Memory

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H01L2924/1434

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/1434Memory

Industries

Patents Grantslast 30 patents

Information Patent Grant
Electrical interconnect bridge
- Patent number 12,148,704
- Issue date Nov 19, 2024
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Guard ring design enabling in-line testing of silicon bridges for s...
- Patent number 12,142,553
- Issue date Nov 12, 2024
- Intel Corporation
- Arnab Sarkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device with embedded programmable logic
- Patent number 12,135,660
- Issue date Nov 5, 2024
- Altera Corporation
- Arifur Rahman
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Three-dimensional memory devices and fabricating methods thereof
- Patent number 12,136,599
- Issue date Nov 5, 2024
- Yangtze Memory Technologies Co., Ltd.
- He Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing semiconductor pac...
- Patent number 12,131,974
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Fu Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,132,009
- Issue date Oct 29, 2024
- Samsung Electronics Co., Ltd.
- Su Chang Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method forming same
- Patent number 12,125,833
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assemblies with molded support substrates
- Patent number 12,119,325
- Issue date Oct 15, 2024
- Micron Technology, Inc.
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,119,331
- Issue date Oct 15, 2024
- Samsung Electronics Co., Ltd.
- Ju-Il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages, packaging methods, and packaged semi...
- Patent number 12,119,338
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked dies and methods for forming bonded structures
- Patent number 12,113,056
- Issue date Oct 8, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device with redistribution plugs
- Patent number 12,112,978
- Issue date Oct 8, 2024
- NANYA TECHNOLOGY CORPORATION
- Chun-Cheng Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor packages having through package vias
- Patent number 12,107,051
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Offset interposers for large-bottom packages and large-die package-...
- Patent number 12,107,082
- Issue date Oct 1, 2024
- Intel Corporation
- Russell K. Mortensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Command and address interface regions, and associated devices and s...
- Patent number 12,100,471
- Issue date Sep 24, 2024
- Kazuhiro Yoshida
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,100,681
- Issue date Sep 24, 2024
- Samsung Electronics Co., Ltd.
- Young Lyong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density interconnect device and method
- Patent number 12,094,831
- Issue date Sep 17, 2024
- Tahoe Research, LTD.
- Mihir K Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with surface-mount die support struct...
- Patent number 12,087,720
- Issue date Sep 10, 2024
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages
- Patent number 12,087,757
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory
- Patent number 12,089,409
- Issue date Sep 10, 2024
- Kioxia Corporation
- Masayoshi Tagami
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of manufacturing an integrated fan-out package having fan-ou...
- Patent number 12,080,615
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-hole electrode substrate
- Patent number 12,080,637
- Issue date Sep 3, 2024
- Dai Nippon Printing Co., Ltd.
- Satoru Kuramochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method to minimize stress on stack via
- Patent number 12,080,600
- Issue date Sep 3, 2024
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stacks and methods forming same
- Patent number 12,080,684
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,080,701
- Issue date Sep 3, 2024
- Samsung Electronics Co., Ltd.
- Sanguk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coaxial through via with novel high isolation cross coupling method...
- Patent number 12,074,125
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Feng Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-free frame design for silicon bridges for semiconductor packages
- Patent number 12,074,121
- Issue date Aug 27, 2024
- Intel Corporation
- Dae-Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deep partition power delivery with deep trench capacitor
- Patent number 12,068,295
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die fine grain integrated voltage regulation
- Patent number 12,068,324
- Issue date Aug 20, 2024
- Apple Inc.
- Jared L. Zerbe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 12,058,101
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240387413
- Publication date Nov 21, 2024
- Samsung Electronics Co., Ltd.
- Jaejun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECONSTRUCTED SUBSTRATES FOR HIGH I/O COUNTS APPLICATION AND METHOD...
- Publication number 20240387338
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hsien-Wei CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT INCLUDING BACKSIDE CONDUCTIVE VIAS
- Publication number 20240387652
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Liang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY SYSTEM INCLUDING SEMICONDUCTOR CHIPS
- Publication number 20240379621
- Publication date Nov 14, 2024
- SK HYNIX INC.
- Dong Sop LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
- Publication number 20240379491
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Fu Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES
- Publication number 20240371851
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS USING BOTH SURFACES OF A WAFER AND MANUFACT...
- Publication number 20240371831
- Publication date Nov 7, 2024
- Samsung Electronics Co., Ltd.
- Joonho Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD FORMING SAME
- Publication number 20240371843
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COAXIAL THROUGH VIA WITH NOVEL HIGH ISOLATION CROSS COUPLING METHOD...
- Publication number 20240363560
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Feng Wei KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE STACKS AND METHODS FORMING SAME
- Publication number 20240363590
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH HYBRID BONDING LAYERS AND PROCESS OF MAK...
- Publication number 20240363564
- Publication date Oct 31, 2024
- TOKYO ELECTRON LIMITED
- Soo Doo CHAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING AN INTEGRATED FAN-OUT PACKAGE HAVING FAN-OU...
- Publication number 20240363463
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL STACK CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240363470
- Publication date Oct 31, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Yeong Beom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL STACKING SEMICONDUCTOR ASSEMBLIES WITH NEAR ZERO...
- Publication number 20240355783
- Publication date Oct 24, 2024
- Micron Technology, Inc.
- Owen R. FAY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP PARTITION POWER DELIVERY WITH DEEP TRENCH CAPACITOR
- Publication number 20240355799
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE COMPRISING AN OFFSET INTERCONNECT
- Publication number 20240355781
- Publication date Oct 24, 2024
- QUALCOMM Incorporated
- Yangyang SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARCHITECTURE FOR COMPUTING SYSTEM PACKAGE
- Publication number 20240355746
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING CHIP PACKAGE STRUCTURE WITH MULTIPLE GAP-FILLING...
- Publication number 20240347407
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Chen LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE SEMICONDUCTOR ASSEMBLIES AND METHODS OF MANUFACT...
- Publication number 20240339390
- Publication date Oct 10, 2024
- Lodestar Licensing Group LLC
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK PACKAGES
- Publication number 20240339436
- Publication date Oct 10, 2024
- SK HYNIX INC.
- Eun Hye DO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240332159
- Publication date Oct 3, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Jae Ung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP MODULE ASSEMBLY
- Publication number 20240332194
- Publication date Oct 3, 2024
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240321839
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Kyungdon Mun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING AN OPTICAL INTEGRATED DEVICE
- Publication number 20240319455
- Publication date Sep 26, 2024
- QUALCOMM Incorporated
- Xia LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE INCLUDING LOWER MOLDED STRUCTURE INCLUDING A SUBS...
- Publication number 20240321759
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Tsung-Ding Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WET ATOMIC LAYER ETCHING METHOD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240321805
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Seungho Hahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLIES WITH REDISTRIBUTION STRUCTURES FOR DIE STA...
- Publication number 20240321822
- Publication date Sep 26, 2024
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING METHOD AND PACKAGING STRUCTURE OF MULTI-LAYER STACKED HIG...
- Publication number 20240321853
- Publication date Sep 26, 2024
- TONGFU MICROELECTRONICS CO., LTD.
- Maohua DU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC BRIDGE FOR HIGH BANDWIDTH INTER-DIE COMMUNICATION
- Publication number 20240321593
- Publication date Sep 26, 2024
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240321815
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Soohyun NAM
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electrical interconnect bridge

Guard ring design enabling in-line testing of silicon bridges for s...

Integrated circuit device with embedded programmable logic

Three-dimensional memory devices and fabricating methods thereof

Semiconductor package and method of manufacturing semiconductor pac...

Semiconductor package

Integrated circuit package and method forming same

Semiconductor device assemblies with molded support substrates

Semiconductor package

Semiconductor device packages, packaging methods, and packaged semi...

Stacked dies and methods for forming bonded structures

Method for fabricating semiconductor device with redistribution plugs

Method of forming semiconductor packages having through package vias

Offset interposers for large-bottom packages and large-die package-...

Command and address interface regions, and associated devices and s...

Semiconductor package and method of fabricating the same

High density interconnect device and method

Semiconductor device assembly with surface-mount die support struct...

Integrated circuit packages

Semiconductor memory

Method of manufacturing an integrated fan-out package having fan-ou...

Through-hole electrode substrate

Semiconductor device and method to minimize stress on stack via

Die stacks and methods forming same

Semiconductor package

Coaxial through via with novel high isolation cross coupling method...

Metal-free frame design for silicon bridges for semiconductor packages

Deep partition power delivery with deep trench capacitor

Multi-die fine grain integrated voltage regulation

Package structure and method of forming the same

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

RECONSTRUCTED SUBSTRATES FOR HIGH I/O COUNTS APPLICATION AND METHOD...

INTEGRATED CIRCUIT INCLUDING BACKSIDE CONDUCTIVE VIAS

MEMORY SYSTEM INCLUDING SEMICONDUCTOR CHIPS

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE

INTEGRATED CIRCUIT PACKAGES

SEMICONDUCTOR APPARATUS USING BOTH SURFACES OF A WAFER AND MANUFACT...

INTEGRATED CIRCUIT PACKAGE AND METHOD FORMING SAME

COAXIAL THROUGH VIA WITH NOVEL HIGH ISOLATION CROSS COUPLING METHOD...

DIE STACKS AND METHODS FORMING SAME

SEMICONDUCTOR DEVICES WITH HYBRID BONDING LAYERS AND PROCESS OF MAK...

METHOD OF MANUFACTURING AN INTEGRATED FAN-OUT PACKAGE HAVING FAN-OU...

WAFER-LEVEL STACK CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME

THREE-DIMENSIONAL STACKING SEMICONDUCTOR ASSEMBLIES WITH NEAR ZERO...

DEEP PARTITION POWER DELIVERY WITH DEEP TRENCH CAPACITOR

INTEGRATED DEVICE COMPRISING AN OFFSET INTERCONNECT

ARCHITECTURE FOR COMPUTING SYSTEM PACKAGE

METHOD FOR FORMING CHIP PACKAGE STRUCTURE WITH MULTIPLE GAP-FILLING...

PACKAGE-ON-PACKAGE SEMICONDUCTOR ASSEMBLIES AND METHODS OF MANUFACT...

STACK PACKAGES

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

CHIP MODULE ASSEMBLY

SEMICONDUCTOR PACKAGE

PACKAGE COMPRISING AN OPTICAL INTEGRATED DEVICE

PACKAGE STRUCTURE INCLUDING LOWER MOLDED STRUCTURE INCLUDING A SUBS...

WET ATOMIC LAYER ETCHING METHOD AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR ASSEMBLIES WITH REDISTRIBUTION STRUCTURES FOR DIE STA...

PACKAGING METHOD AND PACKAGING STRUCTURE OF MULTI-LAYER STACKED HIG...

DIELECTRIC BRIDGE FOR HIGH BANDWIDTH INTER-DIE COMMUNICATION

SEMICONDUCTOR PACKAGE