Mechanical cleaning

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CPC
H01L2224/83912

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/83912Mechanical cleaning

Industries

Patents Grantslast 30 patents

Information Patent Grant
Three dimensional device integration method and integrated device
- Patent number 10,366,962
- Issue date Jul 30, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Light emitting die (LED) packages and related methods
- Patent number 10,256,385
- Issue date Apr 9, 2019
- Cree, Inc.
- Jeffrey Carl Britt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for adhesive control between a substrate and a die
- Patent number 10,056,294
- Issue date Aug 21, 2018
- Maxim Integrated Products, Inc.
- Vivek S. Sridharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method for producing same
- Patent number 9,740,067
- Issue date Aug 22, 2017
- Sharp Kabushiki Kaisha
- Keiji Aota
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
SOLDER REFLOW SYSTEM AND SOLDER REFLOW METHOD USING THE SAME
- Publication number 20240120310
- Publication date Apr 11, 2024
- Samsung Electronics Co., Ltd.
- Youngja KIM
- B08 - CLEANING
Information Patent Application
THREE DIMENSIONAL DEVICE INTEGRATION METHOD AND INTEGRATED DEVICE
- Publication number 20170170132
- Publication date Jun 15, 2017
- ZIPTRONIX, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIE (LED) PACKAGES AND RELATED METHODS
- Publication number 20120187862
- Publication date Jul 26, 2012
- Jeffrey Carl Britt
- H01 - BASIC ELECTRIC ELEMENTS