT LOSS IN FINFETS THROUGH CO-IMPLANTATION
- Publication number 20240249944
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sih-Jie Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED SEMICONDUCTOR REGION FOR A LATCH-UP SUSCEPTIBILITY IMPROVE...
- Publication number 20240243129
- Publication date Jul 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240222436
- Publication date Jul 4, 2024
- Fuji Electric Co., Ltd.
- Takashi TSUJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND A SEMICONDUCTOR D...
- Publication number 20240153953
- Publication date May 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Hung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CHIP WITH IMPROVED LATCH-UP IMMUNITY
- Publication number 20240153949
- Publication date May 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Wen Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING TRANSISTORS SHARING GATES WITH STRUC...
- Publication number 20240153950
- Publication date May 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Feng CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR STRUCTURE
- Publication number 20240105723
- Publication date Mar 28, 2024
- Invention And Collaboration Laboratory Pte. Ltd.
- Chao-Chun LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING TRANSISTORS SHARING GATES WITH STRUC...
- Publication number 20240079408
- Publication date Mar 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Feng CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF
- Publication number 20240047460
- Publication date Feb 8, 2024
- Vanguard International Semiconductor Corporation
- Chih-Cherng Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR LAYOUT IN FINFET TECHNOLOGIES
- Publication number 20230409797
- Publication date Dec 21, 2023
- Apple Inc.
- Farzan Farbiz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
GUARD RING CAPACITOR METHOD AND STRUCTURE
- Publication number 20230343785
- Publication date Oct 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Hsiang WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ESD PROTECTION CIRCUIT, ESD PROTECTION METHOD, SEMICONDUCTOR MEMORY...
- Publication number 20230317711
- Publication date Oct 5, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Zhan XUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GUARD REGION FOR AN INTEGRATED CIRCUIT
- Publication number 20230317726
- Publication date Oct 5, 2023
- NXP B.V.
- Guido Wouter Willem Quax
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STANDARD CELL STRUCTURE
- Publication number 20230299069
- Publication date Sep 21, 2023
- Invention And Collaboration Laboratory Pte. Ltd.
- Chao-Chun LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOGIC CIRCUIT CAPABLE OF PREVENTING LATCH-UP
- Publication number 20230275089
- Publication date Aug 31, 2023
- PIXART IMAGING INC.
- Yung-Ju WEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE AND METHOD
- Publication number 20230261003
- Publication date Aug 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Yao HUANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230141634
- Publication date May 11, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tien-Lu LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL CARRIER STORED TRENCH IGBT AND MANUFACTURING METH...
- Publication number 20230090883
- Publication date Mar 23, 2023
- University of Electronic Science and Technology of China
- Jinping ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Latch-up Free High Voltage Device
- Publication number 20230044360
- Publication date Feb 9, 2023
- Halo Microelectronics International
- Lijie Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYOUT DESIGN FOR HEADER CELL IN 3D INTEGRATED CIRCUITS
- Publication number 20220384414
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- CHENG-YU LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Crown Bulk for FinFET Device
- Publication number 20220367459
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chuan Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embedded Semiconductor Region for Latch-Up Susceptibility Improvement
- Publication number 20220352159
- Publication date Nov 3, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien Yao HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTION CIRCUIT
- Publication number 20220344322
- Publication date Oct 27, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Yao HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE FOR FINFET DEVICES
- Publication number 20220302113
- Publication date Sep 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yong-Yan Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOGIC CIRCUIT CAPABLE OF PREVENTING LATCH-UP
- Publication number 20220302112
- Publication date Sep 22, 2022
- PIXART IMAGING INC.
- Yung-Ju WEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reduce Well Dopant Loss in FinFETs Through Co-Implantation
- Publication number 20220301874
- Publication date Sep 22, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sih-Jie Liu
- H01 - BASIC ELECTRIC ELEMENTS

Means for preventing a bipolar

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Latch-up test structure

Logic circuit capable of preventing latch-up

Transistor structure and related inverter

Latch-up prevention

Integrated circuit with guard region and diode circuit

Protection circuit

Reduce well dopant loss in FinFETs through co-implantation

Embedded semiconductor region for latch-up susceptibility improvement

Semiconductor device including transistors sharing gates with struc...

Method of manufacturing semiconductor devices and a semiconductor d...

Integrated chip with improved latch-up immunity

Electronic devices and systems, and methods for making and using th...

Semiconductor device including transistors sharing gates with struc...

Method and structure for FinFET devices

Insulated trench gates with dopants implanted through gate oxide

Structure and method of integrated circuit having decouple capacitance

Semiconductor layout in FinFET technologies

Guard ring capacitor method and structure

Logic circuit capable of preventing latch-up

Integrated circuit device, method, and system

Crown bulk for FinFET device

Structures for improving radiation hardness and eliminating latch-u...

Semiconductor device and manufacturing method thereof

Method and structure for FinFET devices

Integrated capacitive element and corresponding production method

Metal gate modulation to improve kink effect

Layout construction for addressing electromigration

Latch-up immunization techniques for integrated circuits

Distributed electrical overstress protection for large density and...

Layout construction for addressing electromigration

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT DEVICE MANUFACTURING METHOD

SEMICONDUCTOR CIRCUIT

LATCH-UP PREVENTION

PROTECTION CIRCUIT

REDUCE WELL DOPANT LOSS IN FINFETS THROUGH CO-IMPLANTATION

EMBEDDED SEMICONDUCTOR REGION FOR A LATCH-UP SUSCEPTIBILITY IMPROVE...

SEMICONDUCTOR MODULE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND A SEMICONDUCTOR D...

INTEGRATED CHIP WITH IMPROVED LATCH-UP IMMUNITY

SEMICONDUCTOR DEVICE INCLUDING TRANSISTORS SHARING GATES WITH STRUC...

TRANSISTOR STRUCTURE

SEMICONDUCTOR DEVICE INCLUDING TRANSISTORS SHARING GATES WITH STRUC...

SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR LAYOUT IN FINFET TECHNOLOGIES

GUARD RING CAPACITOR METHOD AND STRUCTURE

ESD PROTECTION CIRCUIT, ESD PROTECTION METHOD, SEMICONDUCTOR MEMORY...

GUARD REGION FOR AN INTEGRATED CIRCUIT

STANDARD CELL STRUCTURE

LOGIC CIRCUIT CAPABLE OF PREVENTING LATCH-UP

INTEGRATED CIRCUIT DEVICE AND METHOD

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

THREE-DIMENSIONAL CARRIER STORED TRENCH IGBT AND MANUFACTURING METH...

Latch-up Free High Voltage Device

LAYOUT DESIGN FOR HEADER CELL IN 3D INTEGRATED CIRCUITS

Crown Bulk for FinFET Device

Embedded Semiconductor Region for Latch-Up Susceptibility Improvement

PROTECTION CIRCUIT

METHOD AND STRUCTURE FOR FINFET DEVICES

LOGIC CIRCUIT CAPABLE OF PREVENTING LATCH-UP

Reduce Well Dopant Loss in FinFETs Through Co-Implantation