mixed adhesion layer containing metallic/inorganic and polymeric materials

Industry

CPC
H05K2201/2063

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/2063mixed adhesion layer containing metallic/inorganic and polymeric materials

Industries

Patents Grantslast 30 patents

Information Patent Grant
Display device
- Patent number 11,882,649
- Issue date Jan 23, 2024
- Samsung Display Co., Ltd.
- Hee-Kwon Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display device
- Patent number 11,464,105
- Issue date Oct 4, 2022
- Samsung Display Co., Ltd.
- Hee-Kwon Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing anisotropic conductive film using vertical...
- Patent number 11,161,988
- Issue date Nov 2, 2021
- Korea Advanced Institute of Science and Technology
- KyoungWook Paik
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Circuit board and electronic apparatus including the same
- Patent number 9,980,384
- Issue date May 22, 2018
- Kyocera Corporation
- Yoshio Ohashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and method for manufacturing same
- Patent number 9,439,303
- Issue date Sep 6, 2016
- Kuraray Co., Ltd.
- Minoru Onodera
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Dielectric device and method of manufacturing the same
- Patent number 8,468,693
- Issue date Jun 25, 2013
- TDK Corporation
- Tomohiko Katoh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin substrate having a resin-metal composite layer and method for...
- Patent number 7,820,279
- Issue date Oct 26, 2010
- Toyota Jidosha Kabushiki Kaisha
- Motoki Hiraoka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Dielectric device and method of manufacturing the same
- Patent number 7,808,769
- Issue date Oct 5, 2010
- TDK Corporation
- Tomohiko Katoh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer ceramic substrate
- Patent number 7,749,592
- Issue date Jul 6, 2010
- TDK Corpoation
- Tomoko Nakamura
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Metallized polyimide film and manufacturing method therefor
- Patent number 7,241,490
- Issue date Jul 10, 2007
- Mitsubishi Shindoh Co., Ltd.
- Masayuki Aida
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copper foil for printed wiring board
- Patent number 5,712,047
- Issue date Jan 27, 1998
- Nippon Denkai, Ltd.
- Kazuyoshi Aso
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Thin film metallization process for improved metal to substrate adh...
- Patent number 5,631,498
- Issue date May 20, 1997
- International Business Machines Corporation
- Morris Anschel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper clad laminate, multilayer printed circuit board and their pr...
- Patent number 5,569,545
- Issue date Oct 29, 1996
- Nippon Denkai Ltd.
- Hitoshi Yokono
- B32 - LAYERED PRODUCTS
Information Patent Grant
Non-cyanide copper-zinc electroplating bath, method of surface trea...
- Patent number 5,534,128
- Issue date Jul 9, 1996
- Nippon Denkai, Ltd.
- Kazuyoshi Aso
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of manufacturing film carrier type substrate
- Patent number 5,496,772
- Issue date Mar 5, 1996
- Nissin Electric Co., Ltd.
- Akinori Ebe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and a method of manufacturing
- Patent number 5,308,927
- Issue date May 3, 1994
- Sumitomo Electric Industries, Ltd.
- Norihiro Hosoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding of polyimide film
- Patent number 5,217,599
- Issue date Jun 8, 1993
- Industrial Technology Research Institute
- Ker-Ming Chen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for adhering polyimide to a substrate
- Patent number 5,198,264
- Issue date Mar 30, 1993
- Motorola, Inc.
- Leonard F. Altman
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Wiring panel including wiring having a surface-reforming layer and...
- Patent number 5,175,399
- Issue date Dec 29, 1992
- Mitsubishi Denki Kabushiki Kaisha
- Mitsumasa Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced adhesion between metals and polymers
- Patent number 4,720,401
- Issue date Jan 19, 1988
- International Business Machines Corporation
- Paul S. C. Ho
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Printed circuit board having mutually etchable copper and nickel la...
- Patent number 4,311,768
- Issue date Jan 19, 1982
- Gould Inc.
- Betty L. Berdan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of forming a printed circuit
- Patent number 4,260,449
- Issue date Apr 7, 1981
- Gould Inc.
- Betty L. Berdan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of making a printed circuit board having mutually etchable c...
- Patent number 4,190,474
- Issue date Feb 26, 1980
- Gould Inc.
- Betty L. Berdan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper foil having bond strength
- Patent number 4,010,005
- Issue date Mar 1, 1977
- Mitsui-Anaconda Electro Copper Sheet Co., Ltd.
- Shigeyoshi Morisaki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
2925645
- Patent number 2,925,645
- Issue date Feb 23, 1960
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
2762116
- Patent number 2,762,116
- Issue date Sep 11, 1956
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
DISPLAY DEVICE
- Publication number 20230042192
- Publication date Feb 9, 2023
- SAMSUNG DISPLAY CO., LTD.
- Hee-Kwon Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY DEVICE
- Publication number 20210259097
- Publication date Aug 19, 2021
- SAMSUNG DISPLAY CO., LTD.
- Hee-Kwon Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM INCLUDING POLYMER LAYER RESTRICTING MOV...
- Publication number 20180298206
- Publication date Oct 18, 2018
- Korea Advanced Institute of Science and Technology
- KyoungWook Paik
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRETCH RELEASE CONDUCTIVE ADHESIVE
- Publication number 20150218425
- Publication date Aug 6, 2015
- Apple Inc.
- Julian MALINSKI
- B32 - LAYERED PRODUCTS
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME
- Publication number 20150195921
- Publication date Jul 9, 2015
- Kuraray Co., Ltd
- Minoru ONODERA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND ELECTRONIC APPARATUS INCLUDING THE SAME
- Publication number 20150144385
- Publication date May 28, 2015
- KYOCERA CORPORATION
- Yoshio Ohashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUSPENSION BOARD WITH CIRCUIT
- Publication number 20150138739
- Publication date May 21, 2015
- Nitto Denko Corporation
- Tomoaki HISHIKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CURABLE COMPOSITION FOR PRINTED CIRCUIT BOARD, CURED COATING FILM U...
- Publication number 20150090482
- Publication date Apr 2, 2015
- Taiyo Ink MFG. Co., Ltd.
- Masayuki SHIMURA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
MULTILAYER PRINTED CIRCUIT BOARD MANUFACTURE
- Publication number 20120037312
- Publication date Feb 16, 2012
- Christian Sparing
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Metal-Coated Polyimide Resin Substrate with Excellent Thermal Aging...
- Publication number 20110318602
- Publication date Dec 29, 2011
- JX NIPPON MINING & METALS CORPORATION
- Taku Yoshida
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CAPACITOR-FORMING MATERIAL AND PRINTED WIRING BOARD PROVIDED WITH C...
- Publication number 20110005817
- Publication date Jan 13, 2011
- Mitsui Mining and Smelting Co., Ltd.
- Ayumi Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIELECTRIC DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100323097
- Publication date Dec 23, 2010
- TDK Corporation
- Tomohiko Katoh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Polyimide Film with Improved Surface Activity
- Publication number 20080193742
- Publication date Aug 14, 2008
- UBE INDUSTRIES., LTD
- Shuichi Maeda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Multilayer ceramic substrate and production method thereof
- Publication number 20080188366
- Publication date Aug 7, 2008
- TDK Corporation
- Tomoko Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Dielectric device and method of manufacturing the same
- Publication number 20070138128
- Publication date Jun 21, 2007
- TDK Corporation
- Tomohiko Katoh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Resin substrate having a resin-metal composite layer and method for...
- Publication number 20070110973
- Publication date May 17, 2007
- Motoki Hiraoka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Circuit board materials with improved bond to conductive metals and...
- Publication number 20070093035
- Publication date Apr 26, 2007
- Robert C. Daigle
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Polyimide complex sheet
- Publication number 20050221103
- Publication date Oct 6, 2005
- Ube Industries, Ltd.
- Shuichi Maeda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Metallized polyimide film and manufacturing method therefor
- Publication number 20050214551
- Publication date Sep 29, 2005
- Mitsubishi Shindoh Co., Ltd.
- Masayuki Aida
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

mixed adhesion layer containing metallic/inorganic and polymeric materials

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Display device

Display device

Method of manufacturing anisotropic conductive film using vertical...

Circuit board and electronic apparatus including the same

Circuit board and method for manufacturing same

Dielectric device and method of manufacturing the same

Resin substrate having a resin-metal composite layer and method for...

Dielectric device and method of manufacturing the same

Multilayer ceramic substrate

Metallized polyimide film and manufacturing method therefor

Copper foil for printed wiring board

Thin film metallization process for improved metal to substrate adh...

Copper clad laminate, multilayer printed circuit board and their pr...

Non-cyanide copper-zinc electroplating bath, method of surface trea...

Method of manufacturing film carrier type substrate

Wiring board and a method of manufacturing

Bonding of polyimide film

Method for adhering polyimide to a substrate

Wiring panel including wiring having a surface-reforming layer and...

Enhanced adhesion between metals and polymers

Printed circuit board having mutually etchable copper and nickel la...

Method of forming a printed circuit

Method of making a printed circuit board having mutually etchable c...

Copper foil having bond strength

2925645

2762116

Patents Applicationslast 30 patents

DISPLAY DEVICE

DISPLAY DEVICE

ANISOTROPIC CONDUCTIVE FILM INCLUDING POLYMER LAYER RESTRICTING MOV...

STRETCH RELEASE CONDUCTIVE ADHESIVE

CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME

CIRCUIT BOARD AND ELECTRONIC APPARATUS INCLUDING THE SAME

SUSPENSION BOARD WITH CIRCUIT

CURABLE COMPOSITION FOR PRINTED CIRCUIT BOARD, CURED COATING FILM U...

MULTILAYER PRINTED CIRCUIT BOARD MANUFACTURE

Metal-Coated Polyimide Resin Substrate with Excellent Thermal Aging...

CAPACITOR-FORMING MATERIAL AND PRINTED WIRING BOARD PROVIDED WITH C...

DIELECTRIC DEVICE AND METHOD OF MANUFACTURING THE SAME

Polyimide Film with Improved Surface Activity

Multilayer ceramic substrate and production method thereof

Dielectric device and method of manufacturing the same

Resin substrate having a resin-metal composite layer and method for...

Circuit board materials with improved bond to conductive metals and...

Polyimide complex sheet

Metallized polyimide film and manufacturing method therefor