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Methods for disconnecting semiconductor or solid-state bodies
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ELECTRICITY
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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
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Methods for disconnecting semiconductor or solid-state bodies
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Patents Grants
last 30 patents
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Patent Grant
Solder ball application for singular die
Patent number
11,978,711
Issue date
May 7, 2024
Global Circuit Innovations Incorporated
Erick Merle Spory
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device and manufacturing method of electronic device
Patent number
11,948,908
Issue date
Apr 2, 2024
Japan Display Inc.
Kazuyuki Yamada
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device manufacturing method
Patent number
11,887,975
Issue date
Jan 30, 2024
Daicel Corporation
Naoko Tsuji
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Reclaimable semiconductor device package and associated systems and...
Patent number
11,854,635
Issue date
Dec 26, 2023
Micron Technology, Inc.
Yueping Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interconnection between chips by bridge chip
Patent number
11,848,272
Issue date
Dec 19, 2023
International Business Machines Corporation
Akihiro Horibe
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Heated pins to couple with solder elements
Patent number
11,830,846
Issue date
Nov 28, 2023
Intel Corporation
Feroz Mohammad
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Manufacturing apparatus, operation method thereof, and method for m...
Patent number
11,791,305
Issue date
Oct 17, 2023
Kioxia Corporation
Sho Kawadahara
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
DBI to SI bonding for simplified handle wafer
Patent number
11,791,307
Issue date
Oct 17, 2023
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Chandrasekhar Mandalapu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for testing semiconductor elements
Patent number
11,756,841
Issue date
Sep 12, 2023
UPPER ELEC. CO., LTD.
Shih Hung Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solder removal from semiconductor devices
Patent number
11,745,281
Issue date
Sep 5, 2023
Micron Technology, Inc.
Mark E. Tuttle
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for manufacturing a handle substrate intended for temporary...
Patent number
11,710,653
Issue date
Jul 25, 2023
Commissariat a l'Energie Atomique et Aux Energies Alternatives
Pierre Montmeat
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Reusable wide bandgap semiconductor substrate
Patent number
11,710,662
Issue date
Jul 25, 2023
United Silicon Carbide, Inc.
Anup Bhalla
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Mechanical wafer alignment detection for bonding process
Patent number
11,688,717
Issue date
Jun 27, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Ching-Hung Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fully automated wafer debonding system and method thereof
Patent number
11,670,524
Issue date
Jun 6, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Cheng-Fei Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods and apparatuses for removal of wires from packaging substrates
Patent number
11,616,045
Issue date
Mar 28, 2023
Skyworks Solutions, Inc.
Cesar Melendrez
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solder ball application for singular die
Patent number
11,508,680
Issue date
Nov 22, 2022
Global Circuit Innovations Inc.
Erick Merle Spory
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Mounting method and mounting device
Patent number
11,495,571
Issue date
Nov 8, 2022
Toray Engineering Co., Ltd.
Yoshiyuki Arai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip removing device and chip removing method
Patent number
11,490,551
Issue date
Nov 1, 2022
ASTI GLOBAL INC., TAIWAN
Chien-Shou Liao
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Pressure-activated electrical interconnection with additive repair
Patent number
11,393,730
Issue date
Jul 19, 2022
X Display Company Technology Limited
Ronald S. Cok
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Pressure-activated electrical interconnection with additive repair
Patent number
11,387,153
Issue date
Jul 12, 2022
X Display Company Technology Limited
Ronald S. Cok
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of dismantling a stack of at least three substrates
Patent number
11,335,584
Issue date
May 17, 2022
Commissariat a l'Energie Atomique et Aux Energies Alternatives
Pierre Montmeat
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Temporary bonding scheme
Patent number
11,328,972
Issue date
May 10, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Wan-Yu Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Device and method for reworking flip chip components
Patent number
11,330,746
Issue date
May 10, 2022
Raytheon Company
James A. Robbins
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wire bond cleaning method and wire bonding recovery process
Patent number
11,302,669
Issue date
Apr 12, 2022
Skyworks Solutions, Inc.
Aldrin Quinones Garing
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Workpiece-separating device and workpiece-separating method
Patent number
11,251,058
Issue date
Feb 15, 2022
Shin-Etsu Engineering Co., Ltd.
Kyouhei Tomioka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High speed handling of ultra-small chips by selective laser bonding...
Patent number
11,222,862
Issue date
Jan 11, 2022
International Business Machines Corporation
Qianwen Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of separating bonded substrate, method of manufacturing semi...
Patent number
11,152,329
Issue date
Oct 19, 2021
TOSHIBA MEMORY CORPORATION
Eiichi Soda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Modular voltage regulators
Patent number
11,152,332
Issue date
Oct 19, 2021
Taiwan Semiconductor Manufacturing Co., Ltd.
Nick Samra
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for bonding a semiconductor substrate to a carrier
Patent number
11,127,595
Issue date
Sep 21, 2021
Microsoft Technology Licensing, LLC
Geoffrey C. Gardner
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated fan-out package including voltage regulators and methods...
Patent number
11,063,016
Issue date
Jul 13, 2021
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
METHOD AND APPARATUS FOR TRIMMING MICRO ELECTRONIC ELEMENT
Publication number
20240071992
Publication date
Feb 29, 2024
PlayNitride Display Co., Ltd.
Yen-Mu Chen
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20230411344
Publication date
Dec 21, 2023
KIOXIA Corporation
Hiroaki ASHIDATE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
REMOVAL OF WIRES FROM PACKAGING SUBSTRATES
Publication number
20230378127
Publication date
Nov 23, 2023
Skyworks Solutions, Inc.
Cesar MELENDREZ MURILLO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
REWORKABLE INTER-SUBSTRATE BOND STRUCTURE
Publication number
20230378126
Publication date
Nov 23, 2023
The Boeing Company
Peter D. Brewer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERCONNECTION BETWEEN CHIPS BY BRIDGE CHIP
Publication number
20230343713
Publication date
Oct 26, 2023
International Business Machines Corporation
Akihiro Horibe
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MECHANICAL WAFER ALIGNMENT DETECTION FOR BONDING PROCESS
Publication number
20230282612
Publication date
Sep 7, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Ching-Hung Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FULLY AUTOMATED WAFER DEBONDING SYSTEM AND METHOD THEREOF
Publication number
20230282494
Publication date
Sep 7, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Cheng-Fei Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TRIM FREE WAFER BONDING METHODS AND DEVICES
Publication number
20230142902
Publication date
May 11, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Shi Ning JU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICRO LED DISPLAY PANEL
Publication number
20230112423
Publication date
Apr 13, 2023
PlayNitride Display Co., Ltd.
Shiang-Ning YANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DISPLAY PANEL
Publication number
20230112531
Publication date
Apr 13, 2023
AU OPTRONICS CORPORATION
Yang-En Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC ASSEMBLIES WITH THROUGH DIE ATTACH FILM CONNECTIONS
Publication number
20230087367
Publication date
Mar 23, 2023
Intel Corporation
Xiaoxuan Sun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MECHANICAL WAFER ALIGNMENT DETECTION FOR BONDING PROCESS
Publication number
20230066893
Publication date
Mar 2, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Ching-Hung Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Solder Ball Application for Singular Die
Publication number
20230055518
Publication date
Feb 23, 2023
Global Circuit Innovations Inc.
Erick Merle Spory
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Chip Removal Head, Chip Removal System and Chip Removal Method
Publication number
20230053040
Publication date
Feb 16, 2023
CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD.
Bin WANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERCONNECTION BETWEEN CHIPS BY BRIDGE CHIP
Publication number
20230051337
Publication date
Feb 16, 2023
International Business Machines Corporation
Akihiro Horibe
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MODULE FOR REMOVING MISASSEMBLED SEMICONDUCTOR LIGHT-EMITTING ELEME...
Publication number
20220406748
Publication date
Dec 22, 2022
LG ELECTRONICS INC.
Juchan CHOI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING ELECTRIC DEVICE
Publication number
20220384674
Publication date
Dec 1, 2022
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
Jiho JOO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LIGHT EMITTING DIODE
Publication number
20220367758
Publication date
Nov 17, 2022
AU OPTRONICS CORPORATION
Chia-Hui Pai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HEATING DEVICE
Publication number
20220347779
Publication date
Nov 3, 2022
CONTINENTAL AUTOMOTIVE FRANCE
Cédric Benaben
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SYSTEMS AND METHODS RELATED TO WIRE BOND CLEANING AND WIRE BONDING...
Publication number
20220336413
Publication date
Oct 20, 2022
Skyworks Solutions, Inc.
Aldrin Quinones GARING
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFACTURING APPARATUS, OPERATION METHOD THEREOF, AND METHOD FOR M...
Publication number
20220262764
Publication date
Aug 18, 2022
KIOXIA Corporation
Sho KAWADAHARA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR TESTING SEMICONDUCTOR ELEMENTS
Publication number
20220189834
Publication date
Jun 16, 2022
Upper ELEC. CO., LTD.
Shih Hung Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD AND APPARATUS FOR DEBONDING TEMPORARILY BONDED WAFERS IN WAF...
Publication number
20220189908
Publication date
Jun 16, 2022
NCC NANO, LLC
VAHID AKHAVAN ATTAR
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Solder Ball Application for Singular Die
Publication number
20220157749
Publication date
May 19, 2022
Global Circuit Innovations Inc.
Erick Merle Spory
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Advanced Device Assembly Structures And Methods
Publication number
20220097166
Publication date
Mar 31, 2022
Invensas Corporation
Cyprian Emeka Uzoh
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
ADHESIVE COMPOSITION FOR OPTICAL IRRADIATION PEELING, LAMINATE BODY...
Publication number
20220073801
Publication date
Mar 10, 2022
NISSAN CHEMICAL CORPORATION
Hiroshi OGINO
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
DISPLAY PANEL AND PREPARATION METHOD THEREOF
Publication number
20220068899
Publication date
Mar 3, 2022
Boe Technology Group Co., Ltd.
Zhijun LV
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING A HANDLE SUBSTRATE INTENDED FOR TEMPORARY...
Publication number
20220068692
Publication date
Mar 3, 2022
Commissariat A L'Energie Atomique et Aux Energies Alternatives
Pierre MONTMEAT
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WORKPIECE-SEPARATING DEVICE AND WORKPIECE-SEPARATING METHOD
Publication number
20220068676
Publication date
Mar 3, 2022
SHIN-ETSU ENGINEERING CO., LTD
Kyouhei TOMIOKA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE PRODUCTION METHOD AND LAMINATE FILM FOR TEMPOR...
Publication number
20220028722
Publication date
Jan 27, 2022
Showa Denko Materials Co., Ltd.
Emi MIYAZAWA
H01 - BASIC ELECTRIC ELEMENTS