Mixed frequency adaptations

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H01L2223/6688

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2223/00Details relating to semiconductor or other solid state devices covered by the group H01L23/00

Current Industry

H01L2223/6688Mixed frequency adaptations

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Die to die high-speed communication without discrete amplifiers bet...
- Patent number 12,205,908
- Issue date Jan 21, 2025
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
On-chip diplexed multi-band submillimeter-wave/terahertz sources
- Patent number 12,087,867
- Issue date Sep 10, 2024
- California Institute of Technology
- Jose Vicente Siles Perez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit comprising a substrate equipped with a trap-rich...
- Patent number 11,978,710
- Issue date May 7, 2024
- STMicroelectronics (Crolles 2) SAS
- Didier Dutartre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and method of manufacturing the same
- Patent number 11,888,210
- Issue date Jan 30, 2024
- Advanced Semiconductor Engineering, Inc.
- Jenchun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cavity resonator for enhancing radio-frequency performance and meth...
- Patent number 11,848,291
- Issue date Dec 19, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Jheng-Hong Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit module and communication device
- Patent number 11,817,358
- Issue date Nov 14, 2023
- Murata Manufacturing Co., Ltd.
- Kiyoshi Aikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,804,457
- Issue date Oct 31, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patch on interposer package with wireless communication interface
- Patent number 11,737,154
- Issue date Aug 22, 2023
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna module and manufacturing method thereof
- Patent number 11,394,103
- Issue date Jul 19, 2022
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Doo Il Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switching circuit and high frequency module
- Patent number 11,336,278
- Issue date May 17, 2022
- Murata Manufacturing Co., Ltd.
- Masashi Hayakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple band multiple mode transceiver front end flip-chip archite...
- Patent number 11,309,926
- Issue date Apr 19, 2022
- Skyworks Solutions, Inc.
- Lisette L. Zhang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Radio frequency interconnections for oscillatory neural networks
- Patent number 11,281,961
- Issue date Mar 22, 2022
- Intel Corporation
- Dmitri Nikonov
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Antenna module
- Patent number 11,217,543
- Issue date Jan 4, 2022
- Samsung Electronics Co., Ltd.
- Doo Il Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having porous semiconductor segment for RF...
- Patent number 11,195,920
- Issue date Dec 7, 2021
- Newport Fab, LLC
- Paul D. Hurwitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High frequency waveguide structure
- Patent number 11,195,806
- Issue date Dec 7, 2021
- Intel Corporation
- Vijay K. Nair
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patch on interposer package with wireless communication interface
- Patent number 11,140,723
- Issue date Oct 5, 2021
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and method for fabricating the same
- Patent number 11,114,393
- Issue date Sep 7, 2021
- Siliconware Precision Industries Co., Ltd.
- Wen-Jung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Blade computing system with wireless communication between blades w...
- Patent number 11,109,428
- Issue date Aug 31, 2021
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit comprising a substrate equipped with a trap-rich...
- Patent number 11,075,177
- Issue date Jul 27, 2021
- STMicroelectronics (Crolles 2) SAS
- Didier Dutartre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compensation network for high speed integrated circuits
- Patent number 10,971,458
- Issue date Apr 6, 2021
- CREDO TECHNOLOGY GROUP LIMITED
- Xike Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 10,971,462
- Issue date Apr 6, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical modular stiffeners for stacked multi-device packages
- Patent number 10,903,155
- Issue date Jan 26, 2021
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Guard ring frequency tuning
- Patent number 10,861,793
- Issue date Dec 8, 2020
- QUALCOMM Incorporated
- Haitao Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and method for fabricating the same
- Patent number 10,833,394
- Issue date Nov 10, 2020
- Siliconware Precision Industries Co., Ltd.
- Wen-Jung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High dynamic range receiver integrated into a chip package
- Patent number 10,778,270
- Issue date Sep 15, 2020
- BAE Systems Information and Electronic Systems Integration Inc.
- Douglas S. Jansen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna module
- Patent number 10,763,225
- Issue date Sep 1, 2020
- Samsung Electronics Co., Ltd.
- Doo Il Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of a package structure
- Patent number 10,651,137
- Issue date May 12, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transition frequency multiplier semiconductor device
- Patent number 10,615,158
- Issue date Apr 7, 2020
- Qorvo US, Inc.
- Kevin Wesley Kobayashi
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method for manufacturing a multi-band antenna package structure
- Patent number 10,566,299
- Issue date Feb 18, 2020
- NATIONAL CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY
- Ching-Wen Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolation module for use between power rails in an integrated circuit
- Patent number 10,560,094
- Issue date Feb 11, 2020
- Intel Corporation
- Fern Nee Tan
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
OFFSET VOIDING SCHEME FOR VERTICAL INTERCONNECTS
- Publication number 20240397610
- Publication date Nov 28, 2024
- Intel Corporation
- Aik Hong Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAVITY RESONATOR FOR ENHANCING RADIO-FREQUENCY PERFORMANCE AND METH...
- Publication number 20240395739
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jheng-Hong JIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240387417
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT COMPRISING A SUBSTRATE EQUIPPED WITH A TRAP-RICH...
- Publication number 20240274552
- Publication date Aug 15, 2024
- STMicroelectronics (Crolles 2) SAS
- Didier DUTARTRE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIOFREQUENCY FILTER AND MANUFACTURING METHOD THEREOF
- Publication number 20240186271
- Publication date Jun 6, 2024
- UNITED MICROELECTRONICS CORP.
- Chien-Yi Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240170829
- Publication date May 23, 2024
- Advanced Semiconductor Engineering, Inc.
- Jenchun CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID CHIP CARRIER PACKAGE
- Publication number 20240128170
- Publication date Apr 18, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICE PACKAGE WITH INTEGRAL ANTENNA MODULE AND SEM...
- Publication number 20240038691
- Publication date Feb 1, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Vijaylaxmi Gumaste Khanolkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240014151
- Publication date Jan 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, BASE STATION, MOBILE DEVICE AND METHOD FOR F...
- Publication number 20240006350
- Publication date Jan 4, 2024
- Intel Corporation
- Ellis NEASE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230402409
- Publication date Dec 14, 2023
- Siliconware Precision Industries Co., Ltd.
- Chung-Yu Ke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAVITY RESONATOR FOR ENHANCING RADIO-FREQUENCY PERFORMANCE AND METH...
- Publication number 20230378104
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Jheng-Hong JIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230369258
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiu-Ying Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OUTPUT MATCHING CIRCUIT AND POWER AMPLIFIER MODULE
- Publication number 20230126728
- Publication date Apr 27, 2023
- MURATA MANUFACTURING CO., LTD.
- Kazuhiro TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-FREQUENCEY PACKAGE, HIGH-FREQUENCY MODULE, AND RADIO WAVE ABSO...
- Publication number 20230103894
- Publication date Apr 6, 2023
- NEC Corporation
- Yuki YOSHIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP ENHANCED QUAD FLAT NO-LEAD ELECTRONIC DEVICE WITH CONDUCT...
- Publication number 20230044284
- Publication date Feb 9, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Rajen Manicon Murugan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230037915
- Publication date Feb 9, 2023
- Advanced Semiconductor Engineering, Inc.
- Jenchun CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF SWITCH DEVICE AND METHOD OF MANUFACTURING SAME
- Publication number 20230042805
- Publication date Feb 9, 2023
- DB HiTek Co., Ltd.
- Jin Hyo JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SMALL-SIZE MILLIMETER WAVE ON-CHIP 90-DEGREE 3DB COUPLERS BASED ON...
- Publication number 20230024122
- Publication date Jan 26, 2023
- Mobix Labs, Inc.
- Oleksandr Gorbachov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE TO DIE HIGH-SPEED COMMUNICATION WITHOUT DISCRETE AMPLIFIERS BET...
- Publication number 20220406737
- Publication date Dec 22, 2022
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAVITY RESONATOR FOR ENHANCING RADIO-FREQUENCY PERFORMANCE AND METH...
- Publication number 20220285296
- Publication date Sep 8, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Jheng-Hong JIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATCH ON INTERPOSER PACKAGE WITH WIRELESS COMMUNICATION INTERFACE
- Publication number 20210400740
- Publication date Dec 23, 2021
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT COMPRISING A SUBSTRATE EQUIPPED WITH A TRAP-RICH...
- Publication number 20210327834
- Publication date Oct 21, 2021
- STMicroelectronics (Crolles 2) SAS
- Didier DUTARTRE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20210217715
- Publication date Jul 15, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ON-CHIP DIPLEXED MULTI-BAND SUBMILLIMETER-WAVE/TERAHERTZ SOURCES
- Publication number 20210218368
- Publication date Jul 15, 2021
- California Institute of Technology
- Jose Vicente Siles Perez
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
CIRCUIT MODULE AND COMMUNICATION DEVICE
- Publication number 20210159133
- Publication date May 27, 2021
- MURATA MANUFACTURING CO., LTD.
- Kiyoshi AIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structure Having Porous Semiconductor Segment for RF...
- Publication number 20210111249
- Publication date Apr 15, 2021
- Newport Fab, LLC dba Jazz Semiconductor.
- Paul D. Hurwitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20200328166
- Publication date Oct 15, 2020
- Siliconware Precision Industries Co., Ltd.
- Wen-Jung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20200266160
- Publication date Aug 20, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20200235462
- Publication date Jul 23, 2020
- SILICONWARE PRECISION INDUSTRIES CO., LTD.
- Wen-Jung Tsai
- H01 - BASIC ELECTRIC ELEMENTS

Mixed frequency adaptations

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Die to die high-speed communication without discrete amplifiers bet...

On-chip diplexed multi-band submillimeter-wave/terahertz sources

Integrated circuit comprising a substrate equipped with a trap-rich...

Electronic package and method of manufacturing the same

Cavity resonator for enhancing radio-frequency performance and meth...

Circuit module and communication device

Package structure and manufacturing method thereof

Patch on interposer package with wireless communication interface

Antenna module and manufacturing method thereof

Switching circuit and high frequency module

Multiple band multiple mode transceiver front end flip-chip archite...

Radio frequency interconnections for oscillatory neural networks

Antenna module

Semiconductor structure having porous semiconductor segment for RF...

High frequency waveguide structure

Patch on interposer package with wireless communication interface

Electronic package and method for fabricating the same

Blade computing system with wireless communication between blades w...

Integrated circuit comprising a substrate equipped with a trap-rich...

Compensation network for high speed integrated circuits

Package structure and manufacturing method thereof

Vertical modular stiffeners for stacked multi-device packages

Guard ring frequency tuning

Electronic package and method for fabricating the same

High dynamic range receiver integrated into a chip package

Antenna module

Manufacturing method of a package structure

Transition frequency multiplier semiconductor device

Method for manufacturing a multi-band antenna package structure

Isolation module for use between power rails in an integrated circuit

Patents Applicationslast 30 patents

OFFSET VOIDING SCHEME FOR VERTICAL INTERCONNECTS

CAVITY RESONATOR FOR ENHANCING RADIO-FREQUENCY PERFORMANCE AND METH...

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

INTEGRATED CIRCUIT COMPRISING A SUBSTRATE EQUIPPED WITH A TRAP-RICH...

RADIOFREQUENCY FILTER AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE AND METHOD OF MANUFACTURING THE SAME

HYBRID CHIP CARRIER PACKAGE

MICROELECTRONIC DEVICE PACKAGE WITH INTEGRAL ANTENNA MODULE AND SEM...

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE, BASE STATION, MOBILE DEVICE AND METHOD FOR F...

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

CAVITY RESONATOR FOR ENHANCING RADIO-FREQUENCY PERFORMANCE AND METH...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

OUTPUT MATCHING CIRCUIT AND POWER AMPLIFIER MODULE

HIGH-FREQUENCEY PACKAGE, HIGH-FREQUENCY MODULE, AND RADIO WAVE ABSO...

FLIP-CHIP ENHANCED QUAD FLAT NO-LEAD ELECTRONIC DEVICE WITH CONDUCT...

ELECTRONIC PACKAGE AND METHOD OF MANUFACTURING THE SAME

RF SWITCH DEVICE AND METHOD OF MANUFACTURING SAME

SMALL-SIZE MILLIMETER WAVE ON-CHIP 90-DEGREE 3DB COUPLERS BASED ON...

DIE TO DIE HIGH-SPEED COMMUNICATION WITHOUT DISCRETE AMPLIFIERS BET...

CAVITY RESONATOR FOR ENHANCING RADIO-FREQUENCY PERFORMANCE AND METH...

PATCH ON INTERPOSER PACKAGE WITH WIRELESS COMMUNICATION INTERFACE

INTEGRATED CIRCUIT COMPRISING A SUBSTRATE EQUIPPED WITH A TRAP-RICH...

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

ON-CHIP DIPLEXED MULTI-BAND SUBMILLIMETER-WAVE/TERAHERTZ SOURCES

CIRCUIT MODULE AND COMMUNICATION DEVICE

Semiconductor Structure Having Porous Semiconductor Segment for RF...

ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME