Methods for disconnecting semiconductor or solid-state bodies

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H01L24/98

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

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H01L24/98Methods for disconnecting semiconductor or solid-state bodies

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Interconnection between chips by bridge chip
- Patent number 12,094,825
- Issue date Sep 17, 2024
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods related to wire bond cleaning and wire bonding...
- Patent number 12,087,728
- Issue date Sep 10, 2024
- Skyworks Solutions, Inc.
- Aldrin Quinones Garing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 12,072,588
- Issue date Aug 27, 2024
- Samsung Display Co., Ltd.
- Yoo Jeong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode
- Patent number 12,057,527
- Issue date Aug 6, 2024
- Au Optronics Corporation
- Chia-Hui Pai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate debonding from bonded part
- Patent number 12,040,311
- Issue date Jul 16, 2024
- The Boeing Company
- Peter D. Brewer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display panel and preparation method thereof
- Patent number 12,033,994
- Issue date Jul 9, 2024
- BOE Technology Group Co., Ltd.
- Zhijun Lv
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transferring missing semiconductor chips using an adhesi...
- Patent number 12,014,941
- Issue date Jun 18, 2024
- Osram Opto Semiconductors GmbH
- Simeon Katz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced device assembly structures and methods
- Patent number 11,999,001
- Issue date Jun 4, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for debonding temporarily bonded wafers in waf...
- Patent number 11,996,384
- Issue date May 28, 2024
- PulseForge, Inc.
- Vahid Akhavan Attar
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder ball application for singular die
- Patent number 11,978,711
- Issue date May 7, 2024
- Global Circuit Innovations Incorporated
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and manufacturing method of electronic device
- Patent number 11,948,908
- Issue date Apr 2, 2024
- Japan Display Inc.
- Kazuyuki Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method
- Patent number 11,887,975
- Issue date Jan 30, 2024
- Daicel Corporation
- Naoko Tsuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reclaimable semiconductor device package and associated systems and...
- Patent number 11,854,635
- Issue date Dec 26, 2023
- Micron Technology, Inc.
- Yueping Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection between chips by bridge chip
- Patent number 11,848,272
- Issue date Dec 19, 2023
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heated pins to couple with solder elements
- Patent number 11,830,846
- Issue date Nov 28, 2023
- Intel Corporation
- Feroz Mohammad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing apparatus, operation method thereof, and method for m...
- Patent number 11,791,305
- Issue date Oct 17, 2023
- Kioxia Corporation
- Sho Kawadahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
DBI to SI bonding for simplified handle wafer
- Patent number 11,791,307
- Issue date Oct 17, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Chandrasekhar Mandalapu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for testing semiconductor elements
- Patent number 11,756,841
- Issue date Sep 12, 2023
- UPPER ELEC. CO., LTD.
- Shih Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder removal from semiconductor devices
- Patent number 11,745,281
- Issue date Sep 5, 2023
- Micron Technology, Inc.
- Mark E. Tuttle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a handle substrate intended for temporary...
- Patent number 11,710,653
- Issue date Jul 25, 2023
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Pierre Montmeat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reusable wide bandgap semiconductor substrate
- Patent number 11,710,662
- Issue date Jul 25, 2023
- United Silicon Carbide, Inc.
- Anup Bhalla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanical wafer alignment detection for bonding process
- Patent number 11,688,717
- Issue date Jun 27, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Hung Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fully automated wafer debonding system and method thereof
- Patent number 11,670,524
- Issue date Jun 6, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Fei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatuses for removal of wires from packaging substrates
- Patent number 11,616,045
- Issue date Mar 28, 2023
- Skyworks Solutions, Inc.
- Cesar Melendrez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder ball application for singular die
- Patent number 11,508,680
- Issue date Nov 22, 2022
- Global Circuit Innovations Inc.
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting method and mounting device
- Patent number 11,495,571
- Issue date Nov 8, 2022
- Toray Engineering Co., Ltd.
- Yoshiyuki Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip removing device and chip removing method
- Patent number 11,490,551
- Issue date Nov 1, 2022
- ASTI GLOBAL INC., TAIWAN
- Chien-Shou Liao
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pressure-activated electrical interconnection with additive repair
- Patent number 11,393,730
- Issue date Jul 19, 2022
- X Display Company Technology Limited
- Ronald S. Cok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressure-activated electrical interconnection with additive repair
- Patent number 11,387,153
- Issue date Jul 12, 2022
- X Display Company Technology Limited
- Ronald S. Cok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of dismantling a stack of at least three substrates
- Patent number 11,335,584
- Issue date May 17, 2022
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Pierre Montmeat
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DISPLAY DEVICE
- Publication number 20240369888
- Publication date Nov 7, 2024
- SAMSUNG DISPLAY CO., LTD.
- YOO JEONG LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED-CIRCUIT MODULE COLLECTION AND DEPOSITION
- Publication number 20240347367
- Publication date Oct 17, 2024
- X-CELEPRINT LIMITED
- Ronald S. Cok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROLED DEFECT MANAGEMENT
- Publication number 20240347398
- Publication date Oct 17, 2024
- VueReal Inc.
- Gholamreza CHAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPENSATION METHOD FOR WAFER BONDING
- Publication number 20240332246
- Publication date Oct 3, 2024
- Macronix International Co., Ltd.
- Tien Chu YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...
- Publication number 20240332250
- Publication date Oct 3, 2024
- STMicroelectronics International N.V.
- Antonio BELLIZZI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR DEBONDING TEMPORARILY BONDED WAFERS IN WAF...
- Publication number 20240321816
- Publication date Sep 26, 2024
- NCC NANO, LLC
- VAHID AKHAVAN ATTAR
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR DEBONDING TEMPORARILY BONDED WAFERS IN WAF...
- Publication number 20240297144
- Publication date Sep 5, 2024
- NCC NANO, LLC
- VAHID AKHAVAN ATTAR
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DBI TO SI BONDING FOR SIMPLIFIED HANDLE WAFER
- Publication number 20240282747
- Publication date Aug 22, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Chandrasekhar Mandalapu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEBONDING REPAIR DEVICES
- Publication number 20240222319
- Publication date Jul 4, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian GAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE DEBONDING FROM BONDED PART
- Publication number 20240213214
- Publication date Jun 27, 2024
- The Boeing Company
- Peter D. Brewer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DBI TO SI BONDING FOR SIMPLIFIED HANDLE WAFER
- Publication number 20240186284
- Publication date Jun 6, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Chandrasekhar Mandalapu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR TRIMMING MICRO ELECTRONIC ELEMENT
- Publication number 20240071992
- Publication date Feb 29, 2024
- PlayNitride Display Co., Ltd.
- Yen-Mu Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230411344
- Publication date Dec 21, 2023
- KIOXIA Corporation
- Hiroaki ASHIDATE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOVAL OF WIRES FROM PACKAGING SUBSTRATES
- Publication number 20230378127
- Publication date Nov 23, 2023
- Skyworks Solutions, Inc.
- Cesar MELENDREZ MURILLO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REWORKABLE INTER-SUBSTRATE BOND STRUCTURE
- Publication number 20230378126
- Publication date Nov 23, 2023
- The Boeing Company
- Peter D. Brewer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION BETWEEN CHIPS BY BRIDGE CHIP
- Publication number 20230343713
- Publication date Oct 26, 2023
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MECHANICAL WAFER ALIGNMENT DETECTION FOR BONDING PROCESS
- Publication number 20230282612
- Publication date Sep 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Hung Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY AUTOMATED WAFER DEBONDING SYSTEM AND METHOD THEREOF
- Publication number 20230282494
- Publication date Sep 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Fei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRIM FREE WAFER BONDING METHODS AND DEVICES
- Publication number 20230142902
- Publication date May 11, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shi Ning JU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO LED DISPLAY PANEL
- Publication number 20230112423
- Publication date Apr 13, 2023
- PlayNitride Display Co., Ltd.
- Shiang-Ning YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL
- Publication number 20230112531
- Publication date Apr 13, 2023
- AU OPTRONICS CORPORATION
- Yang-En Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH THROUGH DIE ATTACH FILM CONNECTIONS
- Publication number 20230087367
- Publication date Mar 23, 2023
- Intel Corporation
- Xiaoxuan Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MECHANICAL WAFER ALIGNMENT DETECTION FOR BONDING PROCESS
- Publication number 20230066893
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Hung Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder Ball Application for Singular Die
- Publication number 20230055518
- Publication date Feb 23, 2023
- Global Circuit Innovations Inc.
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Removal Head, Chip Removal System and Chip Removal Method
- Publication number 20230053040
- Publication date Feb 16, 2023
- CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD.
- Bin WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION BETWEEN CHIPS BY BRIDGE CHIP
- Publication number 20230051337
- Publication date Feb 16, 2023
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE FOR REMOVING MISASSEMBLED SEMICONDUCTOR LIGHT-EMITTING ELEME...
- Publication number 20220406748
- Publication date Dec 22, 2022
- LG ELECTRONICS INC.
- Juchan CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING ELECTRIC DEVICE
- Publication number 20220384674
- Publication date Dec 1, 2022
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Jiho JOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE
- Publication number 20220367758
- Publication date Nov 17, 2022
- AU OPTRONICS CORPORATION
- Chia-Hui Pai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEATING DEVICE
- Publication number 20220347779
- Publication date Nov 3, 2022
- CONTINENTAL AUTOMOTIVE FRANCE
- Cédric Benaben
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Methods for disconnecting semiconductor or solid-state bodies

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Interconnection between chips by bridge chip

Systems and methods related to wire bond cleaning and wire bonding...

Display device

Light emitting diode

Substrate debonding from bonded part

Display panel and preparation method thereof

Method for transferring missing semiconductor chips using an adhesi...

Advanced device assembly structures and methods

Method and apparatus for debonding temporarily bonded wafers in waf...

Solder ball application for singular die

Electronic device and manufacturing method of electronic device

Semiconductor device manufacturing method

Reclaimable semiconductor device package and associated systems and...

Interconnection between chips by bridge chip

Heated pins to couple with solder elements

Manufacturing apparatus, operation method thereof, and method for m...

DBI to SI bonding for simplified handle wafer

Method for testing semiconductor elements

Solder removal from semiconductor devices

Method for manufacturing a handle substrate intended for temporary...

Reusable wide bandgap semiconductor substrate

Mechanical wafer alignment detection for bonding process

Fully automated wafer debonding system and method thereof

Methods and apparatuses for removal of wires from packaging substrates

Solder ball application for singular die

Mounting method and mounting device

Chip removing device and chip removing method

Pressure-activated electrical interconnection with additive repair

Pressure-activated electrical interconnection with additive repair

Method of dismantling a stack of at least three substrates

Patents Applicationslast 30 patents

DISPLAY DEVICE

INTEGRATED-CIRCUIT MODULE COLLECTION AND DEPOSITION

MICROLED DEFECT MANAGEMENT

COMPENSATION METHOD FOR WAFER BONDING

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...

METHOD AND APPARATUS FOR DEBONDING TEMPORARILY BONDED WAFERS IN WAF...

METHOD AND APPARATUS FOR DEBONDING TEMPORARILY BONDED WAFERS IN WAF...

DBI TO SI BONDING FOR SIMPLIFIED HANDLE WAFER

DEBONDING REPAIR DEVICES

SUBSTRATE DEBONDING FROM BONDED PART

DBI TO SI BONDING FOR SIMPLIFIED HANDLE WAFER

METHOD AND APPARATUS FOR TRIMMING MICRO ELECTRONIC ELEMENT

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

REMOVAL OF WIRES FROM PACKAGING SUBSTRATES

REWORKABLE INTER-SUBSTRATE BOND STRUCTURE

INTERCONNECTION BETWEEN CHIPS BY BRIDGE CHIP

MECHANICAL WAFER ALIGNMENT DETECTION FOR BONDING PROCESS

FULLY AUTOMATED WAFER DEBONDING SYSTEM AND METHOD THEREOF

TRIM FREE WAFER BONDING METHODS AND DEVICES

MICRO LED DISPLAY PANEL

DISPLAY PANEL

MICROELECTRONIC ASSEMBLIES WITH THROUGH DIE ATTACH FILM CONNECTIONS

MECHANICAL WAFER ALIGNMENT DETECTION FOR BONDING PROCESS

Solder Ball Application for Singular Die

Chip Removal Head, Chip Removal System and Chip Removal Method

INTERCONNECTION BETWEEN CHIPS BY BRIDGE CHIP

MODULE FOR REMOVING MISASSEMBLED SEMICONDUCTOR LIGHT-EMITTING ELEME...

METHOD OF MANUFACTURING ELECTRIC DEVICE

LIGHT EMITTING DIODE

HEATING DEVICE