Mechanical effects

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CPC
H01L2924/35

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/35Mechanical effects

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device package assemblies with direct leadframe attac...
- Patent number 12,315,826
- Issue date May 27, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package assembly including lid with additional stress mitigating fe...
- Patent number 12,315,768
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Storage layers for wafer bonding
- Patent number 12,315,837
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- De-Yang Chiou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Build-up package for integrated circuit devices, and methods of mak...
- Patent number 12,315,769
- Issue date May 27, 2025
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chiplet first architecture for die tiling applications
- Patent number 12,308,329
- Issue date May 20, 2025
- Intel Corporation
- Srinivas Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power substrate assembly with reduced warpage
- Patent number 12,308,338
- Issue date May 20, 2025
- Littelfuse, Inc.
- Tiburcio A. Maldo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temperature-stable composite of a stranded wire having a contact pad
- Patent number 12,308,588
- Issue date May 20, 2025
- Yageo Nexensos GmbH
- Matthias Muziol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package
- Patent number 12,308,308
- Issue date May 20, 2025
- Siliconware Precision Industries Co., Ltd.
- Sung-Hua Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,308,350
- Issue date May 20, 2025
- NUVOTON TECHNOLOGY CORPORATION JAPAN
- Takeshi Imamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 12,300,679
- Issue date May 13, 2025
- Mediatek Inc.
- Yi-Jyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 12,300,624
- Issue date May 13, 2025
- INNOLUX CORPORATION
- Jen-Hai Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder material
- Patent number 12,296,409
- Issue date May 13, 2025
- Fuji Electric Co., Ltd.
- Hirohiko Watanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fan-out package with controllable standoff
- Patent number 12,300,592
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus including integrated pads and methods of manufacturing th...
- Patent number 12,300,647
- Issue date May 13, 2025
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package and electronic device including the same
- Patent number 12,300,594
- Issue date May 13, 2025
- Samsung Electronics Co., Ltd.
- Sun Ho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming thereof
- Patent number 12,300,656
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method
- Patent number 12,300,575
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method for forming same
- Patent number 12,300,590
- Issue date May 13, 2025
- JCET GROUP CO., LTD.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and method for manufacturing semiconductor module
- Patent number 12,293,949
- Issue date May 6, 2025
- Fuji Electric Co., Ltd.
- Ryoichi Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,293,989
- Issue date May 6, 2025
- Samsung Electronics Co., Ltd.
- Minjung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages and methods of forming the same
- Patent number 12,293,985
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,288,739
- Issue date Apr 29, 2025
- Rohm Co., Ltd.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,288,760
- Issue date Apr 29, 2025
- Renesas Electronics Corporation
- Takayuki Igarashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible electronic structure
- Patent number 12,283,561
- Issue date Apr 22, 2025
- PRAGMATIC SEMICONDUCTOR LIMITED
- Brian Cobb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package
- Patent number 12,283,577
- Issue date Apr 22, 2025
- Samsung Electronics Co., Ltd.
- Joonsung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density interconnection using fanout interposer chiplet
- Patent number 12,283,549
- Issue date Apr 22, 2025
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating same
- Patent number 12,283,578
- Issue date Apr 22, 2025
- Samsung Electronics Co., Ltd.
- Jeong Hyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Extended seal ring structure on wafer-stacking
- Patent number 12,283,552
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Hsorng Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 12,278,196
- Issue date Apr 15, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Tae Ki Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular construction of hybrid-bonded semiconductor die assemblies...
- Patent number 12,278,202
- Issue date Apr 15, 2025
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DIE HAVING A METAL PLATE LAYER
- Publication number 20250167123
- Publication date May 22, 2025
- SK HYNIX INC.
- Jae Jun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250167137
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Yeongkwon KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR CHIP INCLUDING SEMICONDUCTOR...
- Publication number 20250167144
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Junho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING CRACK-RESISTANT BACKSIDE...
- Publication number 20250169070
- Publication date May 22, 2025
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Kota FUNAYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICE OBTAINED BY 3D INTEGRATION AND CORRESPONDING...
- Publication number 20250167157
- Publication date May 22, 2025
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Pablo RENAUD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...
- Publication number 20250167061
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Jinwoo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20250157949
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Chen LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL-SIDE HEAT-DISSIPATION PACKAGE STRUCTURE AND PACKAGE STRUCTURE
- Publication number 20250157873
- Publication date May 15, 2025
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- Ting-An Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY INTERCONNECTION USING FANOUT INTERPOSER CHIPLET
- Publication number 20250157939
- Publication date May 15, 2025
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE
- Publication number 20250159812
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
PACKAGE STRUCTURE WITH WARPAGE-CONTROL ELEMENT
- Publication number 20250157974
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Jan PEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND POWER CONVERSION APPARATUS
- Publication number 20250149399
- Publication date May 8, 2025
- MITSUBISHI ELECTRIC CORPORATION
- Junji FUJINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH REINFORCED ELEMENT
- Publication number 20250149469
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu JENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH AT LEAST ONE PRE-MADE CONDUCTIVE UNIT AN...
- Publication number 20250149420
- Publication date May 8, 2025
- PEP INNOVATION PTE LTD.
- Hwee Seng CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...
- Publication number 20250149424
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250149467
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- Juil Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...
- Publication number 20250149425
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selective Dielectric Capping for Hybrid Bonding
- Publication number 20250149474
- Publication date May 8, 2025
- Applied Materials, Inc.
- Prayudi LIANTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20250149515
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- Kiju LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOP DIE BACK-SIDE MARKING FOR MEMORY SYSTEMS
- Publication number 20250149463
- Publication date May 8, 2025
- Micron Technology, Inc.
- Po Chien Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SLANTED CONDUCTIVE LAYERS AND METHOD FOR...
- Publication number 20250140675
- Publication date May 1, 2025
- NANYA TECHNOLOGY CORPORATION
- KUO-HUI SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250140721
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250140726
- Publication date May 1, 2025
- Samsung Electronics Co., Ltd.
- Kyunglyul LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH MULTIPLE CHIP STRUCTURES
- Publication number 20250140757
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250140636
- Publication date May 1, 2025
- Amkor Technology Japan, Inc.
- Masao HIROBE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20250140643
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250140668
- Publication date May 1, 2025
- Samsung Electronics Co., Ltd.
- Hyunwoong HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SLANTED CONDUCTIVE LAYERS AND METHOD FOR...
- Publication number 20250140672
- Publication date May 1, 2025
- NANYA TECHNOLOGY CORPORATION
- KUO-HUI SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH BACK-TO-BACK DIE STACKING
- Publication number 20250132240
- Publication date Apr 24, 2025
- Micron Technology, Inc.
- Faxing CHE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE
- Publication number 20250132299
- Publication date Apr 24, 2025
- InnoLux Corporation
- Yuan-Lin WU
- H01 - BASIC ELECTRIC ELEMENTS

Mechanical effects

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device package assemblies with direct leadframe attac...

Package assembly including lid with additional stress mitigating fe...

Storage layers for wafer bonding

Build-up package for integrated circuit devices, and methods of mak...

Chiplet first architecture for die tiling applications

Power substrate assembly with reduced warpage

Temperature-stable composite of a stranded wire having a contact pad

Electronic package

Semiconductor device

Semiconductor package structure

Electronic device

Solder material

Fan-out package with controllable standoff

Apparatus including integrated pads and methods of manufacturing th...

Fan-out semiconductor package and electronic device including the same

Semiconductor package and method of forming thereof

Semiconductor package and method

Package structure and method for forming same

Semiconductor module and method for manufacturing semiconductor module

Semiconductor package

Integrated circuit packages and methods of forming the same

Semiconductor device and method for manufacturing the same

Semiconductor device

Flexible electronic structure

Fan-out semiconductor package

High density interconnection using fanout interposer chiplet

Semiconductor package and method of fabricating same

Extended seal ring structure on wafer-stacking

Semiconductor devices and methods of manufacturing semiconductor de...

Modular construction of hybrid-bonded semiconductor die assemblies...

Patents Applicationslast 30 patents

SEMICONDUCTOR DIE HAVING A METAL PLATE LAYER

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR CHIP INCLUDING SEMICONDUCTOR...

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING CRACK-RESISTANT BACKSIDE...

MICROELECTRONIC DEVICE OBTAINED BY 3D INTEGRATION AND CORRESPONDING...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...

PACKAGE STRUCTURE

DUAL-SIDE HEAT-DISSIPATION PACKAGE STRUCTURE AND PACKAGE STRUCTURE

HIGH DENSITY INTERCONNECTION USING FANOUT INTERPOSER CHIPLET

INTEGRATED CIRCUIT STRUCTURE

PACKAGE STRUCTURE WITH WARPAGE-CONTROL ELEMENT

POWER MODULE AND POWER CONVERSION APPARATUS

PACKAGE STRUCTURE WITH REINFORCED ELEMENT

SEMICONDUCTOR PACKAGE WITH AT LEAST ONE PRE-MADE CONDUCTIVE UNIT AN...

SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...

Selective Dielectric Capping for Hybrid Bonding

SEMICONDUCTOR PACKAGES

TOP DIE BACK-SIDE MARKING FOR MEMORY SYSTEMS

SEMICONDUCTOR DEVICE WITH SLANTED CONDUCTIVE LAYERS AND METHOD FOR...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE

CHIP PACKAGE STRUCTURE WITH MULTIPLE CHIP STRUCTURES

SEMICONDUCTOR DEVICE

PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE WITH SLANTED CONDUCTIVE LAYERS AND METHOD FOR...

PACKAGE WITH BACK-TO-BACK DIE STACKING

LIGHT EMITTING DEVICE