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2925645
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Information
Patent Grant
2925645
References
Source
Patent Number
2,925,645
Date Filed
Not available
Date Issued
Tuesday, February 23, 1960
64 years ago
CPC
C11D10/047 - based on cationic surface-active compounds and soap
C11D9/30 - containing nitrogen
C11D9/32 - containing sulfur
H05K3/045 - by making a conductive layer having a relief pattern, followed by abrading of the raised portions
H05K3/382 - by special treatment of the metal
H05K3/107 - by filling grooves in the support with conductive material
H05K2201/2063 - mixed adhesion layer containing metallic/inorganic and polymeric materials
H05K2203/0108 - Male die used for patterning, punching or transferring
H05K2203/025 - Abrading
Y10T29/4916 - Simultaneous circuit manufacturing
Y10T29/49163 - with sintering of base
Y10T156/1041 - Subsequent to lamination
Y10T156/1064 - Partial cutting [e.g., grooving or incising]
Y10T156/108 - Flash, trim or excess removal
US Classifications
029 - Metal working
156 - Adhesive bonding and miscellaneous chemical manufacture
174 - Electricity: conductors and insulators
228 - Metal fusion bonding
427 - Coating processes
439 - Electrical connectors
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