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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2924/00
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H01L2924/1434
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Patents Grants
last 30 patents
Information
Patent Grant
Electronic package
Patent number
12,368,104
Issue date
Jul 22, 2025
Advanced Semiconductor Engineering, Inc.
Hung-Yi Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
IPD modules with flexible connection scheme in packaging
Patent number
12,368,141
Issue date
Jul 22, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Yu-Chia Lai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package
Patent number
12,368,119
Issue date
Jul 22, 2025
Samsung Electronics Co., Ltd.
Minki Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Double side integration semiconductor package and method of forming...
Patent number
12,368,142
Issue date
Jul 22, 2025
Taiwan Semiconductor Manufacturing Company Limited
Monsen Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Parameter exchange for a die-to-die interconnect
Patent number
12,360,934
Issue date
Jul 15, 2025
Intel Corporation
Debendra Das Sharma
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Methods of packaging semiconductor devices and packaged semiconduct...
Patent number
12,362,260
Issue date
Jul 15, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Li-Hui Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of making a fan-out semiconductor assembly with an intermedi...
Patent number
12,362,322
Issue date
Jul 15, 2025
Deca Technologies USA, Inc.
Timothy L. Olson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with redistribution structure and method for f...
Patent number
12,354,965
Issue date
Jul 8, 2025
NANYA TECHNOLOGY CORPORATION
Shing-Yih Shih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package
Patent number
12,354,980
Issue date
Jul 8, 2025
Samsung Electronics Co., Ltd.
Boin Noh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked devices and methods of fabrication
Patent number
12,347,820
Issue date
Jul 1, 2025
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Paul M. Enquist
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with discrete blocks
Patent number
12,334,476
Issue date
Jun 17, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Ching-Wen Hsiao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Architecture for computing system package
Patent number
12,327,796
Issue date
Jun 10, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor chip including through electrode, and semiconductor p...
Patent number
12,322,681
Issue date
Jun 3, 2025
SK hynix Inc.
Seung Hwan Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with redistribution plugs
Patent number
12,315,793
Issue date
May 27, 2025
NANYA TECHNOLOGY CORPORATION
Chun-Cheng Liao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package and method
Patent number
12,315,854
Issue date
May 27, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of manufacturing a fan-out panel level semiconductor package
Patent number
12,315,822
Issue date
May 27, 2025
Samsung Electronics Co., Ltd.
Jeongho Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package
Patent number
12,308,336
Issue date
May 20, 2025
Samsung Electronics Co., Ltd.
Jungho Shim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High registration particles-transferring system
Patent number
12,297,538
Issue date
May 13, 2025
Xerox Corporation
Yunda Wang
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Method of manufacturing semiconductor package
Patent number
12,300,509
Issue date
May 13, 2025
Samsung Electronics Co., Ltd.
Junyong Chung
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Grant
Photonics integrated circuit package
Patent number
12,293,974
Issue date
May 6, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Feng Wei Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package and method of forming same
Patent number
12,294,002
Issue date
May 6, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Shang-Yun Hou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High density interconnection using fanout interposer chiplet
Patent number
12,283,549
Issue date
Apr 22, 2025
Apple Inc.
Jun Zhai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of fabricating same
Patent number
12,283,578
Issue date
Apr 22, 2025
Samsung Electronics Co., Ltd.
Jeong Hyun Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Symbiotic network on layers
Patent number
12,283,572
Issue date
Apr 22, 2025
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Javier A. DeLaCruz
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Stacked dies and methods for forming bonded structures
Patent number
12,266,650
Issue date
Apr 1, 2025
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Info structure with copper pillar having reversed profile
Patent number
12,261,074
Issue date
Mar 25, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Hsi-Kuei Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package having an encapulant comprising conductive fi...
Patent number
12,261,095
Issue date
Mar 25, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Xinyu Bao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package including heat dissipation layer
Patent number
12,255,183
Issue date
Mar 18, 2025
SK hynix Inc.
Joo Wan Hong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Logic drive based on standardized commodity programmable logic semi...
Patent number
12,255,195
Issue date
Mar 18, 2025
iCometrue Company Ltd.
Jin-Yuan Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device including penetration via structure
Patent number
12,249,558
Issue date
Mar 11, 2025
Samsung Electronics Co., Ltd.
Jubin Seo
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20250233098
Publication date
Jul 17, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Yi-Huan Liao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PLURALITY OF ADVANCED MULTILEVEL CIRCUIT ATTACHMENTS
Publication number
20250233108
Publication date
Jul 17, 2025
TOKYO ELECTRON LIMITED
Mark L. Gardner
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
Publication number
20250233119
Publication date
Jul 17, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Shang-Yun Hou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HYBRID SUBSTRATE WITH EMBEDDED COMPONENT
Publication number
20250226302
Publication date
Jul 10, 2025
QUALCOMM Incorporated
Yeoil PARK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
EMBEDDABLE TILES CONTAINING PASSIVE DEVICES FOR PACKAGED SEMICONDUC...
Publication number
20250226298
Publication date
Jul 10, 2025
SARAS MICRO DEVICES, INC.
Richard P. Sheridan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS AND APPARATUS FOR EMBEDDING INTERCONNECT BRIDGES HAVING THR...
Publication number
20250218953
Publication date
Jul 3, 2025
Intel Corporation
Zhixin Xie
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COMPONENT COUPLED WITH CONDUCTIVE VIAS ENCAPSULATED IN AN ELECTRONI...
Publication number
20250218905
Publication date
Jul 3, 2025
Intel Corporation
Jeremy Ecton
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
VERTICALLY EMBEDDED COMPONENTS IN PACKAGE SUBSTRATES
Publication number
20250219021
Publication date
Jul 3, 2025
Intel Corporation
Bohan Shan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MIXED DEPTH CAVITY FOR EMBEDDED BRIDGE STRUCTURES
Publication number
20250210469
Publication date
Jun 26, 2025
Intel Corporation
Brandon C. MARIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE HAVING AN ENCAPULANT COMPRISING CONDUCTIVE FI...
Publication number
20250210452
Publication date
Jun 26, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Xinyu Bao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
Publication number
20250201658
Publication date
Jun 19, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Kuan-Min Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INFO STRUCTURE WITH COPPER PILLAR HAVING REVERSED PROFILE
Publication number
20250201617
Publication date
Jun 19, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Hsi-Kuei Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SIGNAL LINES FOR SEMICONDUCTOR DEVICES
Publication number
20250201693
Publication date
Jun 19, 2025
Altera Corporation
Arturo PACHON MUNOZ
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE ARCHITECTURES HAVING VERTICALLY STACKED DIES WITH BOUNDARY...
Publication number
20250201767
Publication date
Jun 19, 2025
Intel Corporation
Sagar Suthram
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20250201772
Publication date
Jun 19, 2025
SK HYNIX INC.
Heon Yong CHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20250201794
Publication date
Jun 19, 2025
Samsung Electronics Co., Ltd.
Haseob SEONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH DOUBLE-SIDED THERMAL SOLUTION AND METHOD...
Publication number
20250201651
Publication date
Jun 19, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Shih-Wei Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERPOSER SUBSTRATE INCLUDING OFFSET CORE LAYER
Publication number
20250192010
Publication date
Jun 12, 2025
QUALCOMM Incorporated
Aniket PATIL
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
Publication number
20250194113
Publication date
Jun 12, 2025
SK HYNIX INC.
Seung Hwan KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
EMBEDDED BRIDGE WITH THROUGH SILICON VIA BONDING ARCHITECTURES
Publication number
20250192059
Publication date
Jun 12, 2025
Intel Corporation
Brandon C. MARIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE
Publication number
20250183121
Publication date
Jun 5, 2025
Samsung Electronics Co., Ltd.
JUBIN SEO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Die Connection System and Method
Publication number
20250174591
Publication date
May 29, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Ming-Fa Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES AND METHODS FOR FORMING THE SAME
Publication number
20250167126
Publication date
May 22, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Ming-Han LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP BUMP INTERFACE COMPATIBLE WITH DIFFERENT ORIENTATIONS AND TYPE...
Publication number
20250167152
Publication date
May 22, 2025
Xilinx, Inc.
Ygal ARBEL
G11 - INFORMATION STORAGE
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE HAVING WIREBONDED MULTI-DIE STACK
Publication number
20250167180
Publication date
May 22, 2025
Intel Corporation
Thorsten Meyer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES INCLUDING MONOLITHIC SILICON STRUCT...
Publication number
20250167072
Publication date
May 22, 2025
Micron Technology, Inc.
Kunal R. Parekh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING STRUCTURES FOR HIGH-DENSITY METAL-TO-METAL BONDING AND METH...
Publication number
20250157963
Publication date
May 15, 2025
WESTERN DIGITAL TECHNOLOGIES, INC.,
Adarsh RAJASHEKHAR
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT STRUCTURE
Publication number
20250159812
Publication date
May 15, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Chen-Hua Yu
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20250157874
Publication date
May 15, 2025
Samsung Electronics Co., Ltd.
Junghoon KANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HIGH DENSITY INTERCONNECTION USING FANOUT INTERPOSER CHIPLET
Publication number
20250157939
Publication date
May 15, 2025
Apple Inc.
Jun Zhai
H01 - BASIC ELECTRIC ELEMENTS