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H01L2224/83912
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H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/83912
Mechanical cleaning
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Patents Grants
last 30 patents
Information
Patent Grant
Three dimensional device integration method and integrated device
Patent number
10,366,962
Issue date
Jul 30, 2019
INVENSAS BONDING TECHNOLOGIES, INC.
Paul M. Enquist
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Light emitting die (LED) packages and related methods
Patent number
10,256,385
Issue date
Apr 9, 2019
Cree, Inc.
Jeffrey Carl Britt
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Techniques for adhesive control between a substrate and a die
Patent number
10,056,294
Issue date
Aug 21, 2018
Maxim Integrated Products, Inc.
Vivek S. Sridharan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display device and method for producing same
Patent number
9,740,067
Issue date
Aug 22, 2017
Sharp Kabushiki Kaisha
Keiji Aota
G02 - OPTICS
Patents Applications
last 30 patents
Information
Patent Application
SOLDER REFLOW SYSTEM AND SOLDER REFLOW METHOD USING THE SAME
Publication number
20240120310
Publication date
Apr 11, 2024
Samsung Electronics Co., Ltd.
Youngja KIM
B08 - CLEANING
Information
Patent Application
THREE DIMENSIONAL DEVICE INTEGRATION METHOD AND INTEGRATED DEVICE
Publication number
20170170132
Publication date
Jun 15, 2017
ZIPTRONIX, INC.
Paul M. Enquist
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LIGHT EMITTING DIE (LED) PACKAGES AND RELATED METHODS
Publication number
20120187862
Publication date
Jul 26, 2012
Jeffrey Carl Britt
H01 - BASIC ELECTRIC ELEMENTS