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H01L2224/3015

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor die, a semiconductor die stack, and a semiconductor m...
- Patent number 12,046,573
- Issue date Jul 23, 2024
- SK hynix Inc.
- Jin Woong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel, preparation method thereof, and display device
- Patent number 12,033,974
- Issue date Jul 9, 2024
- Shanghai Tianma Micro-Electronics Co,. Ltd.
- Quanpeng Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and formation method of chip package with protective lid
- Patent number 11,978,715
- Issue date May 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Meng-Tsung Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical mechanical polishing for hybrid bonding
- Patent number 11,552,041
- Issue date Jan 10, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical mechanical polishing for hybrid bonding
- Patent number 10,840,205
- Issue date Nov 17, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-stage cure bare die light emitting diode
- Patent number 10,795,452
- Issue date Oct 6, 2020
- Microsoft Technology Licensing, LLC
- Benjamin Patrick Sullivan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Light emitting device package, backlight unit, illumination apparat...
- Patent number 10,074,788
- Issue date Sep 11, 2018
- LUMENS CO., LTD.
- Seung-Hyun Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods for solder flow control in three-dimensional mi...
- Patent number 10,076,042
- Issue date Sep 11, 2018
- NUVOTRONICS, INC.
- David W. Sherrer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for coating conductive substrate with adhesive
- Patent number 10,056,534
- Issue date Aug 21, 2018
- G-SMATT CO., LTD.
- Hak Ryul Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly of an integrated circuit chip and of a plate
- Patent number 9,941,188
- Issue date Apr 10, 2018
- STMicroelectronics (Crolles 2) SAS
- Louis-Michel Collin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device package, backlight unit, illumination apparat...
- Patent number 9,831,407
- Issue date Nov 28, 2017
- LUMENS CO., LTD.
- Seung-Hyun Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip assembled on an interposer
- Patent number 9,780,015
- Issue date Oct 3, 2017
- STMicroelectronics S.A.
- Pierre Bar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing a semiconductor device
- Patent number 9,653,623
- Issue date May 16, 2017
- Samsung Electronics Co., Ltd.
- Yi-Koan Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component mounting method
- Patent number 9,609,760
- Issue date Mar 28, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Tsubasa Saeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods for solder flow control in three-dimensional mi...
- Patent number 9,505,613
- Issue date Nov 29, 2016
- NUVOTRONICS, INC.
- David W. Sherrer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
III-Nitride device with solderable front metal
- Patent number 9,312,375
- Issue date Apr 12, 2016
- Infineon Technologies Americas Corp.
- Chuan Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure and manufacturing method thereof
- Patent number 9,054,114
- Issue date Jun 9, 2015
- Xintec Inc.
- Hung-Jen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods for solder flow control in three-dimensional mi...
- Patent number 8,866,300
- Issue date Oct 21, 2014
- Nuvotronics, LLC
- David W. Sherrer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Power device with solderable front metal
- Patent number 8,853,744
- Issue date Oct 7, 2014
- International Rectifier Corporation
- Chuan Cheah
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Chip package structure and manufacturing method thereof
- Patent number 8,779,558
- Issue date Jul 15, 2014
- Hung-Jen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate with bond fingers
- Patent number 8,766,461
- Issue date Jul 1, 2014
- Texas Instruments Incorporated
- Raymond Partosa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure and manufacturing method thereof
- Patent number 8,673,686
- Issue date Mar 18, 2014
- Hung-Jen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting structure of semiconductor package component and manufactu...
- Patent number 8,664,773
- Issue date Mar 4, 2014
- Panasonic Corporation
- Atsushi Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of mounting part of semiconductor light emitti...
- Patent number 8,609,444
- Issue date Dec 17, 2013
- Toyoda Gosei Co., Ltd.
- Satoshi Wada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with heat dissipation
- Patent number 8,581,390
- Issue date Nov 12, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Edward O. Travis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component arrangement and method for production thereof
- Patent number 8,564,969
- Issue date Oct 22, 2013
- Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
- Hans-Hermann Oppermann
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Power device with bottom source electrode
- Patent number 8,564,110
- Issue date Oct 22, 2013
- Alpha & Omega Semiconductor, Inc.
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip, and semiconductor package and system each inclu...
- Patent number 8,519,470
- Issue date Aug 27, 2013
- Samsung Electronics Co., Ltd.
- Sun-won Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component mounting structure
- Patent number 8,497,432
- Issue date Jul 30, 2013
- Seiko Epson Corporation
- Nobuaki Hashimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnect structure comprising blind vias intended to be metalized
- Patent number 8,482,130
- Issue date Jul 9, 2013
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Damien Saint-Patrice
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING
- Publication number 20240379607
- Publication date Nov 14, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE, A SEMICONDUCTOR DIE STACK, A SEMICONDUCTOR MODUL...
- Publication number 20240332241
- Publication date Oct 3, 2024
- SK HYNIX INC.
- Jin Woong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH PROTECTIVE LID
- Publication number 20240250055
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tsung KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGING METHOD AND SENSOR PACKAGE
- Publication number 20240222308
- Publication date Jul 4, 2024
- PIXART IMAGING Inc.
- SAI-MUN LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240055385
- Publication date Feb 15, 2024
- WISTRON NEWEB CORPORATION
- KUO-HUA HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING
- Publication number 20230268308
- Publication date Aug 24, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE, A SEMICONDUCTOR DIE STACK, A SEMICONDUCTOR MODUL...
- Publication number 20230139612
- Publication date May 4, 2023
- SK HYNIX INC.
- Jin Woong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF CHIP PACKAGE WITH PROTECTIVE LID
- Publication number 20220278069
- Publication date Sep 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tsung KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL, PREPARATION METHOD THEREOF, AND DISPLAY DEVICE
- Publication number 20220052022
- Publication date Feb 17, 2022
- SHANGHAI TIANMA MICRO-ELECTRONICS CO., LTD.
- Quanpeng YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING
- Publication number 20210066233
- Publication date Mar 4, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Gaius Gillman FOUNTAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING
- Publication number 20190096842
- Publication date Mar 28, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Gaius Gillman FOUNTAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE PACKAGE, BACKLIGHT UNIT, ILLUMINATION APPARAT...
- Publication number 20180047884
- Publication date Feb 15, 2018
- LUMENS CO., LTD
- Seung-Hyun OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY OF AN INTEGRATED CIRCUIT CHIP AND OF A PLATE
- Publication number 20170133297
- Publication date May 11, 2017
- STMicroelectronics (Crolles 2) SAS
- Louis-Michel Collin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR COATING CONDUCTIVE SUBSTRATE WITH ADHESIVE
- Publication number 20160284958
- Publication date Sep 29, 2016
- G-SMATT CO., LTD.
- Hak Ryul SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP AND CHIP ARRANGEMENT
- Publication number 20140306331
- Publication date Oct 16, 2014
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIVERSAL NANOPATTERNABLE INTERFACIAL BONDING
- Publication number 20140283982
- Publication date Sep 25, 2014
- Tingrui Pan
- B32 - LAYERED PRODUCTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20140264771
- Publication date Sep 18, 2014
- Xintec Inc.
- Hung-Jen LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAKING A FLIP-CHIP ASSEMBLY WITH BOND FINGERS
- Publication number 20140248746
- Publication date Sep 4, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Raymond Maldan Partosa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE WITH BOND FINGERS
- Publication number 20140197534
- Publication date Jul 17, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Raymond Maldan Partosa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MOUNTING METHOD, ELECTRONIC COMPONENT PLACEMEN...
- Publication number 20140096379
- Publication date Apr 10, 2014
- PANASONIC CORPORATION
- Tsubasa Saeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH HEAT DISSIPATION
- Publication number 20130264698
- Publication date Oct 10, 2013
- Edward O. Travis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Device with Solderable Front Metal
- Publication number 20130207120
- Publication date Aug 15, 2013
- INTERNATIONAL RECTIFIER CORPORATION
- Chuan Cheah
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20130207240
- Publication date Aug 15, 2013
- Xintec Inc.
- Hung-Jen LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20120313222
- Publication date Dec 13, 2012
- Hung-Jen LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20120313261
- Publication date Dec 13, 2012
- Hung-Jen LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING STRUCTURE OF SEMICONDUCTOR PACKAGE COMPONENT AND MANUFACTU...
- Publication number 20120299202
- Publication date Nov 29, 2012
- PANASONIC CORPORATION
- Atsushi YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND METHOD FOR FABRICATING THE SAME
- Publication number 20120273940
- Publication date Nov 1, 2012
- Hynix Semiconductor Inc.
- Seung Hee JO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DEVICE WITH BOTTOM SOURCE ELECTRODE AND PREPARATION METHOD
- Publication number 20120235289
- Publication date Sep 20, 2012
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component arrangement and method for production thereof
- Publication number 20120039056
- Publication date Feb 16, 2012
- Hans-Hermann Oppermann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP, AND SEMICONDUCTOR PACKAGE AND SYSTEM EACH INCLU...
- Publication number 20110283034
- Publication date Nov 17, 2011
- Samsung Electronics Co., Ltd.
- Sun-won KANG
- H01 - BASIC ELECTRIC ELEMENTS

Mirror array

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor die, a semiconductor die stack, and a semiconductor m...

Display panel, preparation method thereof, and display device

Structure and formation method of chip package with protective lid

Chemical mechanical polishing for hybrid bonding

Chemical mechanical polishing for hybrid bonding

Multi-stage cure bare die light emitting diode

Light emitting device package, backlight unit, illumination apparat...

Devices and methods for solder flow control in three-dimensional mi...

Method for coating conductive substrate with adhesive

Assembly of an integrated circuit chip and of a plate

Light emitting device package, backlight unit, illumination apparat...

Integrated circuit chip assembled on an interposer

Methods of manufacturing a semiconductor device

Electronic component mounting method

Devices and methods for solder flow control in three-dimensional mi...

III-Nitride device with solderable front metal

Chip package structure and manufacturing method thereof

Devices and methods for solder flow control in three-dimensional mi...

Power device with solderable front metal

Chip package structure and manufacturing method thereof

Substrate with bond fingers

Chip package structure and manufacturing method thereof

Mounting structure of semiconductor package component and manufactu...

Manufacturing method of mounting part of semiconductor light emitti...

Semiconductor device with heat dissipation

Component arrangement and method for production thereof

Power device with bottom source electrode

Semiconductor chip, and semiconductor package and system each inclu...

Electronic component mounting structure

Interconnect structure comprising blind vias intended to be metalized

Patents Applicationslast 30 patents

CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING

SEMICONDUCTOR DIE, A SEMICONDUCTOR DIE STACK, A SEMICONDUCTOR MODUL...

PACKAGE STRUCTURE WITH PROTECTIVE LID

SENSOR PACKAGING METHOD AND SENSOR PACKAGE

PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING

SEMICONDUCTOR DIE, A SEMICONDUCTOR DIE STACK, A SEMICONDUCTOR MODUL...

STRUCTURE AND FORMATION METHOD OF CHIP PACKAGE WITH PROTECTIVE LID

DISPLAY PANEL, PREPARATION METHOD THEREOF, AND DISPLAY DEVICE

CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING

CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING

LIGHT EMITTING DEVICE PACKAGE, BACKLIGHT UNIT, ILLUMINATION APPARAT...

ASSEMBLY OF AN INTEGRATED CIRCUIT CHIP AND OF A PLATE

METHOD FOR COATING CONDUCTIVE SUBSTRATE WITH ADHESIVE

CHIP AND CHIP ARRANGEMENT

UNIVERSAL NANOPATTERNABLE INTERFACIAL BONDING

CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

MAKING A FLIP-CHIP ASSEMBLY WITH BOND FINGERS

SUBSTRATE WITH BOND FINGERS

ELECTRONIC COMPONENT MOUNTING METHOD, ELECTRONIC COMPONENT PLACEMEN...

SEMICONDUCTOR DEVICE WITH HEAT DISSIPATION

Power Device with Solderable Front Metal

CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

MOUNTING STRUCTURE OF SEMICONDUCTOR PACKAGE COMPONENT AND MANUFACTU...

SEMICONDUCTOR APPARATUS AND METHOD FOR FABRICATING THE SAME

POWER DEVICE WITH BOTTOM SOURCE ELECTRODE AND PREPARATION METHOD

Component arrangement and method for production thereof

SEMICONDUCTOR CHIP, AND SEMICONDUCTOR PACKAGE AND SYSTEM EACH INCLU...