Mechanical effects

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H01L2924/35

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/35Mechanical effects

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Stacked dies and methods for forming bonded structures
- Patent number 12,266,650
- Issue date Apr 1, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,266,627
- Issue date Apr 1, 2025
- Mitsubishi Electric Corporation
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic package for high CTE mismatch
- Patent number 12,266,582
- Issue date Apr 1, 2025
- Qorvo US, Inc.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Managing stress in semiconductor chips
- Patent number 12,261,139
- Issue date Mar 25, 2025
- Ciena Corporation
- Jean-Sébastien Côté
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Info structure with copper pillar having reversed profile
- Patent number 12,261,074
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having an encapulant comprising conductive fi...
- Patent number 12,261,095
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Xinyu Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 12,261,156
- Issue date Mar 25, 2025
- Denso Corporation
- Hiroyoshi Kunieda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,261,106
- Issue date Mar 25, 2025
- Samsung Electronics Co., Ltd.
- Hyeonjeong Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Terminal and connection method
- Patent number 12,261,138
- Issue date Mar 25, 2025
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Jo Umezawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating a semiconductor device
- Patent number 12,261,144
- Issue date Mar 25, 2025
- Infineon Technologies Austria AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor structure
- Patent number 12,261,149
- Issue date Mar 25, 2025
- Powerchip Semiconductor Manufacturing Corporation
- Shih-Ping Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, electronic apparatus, and method for manufac...
- Patent number 12,255,170
- Issue date Mar 18, 2025
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Yasushi Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,255,127
- Issue date Mar 18, 2025
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hidekazu Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer warpage regulation epoxy functional film, and preparation met...
- Patent number 12,255,175
- Issue date Mar 18, 2025
- Wuhan Sanxuan Technology Co., Ltd
- De Wu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor package with riveting structure between two rings and...
- Patent number 12,255,156
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure
- Patent number 12,255,173
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ling-Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure, assembly structure and method for manufacturing...
- Patent number 12,249,583
- Issue date Mar 11, 2025
- Advanced Semiconductor Engineering, Inc.
- Syu-Tang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuits including micropatterns and using partial curing to adhere...
- Patent number 12,237,292
- Issue date Feb 25, 2025
- 3M Innovative Properties Company
- Teresa M. Goeddel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,237,241
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Yanggyoo Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible electronic structure including a support element
- Patent number 12,237,289
- Issue date Feb 25, 2025
- PRAGMATIC SEMICONDUCTOR LIMITED
- Brian Cobb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip laser bonding system
- Patent number 12,237,295
- Issue date Feb 25, 2025
- PROTEC CO., LTD.
- Geunsik Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,237,276
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure
- Patent number 12,238,865
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing semiconductor pac...
- Patent number 12,237,240
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Jinwoo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,237,285
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Gayoung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package and method of manufacture
- Patent number 12,237,288
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming micro interconnect struc...
- Patent number 12,230,559
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with warpage-control element
- Patent number 12,230,597
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Jan Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer chip scale packaging with ball attach before repassivation
- Patent number 12,230,539
- Issue date Feb 18, 2025
- Texas Instruments Incorporated
- Daiki Komatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,224,257
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE USING CAVITY SUBSTRATE AND MANUFACTURING METHODS
- Publication number 20250105165
- Publication date Mar 27, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Young Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE
- Publication number 20250105174
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device And Method Of Manufacturing The Same
- Publication number 20250105180
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Hung Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT PACKAGE HAVING A METAL PLATE STRUCTURE THAT IN...
- Publication number 20250105195
- Publication date Mar 27, 2025
- TEXAS INSTRUMENTS INCORPORATED
- JOHN CARLO MOLINA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND MET...
- Publication number 20250105094
- Publication date Mar 27, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250105187
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Gayoung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250105213
- Publication date Mar 27, 2025
- Macronix International Co., Ltd.
- Shao-En Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device and Manufacturing Method Thereof
- Publication number 20250105130
- Publication date Mar 27, 2025
- Innolux Corporation
- Ker-Yih Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20250105082
- Publication date Mar 27, 2025
- JCET Management Co., Ltd.
- Xiao GU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20250105172
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250105182
- Publication date Mar 27, 2025
- SAMSUNG ELECTRONICS CO,. LTD.
- JAEYONG PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING SUBSTRATE STRUCTURE
- Publication number 20250107190
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Jonggu LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLIP
- Publication number 20250105198
- Publication date Mar 27, 2025
- NEXPERIA B.V.
- Heiming Shiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250096152
- Publication date Mar 20, 2025
- SK HYNIX INC.
- Rho Gyu KWAK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGES WITH LOW-PROFILE POLYIMIDE LAYERS
- Publication number 20250096156
- Publication date Mar 20, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Katleen Fajardo TIMBOL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250096158
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- Jongyoun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250096080
- Publication date Mar 20, 2025
- Fuji Electric Co., Ltd.
- Shun HARASHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE COMPRISING SILICON SUBSTRATE WITH POROUS PORTION
- Publication number 20250096090
- Publication date Mar 20, 2025
- QUALCOMM Incorporated
- Ranadeep DUTTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250096063
- Publication date Mar 20, 2025
- MITSUBISHI ELECTRIC CORPORATION
- Seiu HIGASHIDE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL PERFORMANCE IMPROVEMENT AND STRESS REDUCTION IN SEMICONDUCT...
- Publication number 20250096159
- Publication date Mar 20, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yong LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL DISSIPATION IN SEMICONDUCTOR DEVICES
- Publication number 20250096185
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW COST PACKAGE WARPAGE SOLUTION
- Publication number 20250096009
- Publication date Mar 20, 2025
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICES COUPLED TO INTERPOSER COMPRISING POROUS PORTION
- Publication number 20250096093
- Publication date Mar 20, 2025
- QUALCOMM Incorporated
- Ranadeep DUTTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROCONDUCTIVE ADHESIVE
- Publication number 20250084286
- Publication date Mar 13, 2025
- OSAKA SODA CO., LTD.
- Takamichi MORI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR PACKAGE WITH NICKEL-SILVER PRE-PLATED LEADFRAME
- Publication number 20250087563
- Publication date Mar 13, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH LATERALLY CONFINED SUBSTRATE AND METHODS...
- Publication number 20250087564
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER WARPAGE REGULATION EPOXY FUNCTIONAL FILM, AND PREPARATION MET...
- Publication number 20250087630
- Publication date Mar 13, 2025
- Wuhan Sanxuan Technology Co., Ltd
- De WU
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250087620
- Publication date Mar 13, 2025
- Kabushiki Kaisha Toshiba
- Tomoka HOSHINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH STIFFENER STRUCTURE
- Publication number 20250079246
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chieh-Ming CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH THERMAL DISSIPATION
- Publication number 20250079261
- Publication date Mar 6, 2025
- UTAC Headquarters Pte. Ltd.
- IL Kwon SHIM
- H01 - BASIC ELECTRIC ELEMENTS

Mechanical effects

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Stacked dies and methods for forming bonded structures

Semiconductor device and method for manufacturing the same

Hermetic package for high CTE mismatch

Managing stress in semiconductor chips

Info structure with copper pillar having reversed profile

Semiconductor package having an encapulant comprising conductive fi...

Electronic device

Semiconductor package

Terminal and connection method

Semiconductor device and method for fabricating a semiconductor device

Manufacturing method of semiconductor structure

Semiconductor package, electronic apparatus, and method for manufac...

Semiconductor device and method for manufacturing the same

Wafer warpage regulation epoxy functional film, and preparation met...

Semiconductor package with riveting structure between two rings and...

Chip package structure

Package structure, assembly structure and method for manufacturing...

Circuits including micropatterns and using partial curing to adhere...

Semiconductor package

Flexible electronic structure including a support element

Flip chip laser bonding system

Package structure

Integrated circuit structure

Semiconductor package and method of manufacturing semiconductor pac...

Semiconductor package

Semiconductor die package and method of manufacture

Semiconductor device and method of forming micro interconnect struc...

Package structure with warpage-control element

Wafer chip scale packaging with ball attach before repassivation

Semiconductor structure and manufacturing method thereof

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE USING CAVITY SUBSTRATE AND MANUFACTURING METHODS

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE

Semiconductor Device And Method Of Manufacturing The Same

ELECTRONIC COMPONENT PACKAGE HAVING A METAL PLATE STRUCTURE THAT IN...

INTEGRATED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND MET...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

Electronic Device and Manufacturing Method Thereof

PACKAGING STRUCTURE AND METHOD FOR FORMING THE SAME

Semiconductor Device and Method

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR DEVICES INCLUDING SUBSTRATE STRUCTURE

CLIP

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

PACKAGES WITH LOW-PROFILE POLYIMIDE LAYERS

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

INTEGRATED DEVICE COMPRISING SILICON SUBSTRATE WITH POROUS PORTION

SEMICONDUCTOR DEVICE

THERMAL PERFORMANCE IMPROVEMENT AND STRESS REDUCTION IN SEMICONDUCT...

THERMAL DISSIPATION IN SEMICONDUCTOR DEVICES

LOW COST PACKAGE WARPAGE SOLUTION

INTEGRATED DEVICES COUPLED TO INTERPOSER COMPRISING POROUS PORTION

ELECTROCONDUCTIVE ADHESIVE

SEMICONDUCTOR PACKAGE WITH NICKEL-SILVER PRE-PLATED LEADFRAME

SEMICONDUCTOR PACKAGE WITH LATERALLY CONFINED SUBSTRATE AND METHODS...

WAFER WARPAGE REGULATION EPOXY FUNCTIONAL FILM, AND PREPARATION MET...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE WITH STIFFENER STRUCTURE

SEMICONDUCTOR PACKAGES WITH THERMAL DISSIPATION