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HYBRID CHIP CARRIER PACKAGE
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Publication number 20240128170
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Publication date Apr 18, 2024
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TEXAS INSTRUMENTS INCORPORATED
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Yiqi Tang
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE
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Publication number 20240096731
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Publication date Mar 21, 2024
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Taiwan Semiconductor Manufacturing Company, Ltd.
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Chin-Hua WANG
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H01 - BASIC ELECTRIC ELEMENTS
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ELECTRIC DRIVE MODULE
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Publication number 20240087997
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Publication date Mar 14, 2024
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American Axle & Manufacturing, Inc.
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James P. DOWNS
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE
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Publication number 20240079394
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Publication date Mar 7, 2024
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Samsung Electronics Co., Ltd.
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Juil CHOI
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H01 - BASIC ELECTRIC ELEMENTS
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INVERTER
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Publication number 20240063084
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Publication date Feb 22, 2024
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Tesla, Inc.
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Wenjun Liu
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H01 - BASIC ELECTRIC ELEMENTS
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WIRE BONDED AIR HEAT SINK
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Publication number 20240055318
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Publication date Feb 15, 2024
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Raytheon Company
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James S. Wilson
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE
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Publication number 20240047300
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Publication date Feb 8, 2024
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ROHM CO., LTD.
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Xiaopeng WU
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H01 - BASIC ELECTRIC ELEMENTS
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Integrated Circuit Package and Method
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Publication number 20240021488
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Publication date Jan 18, 2024
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Taiwan Semiconductor Manufacturing Co., Ltd.
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Sey-Ping Sun
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H01 - BASIC ELECTRIC ELEMENTS
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NITRIDE SEMICONDUCTOR DEVICE
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Publication number 20240014094
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Publication date Jan 11, 2024
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ROHM CO., LTD.
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Keita SHIKATA
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE
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Publication number 20240014106
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Publication date Jan 11, 2024
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Power Master Semiconductor Co., Ltd.
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Jooyaung EOM
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H01 - BASIC ELECTRIC ELEMENTS
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