Methods for connecting semiconductor or solid state bodies using means for bonding not being attached to, or not being formed on, the body surface to be connected

Industry

CPC
H01L2224/90

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/90Methods for connecting semiconductor or solid state bodies using means for bonding not being attached to, or not being formed on, the body surface to be connected

Industries

Patents Grantslast 30 patents

Information Patent Grant
Solar cell module and conductor
- Patent number 10,644,182
- Issue date May 5, 2020
- Kabushiki Kaisha Toyota Jidoshokki
- Hirotaka Inaba
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor apparatus
- Patent number 10,468,372
- Issue date Nov 5, 2019
- Mitsubishi Electric Corporation
- Keisuke Eguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC structure with angled interconnect elements
- Patent number 9,754,911
- Issue date Sep 5, 2017
- GLOBALFOUNDRIES Inc.
- David J. West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill device and method
- Patent number 9,516,752
- Issue date Dec 6, 2016
- Intel Corporation
- Patricia A Brusso
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device, having through electrodes, a manufacturing me...
- Patent number 9,257,404
- Issue date Feb 9, 2016
- Seiko Epson Corporation
- Tsuyoshi Yoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for assembling a chip in a flexible substrate
- Patent number 9,179,586
- Issue date Nov 3, 2015
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Jean Brun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System for clamping heat sink
- Patent number 8,994,166
- Issue date Mar 31, 2015
- Harman International Industries, Incorporated
- Greg Mlotkowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilevel interconnection system
- Patent number 8,888,504
- Issue date Nov 18, 2014
- NXP B.V.
- Erich Pischler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and process for producing the same
- Patent number 8,866,021
- Issue date Oct 21, 2014
- Panasonic Corporation
- Hidenobu Nishikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked electronic device and method of making such an electronic d...
- Patent number 8,860,200
- Issue date Oct 14, 2014
- Commissariat a l'Energie Atomique et aux Energies Alternatives
- Jean Brun
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device having through electrodes, a manufacturing met...
- Patent number 8,796,823
- Issue date Aug 5, 2014
- Seiko Epson Corporation
- Tsuyoshi Yoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method including deformation of supporting board to a...
- Patent number 8,748,229
- Issue date Jun 10, 2014
- Fujitsu Semiconductor Limited
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 8,697,491
- Issue date Apr 15, 2014
- Electronics and Telecommunications Research Institute
- Woojin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 8,647,923
- Issue date Feb 11, 2014
- Canon Kabushiki Kaisha
- Kiyofumi Sakaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 8,617,922
- Issue date Dec 31, 2013
- Canon Kabushiki Kaisha
- Kiyofumi Sakaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices and methods for manufacturing microelectron...
- Patent number 8,597,981
- Issue date Dec 3, 2013
- Micron Technology, Inc.
- Rick C. Lake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive bump, method for producing the same, and electronic comp...
- Patent number 8,575,751
- Issue date Nov 5, 2013
- Panasonic Corporation
- Daisuke Sakurai
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Component arrangement and method for production thereof
- Patent number 8,564,969
- Issue date Oct 22, 2013
- Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
- Hans-Hermann Oppermann
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
System for clamping heat sink
- Patent number 8,546,192
- Issue date Oct 1, 2013
- Harman International Industries, Incorporated
- Greg Mlotkowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly of multi-chip modules using sacrificial features
- Patent number 8,487,429
- Issue date Jul 16, 2013
- Oracle America, Inc.
- Jing Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transponder and method of producing a transponder
- Patent number 8,448,870
- Issue date May 28, 2013
- NXP B.V.
- Reinard Rogy
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device
- Patent number 8,441,126
- Issue date May 14, 2013
- Elpida Memory, Inc.
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill device and method
- Patent number 8,399,291
- Issue date Mar 19, 2013
- Intel Corporation
- Patricia A Brusso
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package with a reduced volume and thickness and capab...
- Patent number 8,394,717
- Issue date Mar 12, 2013
- Hynix Semiconductor Inc.
- Chang Jun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connection of components
- Patent number 8,393,076
- Issue date Mar 12, 2013
- Conductive Inkjet Technology Limited
- Philip Gareth Bentley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device having stacked dice disposed on base substrate
- Patent number 8,373,278
- Issue date Feb 12, 2013
- Sanyo Semiconductor Co., Ltd.
- Hiroyuki Shinogi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer of circuit board and joining structure of wafer or circuit board
- Patent number 8,334,465
- Issue date Dec 18, 2012
- Elpida Memory, Inc.
- Masakazu Ishino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device having through electrodes, a manufacturing met...
- Patent number 8,330,256
- Issue date Dec 11, 2012
- Seiko Epson Corporation
- Tsuyoshi Yoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device having several contact areas
- Patent number 8,331,100
- Issue date Dec 11, 2012
- Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
- Michael Feil
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Manufacturing process and structure of through silicon via
- Patent number 8,324,736
- Issue date Dec 4, 2012
- Renesas Electronics Corporation
- Michihiro Kawashita
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
REMOTE HEAT SINK SIDE ATTACH METHODOLOGY
- Publication number 20240387320
- Publication date Nov 21, 2024
- Cisco Technology, Inc.
- Gary K. CHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE FOR INTEGRATED CIRCUIT PACKAGE
- Publication number 20240266278
- Publication date Aug 8, 2024
- Monolithic Power Systems, Inc.
- Yi Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240213106
- Publication date Jun 27, 2024
- DYNEX SEMICONDUCTOR LIMITED
- Robin Adam Simpson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230115289
- Publication date Apr 13, 2023
- Mitsubishi Electric Corporation
- Koji YAMAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE FOR INTEGRATED CIRCUIT PACKAGE AND THE ME...
- Publication number 20220399264
- Publication date Dec 15, 2022
- Monolithic Power Systems, Inc.
- Yi Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, HAVING THROUGH ELECTRODES, A MANUFACTURING ME...
- Publication number 20140306342
- Publication date Oct 16, 2014
- Tsuyoshi YODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURI...
- Publication number 20130329391
- Publication date Dec 12, 2013
- NEC Corporation
- Naomi ISHIZUKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDERFILL DEVICE AND METHOD
- Publication number 20130208411
- Publication date Aug 15, 2013
- Patricia A. Brusso
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WAFER OR CIRCUIT BOARD AND JOINING STRUCTURE OF WAFER OR CIRCUIT BOARD
- Publication number 20130140067
- Publication date Jun 6, 2013
- Elpida Memory, Inc.
- Masakazu Ishino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, AND ELECTRONIC...
- Publication number 20130075896
- Publication date Mar 28, 2013
- SEIKO EPSON CORPORATION
- Tsuyoshi YODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ASSEMBLING A CHIP IN A FLEXIBLE SUBSTRATE
- Publication number 20130074331
- Publication date Mar 28, 2013
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Jean Brun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20130040428
- Publication date Feb 14, 2013
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Woojin CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND PROCESS FOR PRODUCING THE SAME
- Publication number 20130010436
- Publication date Jan 10, 2013
- Hidenobu Nishikawa
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR...
- Publication number 20120322202
- Publication date Dec 20, 2012
- FUJITSU SEMICONDUCTOR LIMITED
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OHMIC CONNECTION USING WIDENED CONNECTION ZONES IN A PORTABLE ELEC...
- Publication number 20120193804
- Publication date Aug 2, 2012
- RFIDEAL
- Yannick Grasset
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEM FOR CLAMPING HEAT SINK
- Publication number 20120119351
- Publication date May 17, 2012
- HARMAN INTERNATIONAL INDUSTRIES, INCORPORATED
- Greg Mlotkowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM FOR CLAMPING HEAT SINK
- Publication number 20120122279
- Publication date May 17, 2012
- HARMAN INTERNATIONAL INDUSTRIES, INCORPORATED
- Greg Mlotkowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR DEVICE
- Publication number 20120119356
- Publication date May 17, 2012
- Elpida Memory, Inc.
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM FOR CLAMPING HEAT SINK
- Publication number 20120055650
- Publication date Mar 8, 2012
- HARMAN INTERNATIONAL INDUSTRIES, INCORPORATED
- Greg Mlotkowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILEVEL INTERCONNECTION SYSTEM
- Publication number 20120045909
- Publication date Feb 23, 2012
- NXP B.V.
- Erich Pischler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component arrangement and method for production thereof
- Publication number 20120039056
- Publication date Feb 16, 2012
- Hans-Hermann Oppermann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20120034759
- Publication date Feb 9, 2012
- Canon Kabushiki Kaisha
- Kiyofumi Sakaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH A REDUCED VOLUME AND THICKNESS AND CAPAB...
- Publication number 20120009775
- Publication date Jan 12, 2012
- Hynix Semiconductor Inc.
- Chang Jun PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK PACKAGE HAVING REDUCED ELECTRICAL CONNECTION LENGTH SUITABLE...
- Publication number 20110312128
- Publication date Dec 22, 2011
- Hynix Semiconductor Inc.
- Sung Min KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING PROCESS AND STRUCTURE OF THROUGH SILICON VIA
- Publication number 20110233773
- Publication date Sep 29, 2011
- RENESAS ELECTRONICS CORPORATION
- Michihiro Kawashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE THROUGH-ELECTRODE SUITABLE FOR A STACKED SEMI...
- Publication number 20110198722
- Publication date Aug 18, 2011
- Hynix Semiconductor Inc.
- Min Suk SUH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE
- Publication number 20110162204
- Publication date Jul 7, 2011
- QIMONDA AG
- Werner Reiss
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
STRUCTURE FOR INHIBITING BACK END OF LINE DAMAGE FROM DICING AND CH...
- Publication number 20110140245
- Publication date Jun 16, 2011
- International Business Machines Corporation
- Michael W. Lane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Manufacturing Semiconductor Device
- Publication number 20110136337
- Publication date Jun 9, 2011
- SEIKO EPSON CORPORATION
- Yasuo Yamasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE FOR CONNECTION OF CIRCUIT MEMBER AND SEMICONDUCTOR DEVICE...
- Publication number 20110133346
- Publication date Jun 9, 2011
- Hitachi Chemical Company, Ltd.
- Akira Nagai
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Methods for connecting semiconductor or solid state bodies using means for bonding not being attached to, or not being formed on, the body surface to be connected

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Solar cell module and conductor

Semiconductor apparatus

IC structure with angled interconnect elements

Underfill device and method

Semiconductor device, having through electrodes, a manufacturing me...

Method for assembling a chip in a flexible substrate

System for clamping heat sink

Multilevel interconnection system

Circuit board and process for producing the same

Stacked electronic device and method of making such an electronic d...

Semiconductor device having through electrodes, a manufacturing met...

Manufacturing method including deformation of supporting board to a...

Semiconductor package and method of fabricating the same

Method of manufacturing semiconductor device

Method of manufacturing semiconductor device

Microelectronic devices and methods for manufacturing microelectron...

Conductive bump, method for producing the same, and electronic comp...

Component arrangement and method for production thereof

System for clamping heat sink

Assembly of multi-chip modules using sacrificial features

Transponder and method of producing a transponder

Semiconductor device

Underfill device and method

Semiconductor package with a reduced volume and thickness and capab...

Electrical connection of components

Semiconductor device having stacked dice disposed on base substrate

Wafer of circuit board and joining structure of wafer or circuit board

Semiconductor device having through electrodes, a manufacturing met...

Device having several contact areas

Manufacturing process and structure of through silicon via

Patents Applicationslast 30 patents

REMOTE HEAT SINK SIDE ATTACH METHODOLOGY

INTERCONNECTION STRUCTURE FOR INTEGRATED CIRCUIT PACKAGE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

INTERCONNECTION STRUCTURE FOR INTEGRATED CIRCUIT PACKAGE AND THE ME...

SEMICONDUCTOR DEVICE, HAVING THROUGH ELECTRODES, A MANUFACTURING ME...

PRINTED WIRING BOARD, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURI...

UNDERFILL DEVICE AND METHOD

WAFER OR CIRCUIT BOARD AND JOINING STRUCTURE OF WAFER OR CIRCUIT BOARD

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, AND ELECTRONIC...

METHOD FOR ASSEMBLING A CHIP IN A FLEXIBLE SUBSTRATE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

CIRCUIT BOARD AND PROCESS FOR PRODUCING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR...

OHMIC CONNECTION USING WIDENED CONNECTION ZONES IN A PORTABLE ELEC...

SYSTEM FOR CLAMPING HEAT SINK

SYSTEM FOR CLAMPING HEAT SINK

SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR DEVICE

SYSTEM FOR CLAMPING HEAT SINK

MULTILEVEL INTERCONNECTION SYSTEM

Component arrangement and method for production thereof

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE WITH A REDUCED VOLUME AND THICKNESS AND CAPAB...

STACK PACKAGE HAVING REDUCED ELECTRICAL CONNECTION LENGTH SUITABLE...

MANUFACTURING PROCESS AND STRUCTURE OF THROUGH SILICON VIA

SEMICONDUCTOR PACKAGE THROUGH-ELECTRODE SUITABLE FOR A STACKED SEMI...

INTEGRATED DEVICE

STRUCTURE FOR INHIBITING BACK END OF LINE DAMAGE FROM DICING AND CH...

Method for Manufacturing Semiconductor Device

ADHESIVE FOR CONNECTION OF CIRCUIT MEMBER AND SEMICONDUCTOR DEVICE...