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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/0915Mirror array

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor chip having chip pads of different surface areas, and...
- Patent number 11,682,643
- Issue date Jun 20, 2023
- SK hynix Inc.
- Ju Il Eom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 11,557,641
- Issue date Jan 17, 2023
- Samsung Display Co., Ltd.
- Byeong Beom Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded packaging module and manufacturing method for the same
- Patent number 11,552,039
- Issue date Jan 10, 2023
- Delta Electronics (Shanghai) Co., Ltd.
- Zengsheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack packages including a supporting substrate
- Patent number 11,152,335
- Issue date Oct 19, 2021
- SK hynix Inc.
- Seung Yeop Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor storage device and method of manufacturing the same
- Patent number 11,088,113
- Issue date Aug 10, 2021
- TOSHIBA MEMORY CORPORATION
- Kazutaka Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device including a sensor substrate and a logic...
- Patent number 10,978,505
- Issue date Apr 13, 2021
- Renesas Electronics Corporation
- Hidenori Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor package
- Patent number 10,790,270
- Issue date Sep 29, 2020
- Samsung Electronics Co., Ltd.
- Dong-ha Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor package
- Patent number 10,373,940
- Issue date Aug 6, 2019
- Samsung Electronics Co., Ltd.
- Dong-ha Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including die bond pads at a die edge
- Patent number 10,128,218
- Issue date Nov 13, 2018
- SanDisk Semiconductor (Shanghai) Co. Ltd.
- Junrong Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with periphery contact pads surrounding central c...
- Patent number 9,859,196
- Issue date Jan 2, 2018
- STMicroelectronics (Shenzhen) R&D Co., Ltd.
- Jing-En Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Segmented bond pads and methods of fabrication thereof
- Patent number 9,543,260
- Issue date Jan 10, 2017
- Infineon Technologies AG
- Albert Birner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with first and second contact pads and related me...
- Patent number 9,466,557
- Issue date Oct 11, 2016
- STMicroelectronics (Shenzhen) R&D Co. Ltd.
- Jing-En Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with first and second contact pads and related me...
- Patent number 9,287,227
- Issue date Mar 15, 2016
- STMicroelectronics (Shenzhen) R&D Co. Ltd.
- Jing-En Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Co-support for XFD packaging
- Patent number 9,123,555
- Issue date Sep 1, 2015
- Invensas Corporation
- Richard Dewitt Crisp
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240222331
- Publication date Jul 4, 2024
- Samsung Electronics Co., Ltd.
- JIN-WOO PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20230317657
- Publication date Oct 5, 2023
- Samsung Electronics Co., Ltd.
- Wonil SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYOUTS OF DATA PADS ON A SEMICONDUCTOR DIE
- Publication number 20230215828
- Publication date Jul 6, 2023
- Micron Technology, Inc.
- Andreas Kuesel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20230132272
- Publication date Apr 27, 2023
- Samsung Electronics Co., Ltd.
- JUN YOUNG OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20230044711
- Publication date Feb 9, 2023
- Fuji Electric Co., Ltd.
- Tomofumi OOSE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230005885
- Publication date Jan 5, 2023
- Samsung Electronics Co., Ltd.
- Hyemi Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP HAVING CHIP PADS OF DIFFERENT SURFACE AREAS, AND...
- Publication number 20220173061
- Publication date Jun 2, 2022
- SK HYNIX INC.
- Ju Il EOM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20210265446
- Publication date Aug 26, 2021
- SAMSUNG DISPLAY CO., LTD.
- Byeong Beom KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK PACKAGES INCLUDING A SUPPORTING SUBSTRATE
- Publication number 20200395340
- Publication date Dec 17, 2020
- SK HYNIX INC.
- Seung Yeop LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200303347
- Publication date Sep 24, 2020
- Toshiba Memory Corporation
- Kazutaka SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED PACKAGING MODULE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20200251438
- Publication date Aug 6, 2020
- DELTA ELECTRONICS (SHANGHAI) CO., LTD.
- Zengsheng WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE CAPTURING MODULE AND PORTABLE ELECTRONIC DEVICE
- Publication number 20200185350
- Publication date Jun 11, 2020
- AZUREWAVE TECHNOLOGIES, INC.
- Chuan Jin
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
STACKED SEMICONDUCTOR PACKAGE
- Publication number 20190333907
- Publication date Oct 31, 2019
- Samsung Electronics Co., Ltd.
- Dong-ha LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190273108
- Publication date Sep 5, 2019
- RENESAS ELECTRONICS CORPORATION
- Hidenori SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING DIE BOND PADS AT A DIE EDGE
- Publication number 20180175006
- Publication date Jun 21, 2018
- Sandisk Semiconductor (Shanghai) Co., Ltd.
- Junrong Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR PACKAGE
- Publication number 20180130782
- Publication date May 10, 2018
- Samsung Electronics Co., Ltd.
- Dong-ha LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXPOSED SIDE-WALL AND LGA ASSEMBLY
- Publication number 20170372989
- Publication date Dec 28, 2017
- QUALCOMM Incorporated
- Daeik Daniel Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20170103958
- Publication date Apr 13, 2017
- Samsung Electronics Co., Ltd.
- CHANHO LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20170033085
- Publication date Feb 2, 2017
- Fujitsu Limited
- Takahiro Shikibu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH FIRST AND SECOND CONTACT PADS AND RELATED ME...
- Publication number 20150155215
- Publication date Jun 4, 2015
- STMICROELECTRONICS (SHENZHEN) MANUFACTURING CO. LTD
- Jing-En LUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CO-SUPPORT FOR XFD PACKAGING
- Publication number 20150115472
- Publication date Apr 30, 2015
- Invensas Corporation
- Richard Dewitt Crisp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Segmented Bond Pads and Methods of Fabrication Thereof
- Publication number 20150035171
- Publication date Feb 5, 2015
- INFINEON TECHNOLOGIES AG
- Albert Birner
- H01 - BASIC ELECTRIC ELEMENTS

Mirror array

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor chip having chip pads of different surface areas, and...

Display device

Embedded packaging module and manufacturing method for the same

Stack packages including a supporting substrate

Semiconductor storage device and method of manufacturing the same

Solid-state imaging device including a sensor substrate and a logic...

Stacked semiconductor package

Stacked semiconductor package

Semiconductor device including die bond pads at a die edge

Electronic device with periphery contact pads surrounding central c...

Segmented bond pads and methods of fabrication thereof

Electronic device with first and second contact pads and related me...

Electronic device with first and second contact pads and related me...

Co-support for XFD packaging

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

LAYOUTS OF DATA PADS ON A SEMICONDUCTOR DIE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR MODULE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR CHIP HAVING CHIP PADS OF DIFFERENT SURFACE AREAS, AND...

DISPLAY DEVICE

STACK PACKAGES INCLUDING A SUPPORTING SUBSTRATE

SEMICONDUCTOR STORAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

EMBEDDED PACKAGING MODULE AND MANUFACTURING METHOD FOR THE SAME

IMAGE CAPTURING MODULE AND PORTABLE ELECTRONIC DEVICE

STACKED SEMICONDUCTOR PACKAGE

SOLID-STATE IMAGING DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE INCLUDING DIE BOND PADS AT A DIE EDGE

STACKED SEMICONDUCTOR PACKAGE

EXPOSED SIDE-WALL AND LGA ASSEMBLY

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

ELECTRONIC DEVICE WITH FIRST AND SECOND CONTACT PADS AND RELATED ME...

CO-SUPPORT FOR XFD PACKAGING

Segmented Bond Pads and Methods of Fabrication Thereof