Metallic materials

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H01L23/3736

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/3736Metallic materials

Industries

Patents Grantslast 30 patents

Information Patent Grant
Optical multichip package with multiple system-on-chip dies
- Patent number 12,148,744
- Issue date Nov 19, 2024
- Intel Corporation
- Zhichao Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising metal layer configured for electromagnetic inter...
- Patent number 12,142,577
- Issue date Nov 12, 2024
- QUALCOMM Technologies, Inc.
- Marc Huesgen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High performance two-phase cooling apparatus for portable applications
- Patent number 12,140,385
- Issue date Nov 12, 2024
- PiMEMS, Inc.
- Payam Bozorgi
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Semiconductor package structure and fabrication method thereof
- Patent number 12,136,581
- Issue date Nov 5, 2024
- Samsung Electronics Co., Ltd.
- Youngho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,131,979
- Issue date Oct 29, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Luguang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of semiconductor device
- Patent number 12,125,794
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hang Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic package for high CTE mismatch
- Patent number 12,119,281
- Issue date Oct 15, 2024
- Qorvo US, Inc.
- Dylan Murdock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat radiation member
- Patent number 12,112,993
- Issue date Oct 8, 2024
- A.L.M.T. Corp.
- Ryota Matsugi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device including cooling structure
- Patent number 12,100,637
- Issue date Sep 24, 2024
- Samsung Electronics Co., Ltd.
- Jae Ho Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Thermally conductive slugs/active dies to improve cooling of stacke...
- Patent number 12,094,800
- Issue date Sep 17, 2024
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thick-silver layer interface
- Patent number 12,094,801
- Issue date Sep 17, 2024
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device and method
- Patent number 12,085,769
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid thermal interface material (TIM) with reduced 3D thermal res...
- Patent number 12,087,658
- Issue date Sep 10, 2024
- Intel Corporation
- Pooya Tadayon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic power package and heat sink/cold rail arrangement
- Patent number 12,087,659
- Issue date Sep 10, 2024
- DELPHI TECHNOLOGIES IP LIMITED
- Binghua Pan
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Semiconductor package structure having thermal management structure
- Patent number 12,087,662
- Issue date Sep 10, 2024
- Chun-Ming Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of wafer bonding
- Patent number 12,080,622
- Issue date Sep 3, 2024
- United Microelectronics Corp.
- Chia-Liang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-cleaning heatsink for electronic components
- Patent number 12,074,080
- Issue date Aug 27, 2024
- Micron Technology, Inc.
- Maksim Kuzmenka
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Heat sink integrated insulating circuit board
- Patent number 12,068,219
- Issue date Aug 20, 2024
- Mitsubishi Materials Corporation
- Toyo Ohashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating for thermal management
- Patent number 12,068,221
- Issue date Aug 20, 2024
- Texas Instruments Incorporated
- Nazila Dadvand
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electronic module
- Patent number 12,068,236
- Issue date Aug 20, 2024
- Murata Manufacturing Co., Ltd.
- Shoji Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages with thermal interface materials with d...
- Patent number 12,062,592
- Issue date Aug 13, 2024
- Intel Corporation
- Sergio Antonio Chan Arguedas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct to chip application of boiling enhancement coating
- Patent number 12,051,637
- Issue date Jul 30, 2024
- MTS IP Holdings Ltd
- Luke Gregory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding sheet and bonded structure
- Patent number 12,046,572
- Issue date Jul 23, 2024
- Mitsui Mining & Smelting Co., Ltd.
- Kei Anai
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Compressible foamed thermal interface materials and methods of maki...
- Patent number 12,033,971
- Issue date Jul 9, 2024
- Laird Technologies, Inc.
- Vijayaraghavan Rajagopal
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Socket interposer for system-in-package (SIP) module qualification...
- Patent number 12,025,971
- Issue date Jul 2, 2024
- Intel Corporation
- Navneet Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,027,438
- Issue date Jul 2, 2024
- Mitsubishi Electric Corporation
- Daisuke Nakaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface materials, 3D semiconductor packages and methods...
- Patent number 12,021,008
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface structures, electrical systems with thermal inter...
- Patent number 12,014,971
- Issue date Jun 18, 2024
- NXP USA, INC.
- Lu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including lid with integrated heat pipe for t...
- Patent number 12,009,276
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 12,009,281
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR ARRANGEMENT AND METHOD OF FORMING
- Publication number 20240387316
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chih-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER STRUCTURE, SEMICONDUCTOR DEVICE AND SEMICONDUCTOR APPARATUS
- Publication number 20240387319
- Publication date Nov 21, 2024
- FLOSFIA INC.
- Mutsumi OKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20240379569
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hang TUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240379488
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Hua WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIC STATIC INDUCTION TRANSISTOR WITH DOUBLE SIDE COOLING AND METHOD...
- Publication number 20240371989
- Publication date Nov 7, 2024
- Analog Power Conversion LLC
- Dumitru G. SDRULLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE MANUFACTURING METHOD
- Publication number 20240361546
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL PAD, HEAT DISSIPATION MODULE, AND ELECTRONIC DEVICE
- Publication number 20240363477
- Publication date Oct 31, 2024
- Honor Device Co., Ltd.
- Erliang Li
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MEMORY DEVICE WITH LOW DENSITY THERMAL BARRIER
- Publication number 20240347418
- Publication date Oct 17, 2024
- Micron Technology, Inc.
- Pengyuan Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POROUS STRUCTURE WITH MICROCHANNELS
- Publication number 20240332124
- Publication date Oct 3, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Sujan Dewanjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240321841
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Hwanjoo PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO IMPROVE INTERCONNECT COEFFICIENT OF THERMAL EXPANSION
- Publication number 20240321636
- Publication date Sep 26, 2024
- Applied Materials, Inc.
- Tyler Sherwood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING POWER SEMICONDUCTOR MODULE, AND POWER SEMIC...
- Publication number 20240321676
- Publication date Sep 26, 2024
- AMOSENSE CO., LTD.
- Jihyung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240312860
- Publication date Sep 19, 2024
- Kabushiki Kaisha Toshiba
- Daisuke KOIKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240304464
- Publication date Sep 12, 2024
- OIP Technology Pte Ltd
- Yonggang JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240304589
- Publication date Sep 12, 2024
- ROHM CO., LTD.
- Katsuhiko YOSHIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH INTEGRATED HEAT DISTRIBUTION AND MANUFACT...
- Publication number 20240290761
- Publication date Aug 29, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-PROFILE MEMORY APPARATUS COMPATIBLE WITH SYSTEM THERMAL SOLUTIO...
- Publication number 20240290680
- Publication date Aug 29, 2024
- Intel Corporation
- Jiun Hann SIR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL CIRCUIT PART AND METHOD OF MANUFACTURING THREE-DI...
- Publication number 20240282588
- Publication date Aug 22, 2024
- MAXELL, LTD.
- Akiko KITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AMPLIFIER MODULES WITH POWER TRANSISTOR DIE AND PERIPHERAL GROUND C...
- Publication number 20240282654
- Publication date Aug 22, 2024
- NXP USA, Inc.
- Elie A. Maalouf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND POWER CONVERTER
- Publication number 20240282666
- Publication date Aug 22, 2024
- Fuji Electric Co., Ltd.
- Yuta NAKAJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL CONDUCTIVE MEMBER FOR A HEAT SINK
- Publication number 20240274488
- Publication date Aug 15, 2024
- The ESAB Group Inc.
- Secundino Miguel Baldonado
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240274539
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Yun PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MCM PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREFOR
- Publication number 20240274501
- Publication date Aug 15, 2024
- SiPLP Microelectronics (Chongqing) Limited
- Weiyuan YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE MODULE AND METHOD FOR FABRICATION OF THE SAME
- Publication number 20240266295
- Publication date Aug 8, 2024
- USI Science and Technology (Shenzhen) Co., Ltd.
- LI-CHENG SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING DUMMY PACKAGE
- Publication number 20240266248
- Publication date Aug 8, 2024
- Samsung Electronics Co., Ltd.
- Byunghan KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH HEAT DISSIPATION AND ELECTROMAGNETIC PROTECTION
- Publication number 20240243075
- Publication date Jul 18, 2024
- Walton Advanced Engineering, Inc
- HONG-CHI YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLIES WITH THERMAL INTERFACE STRUCTURE
- Publication number 20240234243
- Publication date Jul 11, 2024
- Tesla, Inc.
- Aydin Nabovati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE SUBSTRATE AND METHOD OF PRODUCING THE COMPOSITE SUBSTRATE...
- Publication number 20240222209
- Publication date Jul 4, 2024
- Nichia Corporation.
- Masatsugu ICHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Spring finger ring laser welded on a die cast part serving as an ai...
- Publication number 20240222220
- Publication date Jul 4, 2024
- Plume Design, Inc.
- Ming-Tsung Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A METHOD, APPARATUS, AND ASSEMBLY FOR THERMALLY CONNECTING LAYERS W...
- Publication number 20240213115
- Publication date Jun 27, 2024
- Arieca Inc.
- Navid Kazem
- H01 - BASIC ELECTRIC ELEMENTS

Metallic materials

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Optical multichip package with multiple system-on-chip dies

Package comprising metal layer configured for electromagnetic inter...

High performance two-phase cooling apparatus for portable applications

Semiconductor package structure and fabrication method thereof

Semiconductor structure and manufacturing method thereof

Semiconductor device and manufacturing method of semiconductor device

Hermetic package for high CTE mismatch

Heat radiation member

Electronic device including cooling structure

Thermally conductive slugs/active dies to improve cooling of stacke...

Thick-silver layer interface

Integrated circuit device and method

Hybrid thermal interface material (TIM) with reduced 3D thermal res...

Electronic power package and heat sink/cold rail arrangement

Semiconductor package structure having thermal management structure

Semiconductor structure and method of wafer bonding

Self-cleaning heatsink for electronic components

Heat sink integrated insulating circuit board

Plating for thermal management

Electronic module

Integrated circuit packages with thermal interface materials with d...

Direct to chip application of boiling enhancement coating

Bonding sheet and bonded structure

Compressible foamed thermal interface materials and methods of maki...

Socket interposer for system-in-package (SIP) module qualification...

Semiconductor device

Thermal interface materials, 3D semiconductor packages and methods...

Thermal interface structures, electrical systems with thermal inter...

Semiconductor package including lid with integrated heat pipe for t...

Package structure and method of manufacturing the same

Patents Applicationslast 30 patents

SEMICONDUCTOR ARRANGEMENT AND METHOD OF FORMING

MULTILAYER STRUCTURE, SEMICONDUCTOR DEVICE AND SEMICONDUCTOR APPARATUS

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

SIC STATIC INDUCTION TRANSISTOR WITH DOUBLE SIDE COOLING AND METHOD...

INTEGRATED CIRCUIT DEVICE MANUFACTURING METHOD

THERMAL PAD, HEAT DISSIPATION MODULE, AND ELECTRONIC DEVICE

MEMORY DEVICE WITH LOW DENSITY THERMAL BARRIER

POROUS STRUCTURE WITH MICROCHANNELS

SEMICONDUCTOR PACKAGE

METHOD TO IMPROVE INTERCONNECT COEFFICIENT OF THERMAL EXPANSION

METHOD OF MANUFACTURING POWER SEMICONDUCTOR MODULE, AND POWER SEMIC...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE WITH INTEGRATED HEAT DISTRIBUTION AND MANUFACT...

LOW-PROFILE MEMORY APPARATUS COMPATIBLE WITH SYSTEM THERMAL SOLUTIO...

THREE-DIMENSIONAL CIRCUIT PART AND METHOD OF MANUFACTURING THREE-DI...

AMPLIFIER MODULES WITH POWER TRANSISTOR DIE AND PERIPHERAL GROUND C...

SEMICONDUCTOR DEVICE AND POWER CONVERTER

THERMAL CONDUCTIVE MEMBER FOR A HEAT SINK

INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME

MCM PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREFOR

ELECTRONIC PACKAGE MODULE AND METHOD FOR FABRICATION OF THE SAME

SEMICONDUCTOR PACKAGE INCLUDING DUMMY PACKAGE

CHIP PACKAGE WITH HEAT DISSIPATION AND ELECTROMAGNETIC PROTECTION

ELECTRONIC ASSEMBLIES WITH THERMAL INTERFACE STRUCTURE

COMPOSITE SUBSTRATE AND METHOD OF PRODUCING THE COMPOSITE SUBSTRATE...

Spring finger ring laser welded on a die cast part serving as an ai...

A METHOD, APPARATUS, AND ASSEMBLY FOR THERMALLY CONNECTING LAYERS W...