Methods for disconnecting semiconductor or solid-state bodies

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H01L2224/98

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/98Methods for disconnecting semiconductor or solid-state bodies

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Light emitting diode
- Patent number 12,057,527
- Issue date Aug 6, 2024
- Au Optronics Corporation
- Chia-Hui Pai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate debonding from bonded part
- Patent number 12,040,311
- Issue date Jul 16, 2024
- The Boeing Company
- Peter D. Brewer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder ball application for singular die
- Patent number 11,978,711
- Issue date May 7, 2024
- Global Circuit Innovations Incorporated
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing apparatus, operation method thereof, and method for m...
- Patent number 11,791,305
- Issue date Oct 17, 2023
- Kioxia Corporation
- Sho Kawadahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for testing semiconductor elements
- Patent number 11,756,841
- Issue date Sep 12, 2023
- UPPER ELEC. CO., LTD.
- Shih Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor package
- Patent number 11,756,926
- Issue date Sep 12, 2023
- Advanced Semiconductor Engineering, Inc.
- Shun Sing Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder removal from semiconductor devices
- Patent number 11,745,281
- Issue date Sep 5, 2023
- Micron Technology, Inc.
- Mark E. Tuttle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of transferring micro light emitting diodes and display panel
- Patent number 11,552,058
- Issue date Jan 10, 2023
- Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Yong Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder ball application for singular die
- Patent number 11,508,680
- Issue date Nov 22, 2022
- Global Circuit Innovations Inc.
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor package
- Patent number 11,387,213
- Issue date Jul 12, 2022
- Advanced Semiconductor Engineering, Inc.
- Shun Sing Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor package
- Patent number 11,342,304
- Issue date May 24, 2022
- Advanced Semiconductor Engineering, Inc.
- Shun Sing Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for reworking flip chip components
- Patent number 11,330,746
- Issue date May 10, 2022
- Raytheon Company
- James A. Robbins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Workpiece-separating device and workpiece-separating method
- Patent number 11,251,058
- Issue date Feb 15, 2022
- Shin-Etsu Engineering Co., Ltd.
- Kyouhei Tomioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High speed handling of ultra-small chips by selective laser bonding...
- Patent number 11,222,862
- Issue date Jan 11, 2022
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a winding core
- Patent number 11,050,329
- Issue date Jun 29, 2021
- Murata Manufacturing Co., Ltd.
- Eiji Yamauchi
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Solder removal from semiconductor devices
- Patent number 11,020,811
- Issue date Jun 1, 2021
- Micron Technology, Inc.
- Mark E. Tuttle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for the bonding and debonding of substrates
- Patent number 11,024,530
- Issue date Jun 1, 2021
- EV Group E. Thallner GmbH
- Jurgen Burggraf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Floating die package
- Patent number 10,861,796
- Issue date Dec 8, 2020
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gallium liquid metal embrittlement for device rework
- Patent number 10,679,966
- Issue date Jun 9, 2020
- International Business Machines Corporation
- David Danovitch
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Gallium liquid metal embrittlement for device rework
- Patent number 10,559,549
- Issue date Feb 11, 2020
- International Business Machines Corporation
- David Danovitch
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and device for severing a microchip from a wafer and arrangi...
- Patent number 10,497,589
- Issue date Dec 3, 2019
- Jenoptik Optical Systems GmbH
- Meik Panitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High speed handling of ultra-small chips by selective laser bonding...
- Patent number 10,490,525
- Issue date Nov 26, 2019
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for the bonding and debonding of substrates
- Patent number 10,468,286
- Issue date Nov 5, 2019
- EV Group E. Thallner GmbH
- Jurgen Burggraf
- B32 - LAYERED PRODUCTS
Information Patent Grant
Transfer printed device repair
- Patent number 10,438,859
- Issue date Oct 8, 2019
- X-CELEPRINT LIMITED
- Ronald S. Cok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiresaw removal of microelectronics from printed circuit board
- Patent number 10,403,595
- Issue date Sep 3, 2019
- United States of America, as represented by the Secretary of the Navy
- Joel T. Harrison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for polymer-assisted chip transfer
- Patent number 10,388,516
- Issue date Aug 20, 2019
- Facebook Technologies, LLC
- Oscar Torrents Abad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder removal from semiconductor devices
- Patent number 10,307,850
- Issue date Jun 4, 2019
- Micron Technology, Inc.
- Mark E. Tuttle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for remapping a packaged extracted die
- Patent number 10,177,054
- Issue date Jan 8, 2019
- Global Circuit Innovations, Inc.
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Repairing method, manufacturing method, device and electronics appa...
- Patent number 10,170,665
- Issue date Jan 1, 2019
- GoerTek Inc.
- Quanbo Zou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for bonding substrates
- Patent number 10,131,126
- Issue date Nov 20, 2018
- Applied Materials, Inc.
- Kadthala Ramaya Narendrnath
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED-CIRCUIT MODULE COLLECTION AND DEPOSITION
- Publication number 20240347367
- Publication date Oct 17, 2024
- X-CELEPRINT LIMITED
- Ronald S. Cok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROLED DEFECT MANAGEMENT
- Publication number 20240347398
- Publication date Oct 17, 2024
- VueReal Inc.
- Gholamreza CHAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPENSATION METHOD FOR WAFER BONDING
- Publication number 20240332246
- Publication date Oct 3, 2024
- Macronix International Co., Ltd.
- Tien Chu YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...
- Publication number 20240332250
- Publication date Oct 3, 2024
- STMicroelectronics International N.V.
- Antonio BELLIZZI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE DEBONDING FROM BONDED PART
- Publication number 20240213214
- Publication date Jun 27, 2024
- The Boeing Company
- Peter D. Brewer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR TRIMMING MICRO ELECTRONIC ELEMENT
- Publication number 20240071992
- Publication date Feb 29, 2024
- PlayNitride Display Co., Ltd.
- Yen-Mu Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230411344
- Publication date Dec 21, 2023
- KIOXIA Corporation
- Hiroaki ASHIDATE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO LED DISPLAY PANEL
- Publication number 20230112423
- Publication date Apr 13, 2023
- PlayNitride Display Co., Ltd.
- Shiang-Ning YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL
- Publication number 20230112531
- Publication date Apr 13, 2023
- AU OPTRONICS CORPORATION
- Yang-En Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder Ball Application for Singular Die
- Publication number 20230055518
- Publication date Feb 23, 2023
- Global Circuit Innovations Inc.
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE
- Publication number 20220367758
- Publication date Nov 17, 2022
- AU OPTRONICS CORPORATION
- Chia-Hui Pai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE
- Publication number 20220285313
- Publication date Sep 8, 2022
- Advanced Semiconductor Engineering, Inc.
- Shun Sing LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING APPARATUS, OPERATION METHOD THEREOF, AND METHOD FOR M...
- Publication number 20220262764
- Publication date Aug 18, 2022
- KIOXIA Corporation
- Sho KAWADAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF TRANSFERRING MICRO LIGHT EMITTING DIODES AND DISPLAY PANEL
- Publication number 20220216187
- Publication date Jul 7, 2022
- Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Yong FAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR TESTING SEMICONDUCTOR ELEMENTS
- Publication number 20220189834
- Publication date Jun 16, 2022
- Upper ELEC. CO., LTD.
- Shih Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder Ball Application for Singular Die
- Publication number 20220157749
- Publication date May 19, 2022
- Global Circuit Innovations Inc.
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WORKPIECE-SEPARATING DEVICE AND WORKPIECE-SEPARATING METHOD
- Publication number 20220068676
- Publication date Mar 3, 2022
- SHIN-ETSU ENGINEERING CO., LTD
- Kyouhei TOMIOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PRODUCTION METHOD AND LAMINATE FILM FOR TEMPOR...
- Publication number 20220028722
- Publication date Jan 27, 2022
- Showa Denko Materials Co., Ltd.
- Emi MIYAZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE
- Publication number 20210384157
- Publication date Dec 9, 2021
- Advanced Semiconductor Engineering, Inc.
- Shun Sing LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER REMOVAL FROM SEMICONDUCTOR DEVICES
- Publication number 20210252621
- Publication date Aug 19, 2021
- Micron Technology, Inc.
- Mark E. Tuttle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLOATING DIE PACKAGE
- Publication number 20210091012
- Publication date Mar 25, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Speed Handling of Ultra-Small Chips by Selective Laser Bonding...
- Publication number 20200051948
- Publication date Feb 13, 2020
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Speed Handling of Ultra-Small Chips by Selective Laser Bonding...
- Publication number 20190348392
- Publication date Nov 14, 2019
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER REMOVAL FROM SEMICONDUCTOR DEVICES
- Publication number 20190061034
- Publication date Feb 28, 2019
- Micron Technology, Inc.
- Mark E. Tuttle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DECOUPLING SYSTEMS AND METHODS FOR SAME
- Publication number 20180286832
- Publication date Oct 4, 2018
- Intel Corporation
- Bassam M. Ziadeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR THE BONDING AND DEBONDING OF SUBSTRATES
- Publication number 20180233394
- Publication date Aug 16, 2018
- EV GROUP E. THALLNER GMBH
- Jurgen Burggraf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GALLIUM LIQUID METAL EMBRITTLEMENT FOR DEVICE REWORK
- Publication number 20180233482
- Publication date Aug 16, 2018
- International Business Machines Corporation
- David Danovitch
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
GALLIUM LIQUID METAL EMBRITTLEMENT FOR DEVICE REWORK
- Publication number 20180233483
- Publication date Aug 16, 2018
- International Business Machines Corporation
- David Danovitch
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
TRANSFER PRINTED DEVICE REPAIR
- Publication number 20180174932
- Publication date Jun 21, 2018
- X-Celeprint Limited
- Ronald S. Cok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BULK SOLDER REMOVAL ON PROCESSOR PACKAGING
- Publication number 20170179066
- Publication date Jun 22, 2017
- Russell S. Aoki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Methods for disconnecting semiconductor or solid-state bodies

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Light emitting diode

Substrate debonding from bonded part

Solder ball application for singular die

Manufacturing apparatus, operation method thereof, and method for m...

Method for testing semiconductor elements

Method for manufacturing a semiconductor package

Solder removal from semiconductor devices

Method of transferring micro light emitting diodes and display panel

Solder ball application for singular die

Method for manufacturing a semiconductor package

Method for manufacturing a semiconductor package

Device and method for reworking flip chip components

Workpiece-separating device and workpiece-separating method

High speed handling of ultra-small chips by selective laser bonding...

Method for manufacturing a winding core

Solder removal from semiconductor devices

Method for the bonding and debonding of substrates

Floating die package

Gallium liquid metal embrittlement for device rework

Gallium liquid metal embrittlement for device rework

Method and device for severing a microchip from a wafer and arrangi...

High speed handling of ultra-small chips by selective laser bonding...

Method for the bonding and debonding of substrates

Transfer printed device repair

Wiresaw removal of microelectronics from printed circuit board

Method for polymer-assisted chip transfer

Solder removal from semiconductor devices

Method for remapping a packaged extracted die

Repairing method, manufacturing method, device and electronics appa...

Methods for bonding substrates

Patents Applicationslast 30 patents

INTEGRATED-CIRCUIT MODULE COLLECTION AND DEPOSITION

MICROLED DEFECT MANAGEMENT

COMPENSATION METHOD FOR WAFER BONDING

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...

SUBSTRATE DEBONDING FROM BONDED PART

METHOD AND APPARATUS FOR TRIMMING MICRO ELECTRONIC ELEMENT

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

MICRO LED DISPLAY PANEL

DISPLAY PANEL

Solder Ball Application for Singular Die

LIGHT EMITTING DIODE

METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE

MANUFACTURING APPARATUS, OPERATION METHOD THEREOF, AND METHOD FOR M...

METHOD OF TRANSFERRING MICRO LIGHT EMITTING DIODES AND DISPLAY PANEL

METHOD FOR TESTING SEMICONDUCTOR ELEMENTS

Solder Ball Application for Singular Die

WORKPIECE-SEPARATING DEVICE AND WORKPIECE-SEPARATING METHOD

SEMICONDUCTOR DEVICE PRODUCTION METHOD AND LAMINATE FILM FOR TEMPOR...

METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE

SOLDER REMOVAL FROM SEMICONDUCTOR DEVICES

FLOATING DIE PACKAGE

High Speed Handling of Ultra-Small Chips by Selective Laser Bonding...

High Speed Handling of Ultra-Small Chips by Selective Laser Bonding...

SOLDER REMOVAL FROM SEMICONDUCTOR DEVICES

DECOUPLING SYSTEMS AND METHODS FOR SAME

METHOD FOR THE BONDING AND DEBONDING OF SUBSTRATES

GALLIUM LIQUID METAL EMBRITTLEMENT FOR DEVICE REWORK

GALLIUM LIQUID METAL EMBRITTLEMENT FOR DEVICE REWORK

TRANSFER PRINTED DEVICE REPAIR

BULK SOLDER REMOVAL ON PROCESSOR PACKAGING