Means for transporting the components to be connected

Industry

CPC
H01L2224/7565

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/7565Means for transporting the components to be connected

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Tools and systems for processing semiconductor devices, and methods...
- Patent number 12,142,594
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of chip transferring and device/module having gas guiding st...
- Patent number 12,106,981
- Issue date Oct 1, 2024
- MICRAFT SYSTEM PLUS CO., LTD.
- Chien-Shou Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip bonding apparatus and securing assembly therefor
- Patent number 12,074,133
- Issue date Aug 27, 2024
- GUANGZHOU AIFO LIGHT COMMUNICATION TECHNOLOGY COMPANY LTD.
- Guoqiang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer tool and method for transferring semiconductor chips
- Patent number 12,020,973
- Issue date Jun 25, 2024
- Osram Opto Semiconductors GmbH
- Andreas Plöβl
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
System and method for connecting electronic assemblies
- Patent number 12,021,058
- Issue date Jun 25, 2024
- PINK GMBH THERMOSYSTEME
- Christoph Oetzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for semiconductor device bonding
- Patent number 11,990,445
- Issue date May 21, 2024
- PYXIS CF PTE. LTD.
- Amlan Sen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method of fluidic assembly of microchips on a substrate
- Patent number 11,942,450
- Issue date Mar 26, 2024
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Melina Haupt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die bonding for chip conveying apparatus
- Patent number 11,929,344
- Issue date Mar 12, 2024
- Disco Corporation
- Hiromitsu Yoshimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for enhanced microelectronic device handling
- Patent number 11,911,904
- Issue date Feb 27, 2024
- Micron Technology, Inc.
- Kuan Wei Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laned belt for cleaner
- Patent number 11,872,600
- Issue date Jan 16, 2024
- Illinois Tool Works Inc.
- John Neiderman
- B08 - CLEANING
Information Patent Grant
Electronic device
- Patent number 11,843,085
- Issue date Dec 12, 2023
- Innolux Corporation
- Shun-Yuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser bonding apparatus for three-dimensional molded sculptures
- Patent number 11,813,688
- Issue date Nov 14, 2023
- LASERSSEL CO., LTD.
- Jae Joon Choi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light emitting diode display with redundancy scheme
- Patent number 11,778,842
- Issue date Oct 3, 2023
- Apple Inc.
- Andreas Bibl
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Tape carrier assemblies having an integrated adhesive film
- Patent number 11,764,133
- Issue date Sep 19, 2023
- Daewon Semiconductor Packaging Industrial Company
- Sunna Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing apparatus
- Patent number 11,749,667
- Issue date Sep 5, 2023
- Kioxia Corporation
- Toshihiko Ohda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus
- Patent number 11,749,541
- Issue date Sep 5, 2023
- Shinkawa Ltd.
- Shigeyuki Sekiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for and method for aligning dipoles and method of fabrica...
- Patent number 11,728,196
- Issue date Aug 15, 2023
- Samsung Display Co., Ltd.
- Won Ho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Arrangement and method for joining at least two joining partners
- Patent number 11,676,933
- Issue date Jun 13, 2023
- Infineon Technologies AG
- Steffen Hartmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus, system, and method for handling aligned wafer pairs
- Patent number 11,651,983
- Issue date May 16, 2023
- Suss MicroTec Lithography GmbH
- Hale Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for bonding semiconductor substrate
- Patent number 11,631,652
- Issue date Apr 18, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ying-Jui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component mounting system
- Patent number 11,587,804
- Issue date Feb 21, 2023
- BONDTECH CO., LTD.
- Akira Yamauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems for direct transfer of semiconductor device die
- Patent number 11,562,990
- Issue date Jan 24, 2023
- Rohinni, Inc.
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrasonic-assisted solder transfer
- Patent number 11,541,472
- Issue date Jan 3, 2023
- International Business Machines Corporation
- Jae-Woong Nah
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device and method for manufacturing the same
- Patent number 11,545,606
- Issue date Jan 3, 2023
- Innolux Corporation
- Shun-Yuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of bonding of semiconductor elements to substrates, and rel...
- Patent number 11,515,286
- Issue date Nov 29, 2022
- Kulicke and Soffa Industries, Inc.
- Adeel Ahmad Bajwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for reel-to-reel laser reflow
- Patent number 11,515,287
- Issue date Nov 29, 2022
- LASERSSEL CO., LTD.
- Byung Rock Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Direct transfer of semiconductor devices from a substrate
- Patent number 11,515,293
- Issue date Nov 29, 2022
- Rohinni, LLC
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly apparatus for assembling semiconductor light emitting diod...
- Patent number 11,502,055
- Issue date Nov 15, 2022
- LG Electronics Inc.
- Hyunwoo Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transfer of semiconductor devices onto glass substrates
- Patent number 11,488,940
- Issue date Nov 1, 2022
- Rohinni, Inc.
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for bonding a chip to a substrate
- Patent number 11,476,228
- Issue date Oct 18, 2022
- Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Gari Arutinov
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
FLUXLESS DIE BONDING USING IN-SITU PLASMA TREATMENT AND APPARATUS F...
- Publication number 20240404988
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PARALLEL PLASMA TREATMENT AND THERMOCOMPRESSION BONDING AND APPARAT...
- Publication number 20240404989
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOOLS AND SYSTEMS FOR PROCESSING SEMICONDUCTOR DEVICES, AND METHODS...
- Publication number 20240395767
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING ELECTRONIC DEVICE
- Publication number 20240363579
- Publication date Oct 31, 2024
- Samsung Electronics Co., Ltd.
- Seungyeop Oh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD FOR FLUXLESS THERMOCOMPRESSION BONDING
- Publication number 20240339430
- Publication date Oct 10, 2024
- ASMPT SINGAPORE PTE. LTD
- Zetao MA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ASSEMBLY DONOR AND METHOD FOR MANUFACTURING DISPLAY DEVICE USI...
- Publication number 20240258270
- Publication date Aug 1, 2024
- LG Display Co., Ltd.
- Sunghwan YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HANDLING A FRAGILE SUBSTRATE FOR INTERCONNECT BONDING
- Publication number 20240194634
- Publication date Jun 13, 2024
- ASMPT SINGAPORE PTE. LTD
- Keng Yew SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUSES FOR HANDLING MICROELECTRONIC DEVICES
- Publication number 20240139940
- Publication date May 2, 2024
- Micron Technology, Inc.
- Kuan Wei Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240072230
- Publication date Feb 29, 2024
- InnoLux Corporation
- Shun-Yuan HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR CONNECTING ELECTRONIC ASSEMBLIES
- Publication number 20240047413
- Publication date Feb 8, 2024
- PINK GMBH THERMOSYSTEME
- Christoph Oetzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME
- Publication number 20240008298
- Publication date Jan 4, 2024
- Apple Inc.
- Andreas Bibl
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
APPARATUS FOR AND METHOD FOR ALIGNING DIPOLES AND METHOD OF FABRICA...
- Publication number 20230386878
- Publication date Nov 30, 2023
- SAMSUNG DISPLAY CO., LTD.
- Won Ho LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CURVED WAFER STAGE
- Publication number 20230260954
- Publication date Aug 17, 2023
- NEXPERIA B.V.
- Joep Stokkermans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC CHIP MOUNTING DEVICE AND IC CHIP MOUNTING METHOD
- Publication number 20230223376
- Publication date Jul 13, 2023
- SATO HOLDINGS KABUSHIKI KAISHA
- Yoshimitsu MAEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING DEVICE AND MOUNTING METHOD
- Publication number 20230163096
- Publication date May 25, 2023
- TORAY ENGINEERING CO., LTD.
- Katsumi TERADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LANED BELT FOR CLEANER
- Publication number 20230104821
- Publication date Apr 6, 2023
- Illinois Tool Works Inc.
- John Neiderman
- B08 - CLEANING
Information Patent Application
CHIP CONVEYING APPARATUS AND DIE BONDER
- Publication number 20230031977
- Publication date Feb 2, 2023
- Disco Corporation
- Hiromitsu YOSHIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC CHIP MOUNTING DEVICE, AND IC CHIP MOUNTING METHOD
- Publication number 20230019546
- Publication date Jan 19, 2023
- SATO HOLDINGS KABUSHIKI KAISHA
- Yoshimitsu MAEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC CHIP MOUNTING DEVICE AND IC CHIP MOUNTING METHOD
- Publication number 20230011327
- Publication date Jan 12, 2023
- SATO HOLDINGS KABUSHIKI KAISHA
- Yoshimitsu MAEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING AND INDEXING METHOD
- Publication number 20220310553
- Publication date Sep 29, 2022
- NEXPERIA B.V.
- Ralph HUYBERS
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Tools and Systems for Processing Semiconductor Devices, and Methods...
- Publication number 20220302079
- Publication date Sep 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME
- Publication number 20220293876
- Publication date Sep 15, 2022
- Apple Inc.
- Andreas Bibl
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
CHIP-TRANSFERRING MODULE, AND DEVICE AND METHOD FOR TRANSFERRING AN...
- Publication number 20220238358
- Publication date Jul 28, 2022
- ASTI GLOBAL INC., TAIWAN
- CHIEN-SHOU LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD OF FLUIDIC ASSEMBLY OF MICROCHIPS ON A SUBSTRATE
- Publication number 20220165702
- Publication date May 26, 2022
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Melina Haupt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR AND METHOD FOR ALIGNING DIPOLES AND METHOD OF FABRICA...
- Publication number 20220005719
- Publication date Jan 6, 2022
- SAMSUNG DISPLAY CO., LTD.
- Won Ho LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transfer Tool and Method for Transferring Semiconductor Chips
- Publication number 20210384062
- Publication date Dec 9, 2021
- Osram Opto Semiconductors GmbH
- Andreas Plößl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20210313501
- Publication date Oct 7, 2021
- InnoLux Corporation
- Shun-Yuan HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210296551
- Publication date Sep 23, 2021
- InnoLux Corporation
- Shun-Yuan HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF BONDING OF SEMICONDUCTOR ELEMENTS TO SUBSTRATES, AND REL...
- Publication number 20210265303
- Publication date Aug 26, 2021
- KULICKE AND SOFFA INDUSTRIES, INC.
- Adeel Ahmad Bajwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME
- Publication number 20210257572
- Publication date Aug 19, 2021
- Apple Inc.
- Andreas Bibl
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS

Means for transporting the components to be connected

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Tools and systems for processing semiconductor devices, and methods...

Method of chip transferring and device/module having gas guiding st...

Chip bonding apparatus and securing assembly therefor

Transfer tool and method for transferring semiconductor chips

System and method for connecting electronic assemblies

Apparatus and method for semiconductor device bonding

Device and method of fluidic assembly of microchips on a substrate

Die bonding for chip conveying apparatus

Apparatus and methods for enhanced microelectronic device handling

Laned belt for cleaner

Electronic device

Laser bonding apparatus for three-dimensional molded sculptures

Light emitting diode display with redundancy scheme

Tape carrier assemblies having an integrated adhesive film

Semiconductor manufacturing apparatus

Bonding apparatus

Apparatus for and method for aligning dipoles and method of fabrica...

Arrangement and method for joining at least two joining partners

Apparatus, system, and method for handling aligned wafer pairs

Method and apparatus for bonding semiconductor substrate

Component mounting system

Systems for direct transfer of semiconductor device die

Ultrasonic-assisted solder transfer

Electronic device and method for manufacturing the same

Methods of bonding of semiconductor elements to substrates, and rel...

Device and method for reel-to-reel laser reflow

Direct transfer of semiconductor devices from a substrate

Assembly apparatus for assembling semiconductor light emitting diod...

Method for transfer of semiconductor devices onto glass substrates

Method and system for bonding a chip to a substrate

Patents Applicationslast 30 patents

FLUXLESS DIE BONDING USING IN-SITU PLASMA TREATMENT AND APPARATUS F...

PARALLEL PLASMA TREATMENT AND THERMOCOMPRESSION BONDING AND APPARAT...

TOOLS AND SYSTEMS FOR PROCESSING SEMICONDUCTOR DEVICES, AND METHODS...

SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING ELECTRONIC DEVICE

SYSTEM AND METHOD FOR FLUXLESS THERMOCOMPRESSION BONDING

SELF-ASSEMBLY DONOR AND METHOD FOR MANUFACTURING DISPLAY DEVICE USI...

HANDLING A FRAGILE SUBSTRATE FOR INTERCONNECT BONDING

APPARATUSES FOR HANDLING MICROELECTRONIC DEVICES

ELECTRONIC DEVICE

SYSTEM AND METHOD FOR CONNECTING ELECTRONIC ASSEMBLIES

LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME

APPARATUS FOR AND METHOD FOR ALIGNING DIPOLES AND METHOD OF FABRICA...

CURVED WAFER STAGE

IC CHIP MOUNTING DEVICE AND IC CHIP MOUNTING METHOD

MOUNTING DEVICE AND MOUNTING METHOD

LANED BELT FOR CLEANER

CHIP CONVEYING APPARATUS AND DIE BONDER

IC CHIP MOUNTING DEVICE, AND IC CHIP MOUNTING METHOD

IC CHIP MOUNTING DEVICE AND IC CHIP MOUNTING METHOD

BONDING AND INDEXING METHOD

Tools and Systems for Processing Semiconductor Devices, and Methods...

LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME

CHIP-TRANSFERRING MODULE, AND DEVICE AND METHOD FOR TRANSFERRING AN...

DEVICE AND METHOD OF FLUIDIC ASSEMBLY OF MICROCHIPS ON A SUBSTRATE

APPARATUS FOR AND METHOD FOR ALIGNING DIPOLES AND METHOD OF FABRICA...

Transfer Tool and Method for Transferring Semiconductor Chips

ELECTRONIC DEVICE

ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME

METHODS OF BONDING OF SEMICONDUCTOR ELEMENTS TO SUBSTRATES, AND REL...

LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME