Mechanical treatment

Industry

CPC
H01L2224/11602

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/11602Mechanical treatment

Industries

Patents Grantslast 30 patents

Information Patent Grant
Fabrication method of high aspect ratio solder bumping with stud bu...
- Patent number 11,181,704
- Issue date Nov 23, 2021
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for removing bond film from cavities in printed circuit boards
- Patent number 11,171,101
- Issue date Nov 9, 2021
- Raytheon Company
- James E. Benedict
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of high aspect ratio solder bumping with stud bu...
- Patent number 11,112,570
- Issue date Sep 7, 2021
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Housing comprising a semiconductor body and a method for producing...
- Patent number 10,903,406
- Issue date Jan 26, 2021
- OSRAM OLED GmbH
- Martin Unterburger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of high aspect ratio solder bumping with stud bu...
- Patent number 10,598,874
- Issue date Mar 24, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- G02 - OPTICS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 10,319,692
- Issue date Jun 11, 2019
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yung-Ping Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,217,687
- Issue date Feb 26, 2019
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tien-Chung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structure with array of micrometer scale copper pillar ba...
- Patent number 10,128,123
- Issue date Nov 13, 2018
- Imec VZW
- Bivragh Majeed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 9,929,069
- Issue date Mar 27, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tien-Chung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device packages having bumps and methods of manufacturin...
- Patent number 9,209,146
- Issue date Dec 8, 2015
- SK Hynix Inc.
- Seung Jee Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced WLP for superior temp cycling, drop test and high current...
- Patent number 9,099,345
- Issue date Aug 4, 2015
- Maxim Integrated Products, Inc.
- Rey Alvarado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transferring a graphene sheet to metal contact bumps of...
- Patent number 8,974,617
- Issue date Mar 10, 2015
- IMEC
- Yu-Hsiang Hu
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Electronic device packages having bumps and methods of manufacturin...
- Patent number 8,907,487
- Issue date Dec 9, 2014
- SK Hynix Inc.
- Seung Jee Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TSV pillar as an interconnecting structure
- Patent number 8,691,691
- Issue date Apr 8, 2014
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 8,410,615
- Issue date Apr 2, 2013
- Hitachi, Ltd.
- Mayu Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced WLP for superior temp cycling, drop test and high current...
- Patent number 8,264,089
- Issue date Sep 11, 2012
- Maxim Integrated Products, Inc.
- Rey Alvarado
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20230089483
- Publication date Mar 23, 2023
- Panasonic Intellectual Property Management Co., Ltd.
- KIYOKAZU ITOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPORARY BONDING AND DEBONDING PROCESS TO PREVENT DEFORMATION OF M...
- Publication number 20220262755
- Publication date Aug 18, 2022
- Brewer Science, Inc.
- Chia-Hsin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR REMOVING BOND FILM FROM CAVITIES IN PRINTED CIRCUIT BOARDS
- Publication number 20210305187
- Publication date Sep 30, 2021
- Raytheon Company
- James E. Benedict
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HOUSING COMPRISING A SEMICONDUCTOR BODY AND A METHOD FOR PRODUCING...
- Publication number 20210104653
- Publication date Apr 8, 2021
- OSRAM OLED GmbH
- Martin Unterburger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF HIGH ASPECT RATIO SOLDER BUMPING WITH STUD BU...
- Publication number 20190131266
- Publication date May 2, 2019
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20180226372
- Publication date Aug 9, 2018
- NANYA TECHNOLOGY CORPORATION
- Po-Chun LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A COMPONENT AND COMPONENT
- Publication number 20180219145
- Publication date Aug 2, 2018
- Osram Opto Semiconductors GmbH
- Martin Unterburger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20180211895
- Publication date Jul 26, 2018
- Taiwan Semiconductor Manufacturing company Ltd.
- TIEN-CHUNG YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20170103955
- Publication date Apr 13, 2017
- Taiwan Semiconductor Manufacturing company Ltd.
- YUNG-PING CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20170098588
- Publication date Apr 6, 2017
- Taiwan Semiconductor Manufacturing company Ltd.
- TIEN-CHUNG YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING BUMPS, SEMICONDUCTOR DEVICE AND METHOD FOR MANUF...
- Publication number 20150132865
- Publication date May 14, 2015
- Fujitsu Limited
- Masataka Mizukoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGES HAVING BUMPS AND METHODS OF MANUFACTURIN...
- Publication number 20150056755
- Publication date Feb 26, 2015
- SK HYNIX INC.
- Seung Jee KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Metal Bump Die Assembly
- Publication number 20140193952
- Publication date Jul 10, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiu-Jen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR TRANSFERRING A GRAPHENE SHEET TO METAL CONTACT BUMPS OF...
- Publication number 20140166194
- Publication date Jun 19, 2014
- Yu-Hsiang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR DEVICE, AND METHOD OF MANFAC...
- Publication number 20140103522
- Publication date Apr 17, 2014
- OLYMPUS CORPORATION
- Yoshiaki Takemoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGES HAVING BUMPS AND METHODS OF MANUFACTURIN...
- Publication number 20130334683
- Publication date Dec 19, 2013
- SK HYNIX INC.
- Seung Jee KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130285253
- Publication date Oct 31, 2013
- Hitachi, Ltd
- Mayu Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TSV PILLAR AS AN INTERCONNECTING STRUCTURE
- Publication number 20130026606
- Publication date Jan 31, 2013
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED WLP FOR SUPERIOR TEMP CYCLING, DROP TEST AND HIGH CURRENT...
- Publication number 20120326308
- Publication date Dec 27, 2012
- Maxim Integrated Products, Inc.
- REY ALVARADO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20120068355
- Publication date Mar 22, 2012
- Hitachi, Ltd.
- Mayu Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED WLP FOR SUPERIOR TEMP CYCLING, DROP TEST AND HIGH CURRENT...
- Publication number 20110227219
- Publication date Sep 22, 2011
- MAXIM INTEGRATED PRODUCTS, INC.
- REY ALVARADO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING BUMPS, SEMICONDUCTOR DEVICE AND METHOD FOR MANUF...
- Publication number 20090186425
- Publication date Jul 23, 2009
- Fujitsu Limited
- Masataka Mizukoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming bumps, semiconductor device and method for manuf...
- Publication number 20050161814
- Publication date Jul 28, 2005
- FUJITSU LIMITED
- Masataka Mizukoshi
- H01 - BASIC ELECTRIC ELEMENTS

Mechanical treatment

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Fabrication method of high aspect ratio solder bumping with stud bu...

Process for removing bond film from cavities in printed circuit boards

Fabrication method of high aspect ratio solder bumping with stud bu...

Housing comprising a semiconductor body and a method for producing...

Fabrication method of high aspect ratio solder bumping with stud bu...

Semiconductor structure and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Substrate structure with array of micrometer scale copper pillar ba...

Semiconductor device and manufacturing method thereof

Electronic device packages having bumps and methods of manufacturin...

Enhanced WLP for superior temp cycling, drop test and high current...

Method for transferring a graphene sheet to metal contact bumps of...

Electronic device packages having bumps and methods of manufacturin...

TSV pillar as an interconnecting structure

Semiconductor device and method for manufacturing the same

Enhanced WLP for superior temp cycling, drop test and high current...

Patents Applicationslast 30 patents

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

TEMPORARY BONDING AND DEBONDING PROCESS TO PREVENT DEFORMATION OF M...

PROCESS FOR REMOVING BOND FILM FROM CAVITIES IN PRINTED CIRCUIT BOARDS

HOUSING COMPRISING A SEMICONDUCTOR BODY AND A METHOD FOR PRODUCING...

FABRICATION METHOD OF HIGH ASPECT RATIO SOLDER BUMPING WITH STUD BU...

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

METHOD FOR PRODUCING A COMPONENT AND COMPONENT

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

METHOD FOR FORMING BUMPS, SEMICONDUCTOR DEVICE AND METHOD FOR MANUF...

ELECTRONIC DEVICE PACKAGES HAVING BUMPS AND METHODS OF MANUFACTURIN...

Methods for Metal Bump Die Assembly

METHOD FOR TRANSFERRING A GRAPHENE SHEET TO METAL CONTACT BUMPS OF...

SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR DEVICE, AND METHOD OF MANFAC...

ELECTRONIC DEVICE PACKAGES HAVING BUMPS AND METHODS OF MANUFACTURIN...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

TSV PILLAR AS AN INTERCONNECTING STRUCTURE

ENHANCED WLP FOR SUPERIOR TEMP CYCLING, DROP TEST AND HIGH CURRENT...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

ENHANCED WLP FOR SUPERIOR TEMP CYCLING, DROP TEST AND HIGH CURRENT...

METHOD FOR FORMING BUMPS, SEMICONDUCTOR DEVICE AND METHOD FOR MANUF...

Method for forming bumps, semiconductor device and method for manuf...