Claims
- 1. A readily etchable printed circuit board comprising a resinous substrate having bonded to at least one surface thereof a composite metal structure including a layer of copper foil having opposed first and second surfaces and a thin layer of nickel having opposed first and second surfaces with one of said surfaces of said copper foil being bonded to and in direct contact with one of said surfaces of said nickel layer and the opposite opposed surface of said nickel layer being bonded to said resinous substrate, said nickel layer containing an effective amount of sulfur to render said copper foil and said nickel barrier layer mutually etchable.
- 2. The printed circuit board of claim 1 wherein said sulfur is present in an amount ranging from about 0.05 to about 10.0 weight percent.
- 3. The printed circuit board of claim 2 wherein said sulfur is present in an amount ranging from about 0.1 to 5.0 weight percent.
Parent Case Info
This is a division of application Ser. No. 863,109, filed Dec. 22, 1977, now U.S. Pat. No. 4,190,474.
US Referenced Citations (8)
Divisions (1)
|
Number |
Date |
Country |
Parent |
863109 |
Dec 1977 |
|