Memory

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H01L2924/1434

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/1434Memory

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having plural stacked first chips sealed in a...
- Patent number 12,237,315
- Issue date Feb 25, 2025
- Kioxia Corporation
- Takayuki Ide
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip bump interface compatible with different orientations and type...
- Patent number 12,237,287
- Issue date Feb 25, 2025
- Xilinx, Inc.
- Ygal Arbel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure
- Patent number 12,238,865
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device having laterally extending capacitors of different le...
- Patent number 12,238,917
- Issue date Feb 25, 2025
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for fabricating the same
- Patent number 12,237,253
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Jun Hyeong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package having wirebonded multi-die stack
- Patent number 12,237,305
- Issue date Feb 25, 2025
- Intel Corporation
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die connection system and method
- Patent number 12,218,093
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods for forming the same
- Patent number 12,211,799
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Han Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 12,211,821
- Issue date Jan 28, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assemblies including monolithic silicon struct...
- Patent number 12,205,865
- Issue date Jan 21, 2025
- Micron Technology, Inc.
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Honeycomb pattern for conductive features
- Patent number 12,205,916
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shenggao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit including backside conductive vias
- Patent number 12,205,997
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-Liang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die package structures including redistribution layers
- Patent number 12,199,065
- Issue date Jan 14, 2025
- Parabellum Strategic Opportunities Fund LLC
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and semiconductor device
- Patent number 12,199,053
- Issue date Jan 14, 2025
- Renesas Electronics Corporation
- Shuuichi Kariyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, semiconductor package and method of manufactu...
- Patent number 12,199,056
- Issue date Jan 14, 2025
- Samsung Electronics Co., Ltd.
- Jumyong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assemblies including vertically integrated circuits a...
- Patent number 12,199,001
- Issue date Jan 14, 2025
- Micron Technology, Inc.
- Chan H. Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for producing the same
- Patent number 12,199,066
- Issue date Jan 14, 2025
- Kioxia Corporation
- Gen Toyota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with pillar array
- Patent number 12,191,162
- Issue date Jan 7, 2025
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,191,238
- Issue date Jan 7, 2025
- Samsung Electronics Co., Ltd.
- Aenee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical bridge package with integrated off-bridge photonic chann...
- Patent number 12,191,257
- Issue date Jan 7, 2025
- Celestial AI Inc.
- Ankur Aggarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a high reliability
- Patent number 12,183,718
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- Ji-Hwan Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,183,682
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost package warpage solution
- Patent number 12,183,596
- Issue date Dec 31, 2024
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,183,664
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- Ju-Il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,176,262
- Issue date Dec 24, 2024
- Samsung Electronics Co., Ltd.
- Eunseok Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-free frame design for silicon bridges for semiconductor packages
- Patent number 12,170,253
- Issue date Dec 17, 2024
- Intel Corporation
- Dae-Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,170,259
- Issue date Dec 17, 2024
- Samsung Electronics Co., Ltd.
- Ju Bin Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures, packaged semiconductor devices, and method...
- Patent number 12,159,862
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-tier IC package including processor and high bandwidth memory
- Patent number 12,154,890
- Issue date Nov 26, 2024
- Huawei Technologies Co., Ltd.
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical interconnect bridge
- Patent number 12,148,704
- Issue date Nov 19, 2024
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250069979
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Eunseok CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH REDISTRIBUTION PLUGS AND METHOD FOR FABRI...
- Publication number 20250070017
- Publication date Feb 27, 2025
- NANYA TECHNOLOGY CORPORATION
- Chun-Cheng LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-FREE FRAME DESIGN FOR SILICON BRIDGES FOR SEMICONDUCTOR PACKAGES
- Publication number 20250070056
- Publication date Feb 27, 2025
- Intel Corporation
- Dae-Woo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND WIRING SUBSTRATE INCLUDED IN THE SAME
- Publication number 20250062244
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- KANG JOON LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250062283
- Publication date Feb 20, 2025
- SK HYNIX INC.
- Seong Ju LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE TREATMENT IN INTEGRATED CIRCUIT PACKAGE AND METHOD
- Publication number 20250062201
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20250054891
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- Ju Bin SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF SEMICONDUCTOR CHIPS
- Publication number 20250046745
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Young Lyong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250046692
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Youngbae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL INTERCONNECT BRIDGE
- Publication number 20250038114
- Publication date Jan 30, 2025
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR PROVIDING DYNAMIC SECURITY FABRIC INTERPOSE...
- Publication number 20250038132
- Publication date Jan 30, 2025
- The Charles Stark Draper Laboratory, Inc.
- Douglas La Tulipe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH BACKSIDE POWER DELIVERY NETWORK LAYER
- Publication number 20250029914
- Publication date Jan 23, 2025
- Samsung Electronics Co., Ltd.
- Hyunsoo CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GUARD RING DESIGN ENABLING IN-LINE TESTING OF SILICON BRIDGES FOR S...
- Publication number 20250029908
- Publication date Jan 23, 2025
- Intel Corporation
- Arnab SARKAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250022824
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Youngbae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250022787
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Hyunsoo CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING SEMICONDUCTOR DIE STACK STRUCTURES
- Publication number 20250022869
- Publication date Jan 16, 2025
- SK HYNIX INC.
- Sung Kyu KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED INTEGRATED STACK CAPACITOR (ISC) IN SUBSTRATE BUILD-UP LAYER
- Publication number 20250014986
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Rui ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF
- Publication number 20250015015
- Publication date Jan 9, 2025
- Yangtze Memory Technologies Co., Ltd.
- He CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Die Fine Grain Integrated Voltage Regulation
- Publication number 20250015033
- Publication date Jan 9, 2025
- Apple Inc.
- Jared L. Zerbe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250015005
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- KEUNYOUNG LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A THROUGH VIA BETWEEN REDISTRIBUTION LAYERS
- Publication number 20250008750
- Publication date Jan 2, 2025
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A SPACED SUPPLY VOLTAGE AND GROUND REFERENCE
- Publication number 20250006704
- Publication date Jan 2, 2025
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250006577
- Publication date Jan 2, 2025
- Innolux Corporation
- Mei-Yen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES WITH MOLDED SUPPORT SUBSTRATES
- Publication number 20250006697
- Publication date Jan 2, 2025
- Micron Technology, Inc.
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250006696
- Publication date Jan 2, 2025
- Samsung Electronics Co., Ltd.
- Yongkoon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240429146
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Minwoo CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH SURFACE-MOUNT DIE SUPPORT STRUCT...
- Publication number 20240429191
- Publication date Dec 26, 2024
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240429214
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Ju-Il CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240429118
- Publication date Dec 26, 2024
- KIOXIA Corporation
- Keisuke TOKUBUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Decoupling Capacitor Structures And Assemblies
- Publication number 20240429157
- Publication date Dec 26, 2024
- KYOCERA AVX Components Corporation
- Laurent Desclos
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device having plural stacked first chips sealed in a...

Chip bump interface compatible with different orientations and type...

Integrated circuit structure

Memory device having laterally extending capacitors of different le...

Semiconductor package and method for fabricating the same

Integrated circuit package having wirebonded multi-die stack

Semiconductor die connection system and method

Semiconductor packages and methods for forming the same

Package-on-package assembly with wire bond vias

Semiconductor device assemblies including monolithic silicon struct...

Honeycomb pattern for conductive features

Integrated circuit including backside conductive vias

Multi-die package structures including redistribution layers

Electronic device and semiconductor device

Semiconductor device, semiconductor package and method of manufactu...

Semiconductor assemblies including vertically integrated circuits a...

Semiconductor device and method for producing the same

Semiconductor device assembly with pillar array

Semiconductor package

Electrical bridge package with integrated off-bridge photonic chann...

Semiconductor package having a high reliability

Semiconductor package and manufacturing method thereof

Low cost package warpage solution

Semiconductor package

Semiconductor package

Metal-free frame design for silicon bridges for semiconductor packages

Semiconductor package and method of fabricating the same

Interconnect structures, packaged semiconductor devices, and method...

Multi-tier IC package including processor and high bandwidth memory

Electrical interconnect bridge

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE WITH REDISTRIBUTION PLUGS AND METHOD FOR FABRI...

METAL-FREE FRAME DESIGN FOR SILICON BRIDGES FOR SEMICONDUCTOR PACKAGES

SEMICONDUCTOR PACKAGE AND WIRING SUBSTRATE INCLUDED IN THE SAME

SEMICONDUCTOR PACKAGE

SURFACE TREATMENT IN INTEGRATED CIRCUIT PACKAGE AND METHOD

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF SEMICONDUCTOR CHIPS

WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

ELECTRICAL INTERCONNECT BRIDGE

SYSTEMS AND METHODS FOR PROVIDING DYNAMIC SECURITY FABRIC INTERPOSE...

SEMICONDUCTOR PACKAGE WITH BACKSIDE POWER DELIVERY NETWORK LAYER

GUARD RING DESIGN ENABLING IN-LINE TESTING OF SILICON BRIDGES FOR S...

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR PACKAGE

METHODS OF MANUFACTURING SEMICONDUCTOR DIE STACK STRUCTURES

EMBEDDED INTEGRATED STACK CAPACITOR (ISC) IN SUBSTRATE BUILD-UP LAYER

THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF

Multi-Die Fine Grain Integrated Voltage Regulation

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE WITH A THROUGH VIA BETWEEN REDISTRIBUTION LAYERS

SEMICONDUCTOR DEVICE WITH A SPACED SUPPLY VOLTAGE AND GROUND REFERENCE

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE ASSEMBLIES WITH MOLDED SUPPORT SUBSTRATES

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR DEVICE ASSEMBLY WITH SURFACE-MOUNT DIE SUPPORT STRUCT...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Decoupling Capacitor Structures And Assemblies